TY  - JOUR
AU  - Vuksanović, Marija M.
AU  - Mladenović, Ivana O.
AU  - Stupar, Stevan
AU  - Marinković, Aleksandar
AU  - Jančić Heinemann, Radmila
PY  - 2024
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/7148
AB  - Polymer composites based on unsaturated polyester resin (UPR) and reinforced with particles based on unmodified/modifiedplant provenance biosilica particles were synthesized and characterized. An unsaturated polyester resin was obtained fromwaste poly (ethylene terephthalate (PET). Biosilaca particles are made from rice husk biomass. The surface of the producedsilica particles was modified using three different silanes: 3-trimethoxysilylpropyl methacrylate (MEMO), trimethoxyvinylsilane (TMEVS), and 3-aminopropyltrimethoxysilane (APTMS). The microhardness test method was used to investigatethe mechanical properties of synthesized composite material with variations in dwell times and applied loads. Optimization ofcomposite microhardness value prediction in function of synthesized parameters (type of modification of silica particles) andmeasurement parameters (applied loads and dwell times) was done using the method of response surface methodology (RSM)regression analysis. The maximal microhardness values (0.459 GPa) were obtained of type modification of silica particles withvinyl with 80% confidence for 120 experimental variables. This method can be used to choose the optimal dwell time and loadfor comparison of measurements between different composite materials and to enable the choice of the material in terms ofoptimization of the quality of reinforcement and quality of interphase determined by surface modification.
PB  - SAGE Publications Ltd.
T2  - Polymers and Polymer Composites
T1  - Microhardness measurement optimization in green derived silica/polyester composites using response surface methodology
VL  - 32
DO  - 10.1177/09673911241228092
ER  - 

@article{
author = "Vuksanović, Marija M. and Mladenović, Ivana O. and Stupar, Stevan and Marinković, Aleksandar and Jančić Heinemann, Radmila",
year = "2024",
abstract = "Polymer composites based on unsaturated polyester resin (UPR) and reinforced with particles based on unmodified/modifiedplant provenance biosilica particles were synthesized and characterized. An unsaturated polyester resin was obtained fromwaste poly (ethylene terephthalate (PET). Biosilaca particles are made from rice husk biomass. The surface of the producedsilica particles was modified using three different silanes: 3-trimethoxysilylpropyl methacrylate (MEMO), trimethoxyvinylsilane (TMEVS), and 3-aminopropyltrimethoxysilane (APTMS). The microhardness test method was used to investigatethe mechanical properties of synthesized composite material with variations in dwell times and applied loads. Optimization ofcomposite microhardness value prediction in function of synthesized parameters (type of modification of silica particles) andmeasurement parameters (applied loads and dwell times) was done using the method of response surface methodology (RSM)regression analysis. The maximal microhardness values (0.459 GPa) were obtained of type modification of silica particles withvinyl with 80% confidence for 120 experimental variables. This method can be used to choose the optimal dwell time and loadfor comparison of measurements between different composite materials and to enable the choice of the material in terms ofoptimization of the quality of reinforcement and quality of interphase determined by surface modification.",
publisher = "SAGE Publications Ltd.",
journal = "Polymers and Polymer Composites",
title = "Microhardness measurement optimization in green derived silica/polyester composites using response surface methodology",
volume = "32",
doi = "10.1177/09673911241228092"
}

Vuksanović, M. M., Mladenović, I. O., Stupar, S., Marinković, A.,& Jančić Heinemann, R.. (2024). Microhardness measurement optimization in green derived silica/polyester composites using response surface methodology. in Polymers and Polymer Composites
SAGE Publications Ltd.., 32.
https://doi.org/10.1177/09673911241228092

Vuksanović MM, Mladenović IO, Stupar S, Marinković A, Jančić Heinemann R. Microhardness measurement optimization in green derived silica/polyester composites using response surface methodology. in Polymers and Polymer Composites. 2024;32.
doi:10.1177/09673911241228092 .

Vuksanović, Marija M., Mladenović, Ivana O., Stupar, Stevan, Marinković, Aleksandar, Jančić Heinemann, Radmila, "Microhardness measurement optimization in green derived silica/polyester composites using response surface methodology" in Polymers and Polymer Composites, 32 (2024),
https://doi.org/10.1177/09673911241228092 . .

TY  - CONF
AU  - Mladenović, Ivana
AU  - Đorović-Amanović, Jovana
AU  - Nikolić, Nebojša
AU  - Vasiljević-Radović, Dana
AU  - Radojević, Vesna
AU  - Lamovec, Jelena
PY  - 2020
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/4410
AB  - Fine-grained nickel coatings were electrodeposited by direct current (dc) regime onto different substrates: polycrystalline cold-rolled copper, polycrystalline brass and single crystal (100)-oriented silicon. These composite structures belong to different type of laminated composite systems. The influence of the substrate material and coating plating parameters on microstructural and mechanical properties, such as hardness and adhesion, was characterized by the Vickers microindentation test for different loads. Above critical indentation depth (usually around 10% of the coating thickness), the measured hardness is the so-called “composite hardness”, because the substrate participates in the plastic deformations during indentation. Three composite hardness models (Korsunsky, Chicot-Lesage and Chen-Gao), constructed on different principles, were chosen for fitting the experimental results in order to determine the coating hardness and the critical reduced depth as the adhesion parameter. The coating hardness is mainly influenced by the current density, because increase in current density leads to decrease in grain size and increase in coating hardness. The critical reduced depth as the parameter of adhesion depends on the substrate material.
PB  - Belgrade : Academy of Criminalistic and Police Studies
C3  - Thematic conference proceedings of international significance - International Scientific Conference
T1  - Analysis and interpretation of the micromechanical properties measurements of electrodeposited nickel coatings on different substrates.
EP  - 665
IS  - 1
SP  - 655
VL  - 0
UR  - https://hdl.handle.net/21.15107/rcub_technorep_4410
ER  - 

@conference{
author = "Mladenović, Ivana and Đorović-Amanović, Jovana and Nikolić, Nebojša and Vasiljević-Radović, Dana and Radojević, Vesna and Lamovec, Jelena",
year = "2020",
abstract = "Fine-grained nickel coatings were electrodeposited by direct current (dc) regime onto different substrates: polycrystalline cold-rolled copper, polycrystalline brass and single crystal (100)-oriented silicon. These composite structures belong to different type of laminated composite systems. The influence of the substrate material and coating plating parameters on microstructural and mechanical properties, such as hardness and adhesion, was characterized by the Vickers microindentation test for different loads. Above critical indentation depth (usually around 10% of the coating thickness), the measured hardness is the so-called “composite hardness”, because the substrate participates in the plastic deformations during indentation. Three composite hardness models (Korsunsky, Chicot-Lesage and Chen-Gao), constructed on different principles, were chosen for fitting the experimental results in order to determine the coating hardness and the critical reduced depth as the adhesion parameter. The coating hardness is mainly influenced by the current density, because increase in current density leads to decrease in grain size and increase in coating hardness. The critical reduced depth as the parameter of adhesion depends on the substrate material.",
publisher = "Belgrade : Academy of Criminalistic and Police Studies",
journal = "Thematic conference proceedings of international significance - International Scientific Conference",
title = "Analysis and interpretation of the micromechanical properties measurements of electrodeposited nickel coatings on different substrates.",
pages = "665-655",
number = "1",
volume = "0",
url = "https://hdl.handle.net/21.15107/rcub_technorep_4410"
}

Mladenović, I., Đorović-Amanović, J., Nikolić, N., Vasiljević-Radović, D., Radojević, V.,& Lamovec, J.. (2020). Analysis and interpretation of the micromechanical properties measurements of electrodeposited nickel coatings on different substrates.. in Thematic conference proceedings of international significance - International Scientific Conference
Belgrade : Academy of Criminalistic and Police Studies., 0(1), 655-665.
https://hdl.handle.net/21.15107/rcub_technorep_4410

Mladenović I, Đorović-Amanović J, Nikolić N, Vasiljević-Radović D, Radojević V, Lamovec J. Analysis and interpretation of the micromechanical properties measurements of electrodeposited nickel coatings on different substrates.. in Thematic conference proceedings of international significance - International Scientific Conference. 2020;0(1):655-665.
https://hdl.handle.net/21.15107/rcub_technorep_4410 .

Mladenović, Ivana, Đorović-Amanović, Jovana, Nikolić, Nebojša, Vasiljević-Radović, Dana, Radojević, Vesna, Lamovec, Jelena, "Analysis and interpretation of the micromechanical properties measurements of electrodeposited nickel coatings on different substrates." in Thematic conference proceedings of international significance - International Scientific Conference, 0, no. 1 (2020):655-665,
https://hdl.handle.net/21.15107/rcub_technorep_4410 .

TY  - CONF
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Nikolić, Nebojša
AU  - Andrić, Stevan
AU  - Obradov, Marko
AU  - Radojević, Vesna
AU  - Vasiljević-Radović, Dana
PY  - 2020
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/4420
AB  - Copper coatings are produced on silicon wafer by electrodeposition (ED) in pulsating current (PC) regime. Electrodeposition was performed at various current density amplitudes in the range of 80−140 mA cm-2, frequency in the range of 30−100 Hz and coating thickness in the range of 10−60 μm. The resulting composite systems consist of monolayered copper films electrodeposited from sulfate bath on Si wafers with sputtered layers of Cr/Au. Roughness measurements were performed to evaluate properties of the copper coating surface. The coating roughness (R) was measured using Atomic Force Microscope in contact mode. The software Gwyddion was used for determination an average roughness parameter (Ra). After that (Artificial Neural Network-ANN) model was used to study the relationship between the parameters of electrodeposition process and roughness of copper coatings. The influence of experimental values: amplitude current density, frequency and thickness of coating on the surface roughness will be highlighted. Response surface methodology (RSM) was utilized to improve the correction between Ra and input parameters. Finally, the results of the average roughness (experimental and predicted) were used to estimate the new value of (Ra) of copper for each variation of the input parameters and compared capability of ANN and regression analysis for surface roughness generated under different electrochemical conditions. The coefficient of determination was found 92% for ANN and 93% for regression analysis.
PB  - Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear angineering
C3  - Proceedings - 7th International Conference on Electrical, Electronic and Computing Engineering IcETR
T1  - Response Surface Methodology and Artificial Neural Network-Based Models for Predicting Roughness of Cu coatings
UR  - https://hdl.handle.net/21.15107/rcub_technorep_4420
ER  - 

@conference{
author = "Mladenović, Ivana and Lamovec, Jelena and Nikolić, Nebojša and Andrić, Stevan and Obradov, Marko and Radojević, Vesna and Vasiljević-Radović, Dana",
year = "2020",
abstract = "Copper coatings are produced on silicon wafer by electrodeposition (ED) in pulsating current (PC) regime. Electrodeposition was performed at various current density amplitudes in the range of 80−140 mA cm-2, frequency in the range of 30−100 Hz and coating thickness in the range of 10−60 μm. The resulting composite systems consist of monolayered copper films electrodeposited from sulfate bath on Si wafers with sputtered layers of Cr/Au. Roughness measurements were performed to evaluate properties of the copper coating surface. The coating roughness (R) was measured using Atomic Force Microscope in contact mode. The software Gwyddion was used for determination an average roughness parameter (Ra). After that (Artificial Neural Network-ANN) model was used to study the relationship between the parameters of electrodeposition process and roughness of copper coatings. The influence of experimental values: amplitude current density, frequency and thickness of coating on the surface roughness will be highlighted. Response surface methodology (RSM) was utilized to improve the correction between Ra and input parameters. Finally, the results of the average roughness (experimental and predicted) were used to estimate the new value of (Ra) of copper for each variation of the input parameters and compared capability of ANN and regression analysis for surface roughness generated under different electrochemical conditions. The coefficient of determination was found 92% for ANN and 93% for regression analysis.",
publisher = "Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear angineering",
journal = "Proceedings - 7th International Conference on Electrical, Electronic and Computing Engineering IcETR",
title = "Response Surface Methodology and Artificial Neural Network-Based Models for Predicting Roughness of Cu coatings",
url = "https://hdl.handle.net/21.15107/rcub_technorep_4420"
}

Mladenović, I., Lamovec, J., Nikolić, N., Andrić, S., Obradov, M., Radojević, V.,& Vasiljević-Radović, D.. (2020). Response Surface Methodology and Artificial Neural Network-Based Models for Predicting Roughness of Cu coatings. in Proceedings - 7th International Conference on Electrical, Electronic and Computing Engineering IcETR
Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear angineering..
https://hdl.handle.net/21.15107/rcub_technorep_4420

Mladenović I, Lamovec J, Nikolić N, Andrić S, Obradov M, Radojević V, Vasiljević-Radović D. Response Surface Methodology and Artificial Neural Network-Based Models for Predicting Roughness of Cu coatings. in Proceedings - 7th International Conference on Electrical, Electronic and Computing Engineering IcETR. 2020;.
https://hdl.handle.net/21.15107/rcub_technorep_4420 .

Mladenović, Ivana, Lamovec, Jelena, Nikolić, Nebojša, Andrić, Stevan, Obradov, Marko, Radojević, Vesna, Vasiljević-Radović, Dana, "Response Surface Methodology and Artificial Neural Network-Based Models for Predicting Roughness of Cu coatings" in Proceedings - 7th International Conference on Electrical, Electronic and Computing Engineering IcETR (2020),
https://hdl.handle.net/21.15107/rcub_technorep_4420 .

TY  - JOUR
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Vasiljević-Radović, Dana
AU  - Vasilić, Rastko
AU  - Radojević, Vesna
AU  - Nikolić, Nebojša
PY  - 2020
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/4539
AB  - Copper electrodeposition on (111)-oriented Si substrate was performed by the pulsating current (PC) regime at various average current densities in the range of 15-70 mAcm(-2), obtained by varying either the frequency (30, 50, 80 and 100 Hz for the current density amplitude of 100 mAcm(-2)) or the current density amplitude (120 and 140 mAcm(-2) at 100 Hz). The produced Cu coatings were examined by SEM, AFM and XRD techniques. The morphology of the coatings changed from those with large grains to fine-grained and globular, while the crystal structure changed from the strong (220) to the strong (111) preferred orientation by increasing the average current density. The mechanical characteristics of coatings were examined using Vickers micro-indentation tests, applying the Chicot-Lesage (C-L) composite hardness model for the analysis of microhardness. The maximum microhardness was obtained for the Cu coating produced at an average current density of 50 mAcm(-2), with a current density amplitude of 100 mAcm(-2) and a frequency of 100 Hz. This copper coating was fine-grained and showed the smallest roughness in relation to the other coatings, and it was obtained in the mixed activation-diffusion control between the end of the effect of the activation control and the beginning of the dominant effect of diffusion control.
PB  - MDPI, Basel
T2  - Metals
T1  - Morphology, Structure and Mechanical Properties of Copper Coatings Electrodeposited by Pulsating Current (PC) Regime on Si(111)
IS  - 4
VL  - 10
DO  - 10.3390/met10040488
ER  - 

@article{
author = "Mladenović, Ivana and Lamovec, Jelena and Vasiljević-Radović, Dana and Vasilić, Rastko and Radojević, Vesna and Nikolić, Nebojša",
year = "2020",
abstract = "Copper electrodeposition on (111)-oriented Si substrate was performed by the pulsating current (PC) regime at various average current densities in the range of 15-70 mAcm(-2), obtained by varying either the frequency (30, 50, 80 and 100 Hz for the current density amplitude of 100 mAcm(-2)) or the current density amplitude (120 and 140 mAcm(-2) at 100 Hz). The produced Cu coatings were examined by SEM, AFM and XRD techniques. The morphology of the coatings changed from those with large grains to fine-grained and globular, while the crystal structure changed from the strong (220) to the strong (111) preferred orientation by increasing the average current density. The mechanical characteristics of coatings were examined using Vickers micro-indentation tests, applying the Chicot-Lesage (C-L) composite hardness model for the analysis of microhardness. The maximum microhardness was obtained for the Cu coating produced at an average current density of 50 mAcm(-2), with a current density amplitude of 100 mAcm(-2) and a frequency of 100 Hz. This copper coating was fine-grained and showed the smallest roughness in relation to the other coatings, and it was obtained in the mixed activation-diffusion control between the end of the effect of the activation control and the beginning of the dominant effect of diffusion control.",
publisher = "MDPI, Basel",
journal = "Metals",
title = "Morphology, Structure and Mechanical Properties of Copper Coatings Electrodeposited by Pulsating Current (PC) Regime on Si(111)",
number = "4",
volume = "10",
doi = "10.3390/met10040488"
}

Mladenović, I., Lamovec, J., Vasiljević-Radović, D., Vasilić, R., Radojević, V.,& Nikolić, N.. (2020). Morphology, Structure and Mechanical Properties of Copper Coatings Electrodeposited by Pulsating Current (PC) Regime on Si(111). in Metals
MDPI, Basel., 10(4).
https://doi.org/10.3390/met10040488

Mladenović I, Lamovec J, Vasiljević-Radović D, Vasilić R, Radojević V, Nikolić N. Morphology, Structure and Mechanical Properties of Copper Coatings Electrodeposited by Pulsating Current (PC) Regime on Si(111). in Metals. 2020;10(4).
doi:10.3390/met10040488 .

Mladenović, Ivana, Lamovec, Jelena, Vasiljević-Radović, Dana, Vasilić, Rastko, Radojević, Vesna, Nikolić, Nebojša, "Morphology, Structure and Mechanical Properties of Copper Coatings Electrodeposited by Pulsating Current (PC) Regime on Si(111)" in Metals, 10, no. 4 (2020),
https://doi.org/10.3390/met10040488 . .

TY  - JOUR
AU  - Vuksanović, Marija M.
AU  - Tomić, Nataša
AU  - Mladenović, Ivana
AU  - Perić, Tamara
AU  - Gligorijević, Bojan
AU  - Jančić-Heinemann, Radmila
PY  - 2020
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/4559
AB  - Composite materials based on acrylate UV-cured polymers (Bis-GMA/TEGDMA) as a matrix and reinforcements that can be selected in order to adjust the properties of the obtained composite are used in the field of dental technology. The role of reinforcement is to adjust the mechanical properties, but also to control the shrinkage during curing. As reinforcement, alumina particles doped with iron oxide (Al2O3 Fe) synthesized using the sol-gel technique were selected. In order to simulate the process of adhesive application in real conditions, in vitro testing technique and adhesion properties of synthesized adhesive were used, where tooth tissue was used as a substrate. Comparison with standard adhesives used in dentistry was used to compare adhesion. The quality of the adhesive joint was evaluated using the microhardness testing method using different loads where it is estimated how the adhesive makes a connection with the substrate. It was shown that the synthesized adhesive showed significantly enhanced adhesion compared to the standard adhesive used in dentistry (836%).
AB  - Kompozitni materijali na bazi akrilatnih fotopolimerizujućih polimera, (Bis-GMA/TEGDMA) koji predstavljaju matricu i ojačanja koja se mogu odabrati sa ciljem podešavanja svojstava dobijenih kompozita, koriste se u oblasti dentalne tehnologije. Uloga ojačanja je podešavanje mehaničkih svojstava, ali i kontrola skupljanja tokom očvršćavanja. Kao ojačanje odabrane su čestice aluminijum-oksida dopirane gvožđe oksidom (Al2O3 Fe), sintetisane korišćenjem sol-gel tehnike. U cilju simuliranja procesa primene adheziva u realnim uslovima korišćena je in vitro tehnika ispitivanja adhezije sintetisanog adheziva pri čemu je kao substrat korišćeno tkivo zuba. Dobijene vrednosti adhezije poređene su sa komercijalnim adhezivima koji se koriste u stomatologiji. Kvalitet adhezivnog spoja ocenjen je merenjem mikrotvrdoće primenom različitih opterećenja, pri čemu je procenjen način kako se ostvaruje spoj između filma i podloge. Pokazalo se da je sintetisani adheziv imao višestruko jaču adheziju u poređenju sa standardnim adhezivom korišćenim u stomatologiji (836 %).
PB  - Savez inženjera i tehničara Srbije, Beograd
T2  - Tehnika
T1  - Enhanced adhesion of acrylic adhesives with dental tissue with the addition of aluminum oxide based particles
T1  - Poboljšana adhezija akrilnih adheziva sa zubnim tkivom uz dodatak čestica na bazi aluminijum oksida
EP  - 433
IS  - 4
SP  - 429
VL  - 75
DO  - 10.5937/tehnika2004429V
ER  - 

@article{
author = "Vuksanović, Marija M. and Tomić, Nataša and Mladenović, Ivana and Perić, Tamara and Gligorijević, Bojan and Jančić-Heinemann, Radmila",
year = "2020",
abstract = "Composite materials based on acrylate UV-cured polymers (Bis-GMA/TEGDMA) as a matrix and reinforcements that can be selected in order to adjust the properties of the obtained composite are used in the field of dental technology. The role of reinforcement is to adjust the mechanical properties, but also to control the shrinkage during curing. As reinforcement, alumina particles doped with iron oxide (Al2O3 Fe) synthesized using the sol-gel technique were selected. In order to simulate the process of adhesive application in real conditions, in vitro testing technique and adhesion properties of synthesized adhesive were used, where tooth tissue was used as a substrate. Comparison with standard adhesives used in dentistry was used to compare adhesion. The quality of the adhesive joint was evaluated using the microhardness testing method using different loads where it is estimated how the adhesive makes a connection with the substrate. It was shown that the synthesized adhesive showed significantly enhanced adhesion compared to the standard adhesive used in dentistry (836%)., Kompozitni materijali na bazi akrilatnih fotopolimerizujućih polimera, (Bis-GMA/TEGDMA) koji predstavljaju matricu i ojačanja koja se mogu odabrati sa ciljem podešavanja svojstava dobijenih kompozita, koriste se u oblasti dentalne tehnologije. Uloga ojačanja je podešavanje mehaničkih svojstava, ali i kontrola skupljanja tokom očvršćavanja. Kao ojačanje odabrane su čestice aluminijum-oksida dopirane gvožđe oksidom (Al2O3 Fe), sintetisane korišćenjem sol-gel tehnike. U cilju simuliranja procesa primene adheziva u realnim uslovima korišćena je in vitro tehnika ispitivanja adhezije sintetisanog adheziva pri čemu je kao substrat korišćeno tkivo zuba. Dobijene vrednosti adhezije poređene su sa komercijalnim adhezivima koji se koriste u stomatologiji. Kvalitet adhezivnog spoja ocenjen je merenjem mikrotvrdoće primenom različitih opterećenja, pri čemu je procenjen način kako se ostvaruje spoj između filma i podloge. Pokazalo se da je sintetisani adheziv imao višestruko jaču adheziju u poređenju sa standardnim adhezivom korišćenim u stomatologiji (836 %).",
publisher = "Savez inženjera i tehničara Srbije, Beograd",
journal = "Tehnika",
title = "Enhanced adhesion of acrylic adhesives with dental tissue with the addition of aluminum oxide based particles, Poboljšana adhezija akrilnih adheziva sa zubnim tkivom uz dodatak čestica na bazi aluminijum oksida",
pages = "433-429",
number = "4",
volume = "75",
doi = "10.5937/tehnika2004429V"
}

Vuksanović, M. M., Tomić, N., Mladenović, I., Perić, T., Gligorijević, B.,& Jančić-Heinemann, R.. (2020). Enhanced adhesion of acrylic adhesives with dental tissue with the addition of aluminum oxide based particles. in Tehnika
Savez inženjera i tehničara Srbije, Beograd., 75(4), 429-433.
https://doi.org/10.5937/tehnika2004429V

Vuksanović MM, Tomić N, Mladenović I, Perić T, Gligorijević B, Jančić-Heinemann R. Enhanced adhesion of acrylic adhesives with dental tissue with the addition of aluminum oxide based particles. in Tehnika. 2020;75(4):429-433.
doi:10.5937/tehnika2004429V .

Vuksanović, Marija M., Tomić, Nataša, Mladenović, Ivana, Perić, Tamara, Gligorijević, Bojan, Jančić-Heinemann, Radmila, "Enhanced adhesion of acrylic adhesives with dental tissue with the addition of aluminum oxide based particles" in Tehnika, 75, no. 4 (2020):429-433,
https://doi.org/10.5937/tehnika2004429V . .

TY  - JOUR
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Vasiljević-Radović, Dana
AU  - Radojević, Vesna
AU  - Nikolić, Nebojša
PY  - 2020
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/4405
AB  - Mechanical features of the Cu coatings produced by the pulsating current (PC) regime on Si(111) substrate have been investigated. The Cu coatings were electrodeposited by varying duty cycle (15-50 %) and keeping the current density amplitude constant (100 mA cm(-2)), and by keeping duty cycle constant (50 %) but varying the current density amplitude value (80-120 mA cm(-2)). The scanning electron microscopy (SEM) and optical microscopy (OM) techniques showed that morphology of the coatings changed with increasing the duty cycle from those with large and well defined grains to uniform and compact fine-grained coatings. The Vickers microindentation technique was used for an examination of hardness applying the Chen-Gao (C-G) composite hardness model and indentation creep features of the Cu coatings. The obtained values of hardness for the Cu coatings on Si(111) in the 0.9069-1.5079 GPa range indicated the successful implementation of the C-G model for this "soft film on hard substrate" composite system. The obtained stress exponents ranging from 2.79 to 5.29 indicated that creep mechanism changed from grain boundary sliding to both dislocation climbs and dislocation creep with decreasing duty cycle values. The maximum hardness and minimum stress exponent was obtained for the fine-grained Cu coating produced with a duty cycle of 50 % and the current density amplitude of 100 mA cm(-2), indicating that its plastic deformation during microindentation was primarily caused by grain boundary sliding. Optimization of process formation and mechanical features of the Cu coatings was made using Response Surface Methodology (RSM), and error of 3.2 % showed a good agreement between predicted and measured values.
PB  - Electrochemical Science Group, Beograd
T2  - International Journal of Electrochemical Science
T1  - Mechanical features of copper coatings electrodeposited by the pulsating current (PC) regime on Si(111) substrate
EP  - 12191
IS  - 11
SP  - 12173
VL  - 15
DO  - 10.20964/2020.12.01
ER  - 

@article{
author = "Mladenović, Ivana and Lamovec, Jelena and Vasiljević-Radović, Dana and Radojević, Vesna and Nikolić, Nebojša",
year = "2020",
abstract = "Mechanical features of the Cu coatings produced by the pulsating current (PC) regime on Si(111) substrate have been investigated. The Cu coatings were electrodeposited by varying duty cycle (15-50 %) and keeping the current density amplitude constant (100 mA cm(-2)), and by keeping duty cycle constant (50 %) but varying the current density amplitude value (80-120 mA cm(-2)). The scanning electron microscopy (SEM) and optical microscopy (OM) techniques showed that morphology of the coatings changed with increasing the duty cycle from those with large and well defined grains to uniform and compact fine-grained coatings. The Vickers microindentation technique was used for an examination of hardness applying the Chen-Gao (C-G) composite hardness model and indentation creep features of the Cu coatings. The obtained values of hardness for the Cu coatings on Si(111) in the 0.9069-1.5079 GPa range indicated the successful implementation of the C-G model for this "soft film on hard substrate" composite system. The obtained stress exponents ranging from 2.79 to 5.29 indicated that creep mechanism changed from grain boundary sliding to both dislocation climbs and dislocation creep with decreasing duty cycle values. The maximum hardness and minimum stress exponent was obtained for the fine-grained Cu coating produced with a duty cycle of 50 % and the current density amplitude of 100 mA cm(-2), indicating that its plastic deformation during microindentation was primarily caused by grain boundary sliding. Optimization of process formation and mechanical features of the Cu coatings was made using Response Surface Methodology (RSM), and error of 3.2 % showed a good agreement between predicted and measured values.",
publisher = "Electrochemical Science Group, Beograd",
journal = "International Journal of Electrochemical Science",
title = "Mechanical features of copper coatings electrodeposited by the pulsating current (PC) regime on Si(111) substrate",
pages = "12191-12173",
number = "11",
volume = "15",
doi = "10.20964/2020.12.01"
}

Mladenović, I., Lamovec, J., Vasiljević-Radović, D., Radojević, V.,& Nikolić, N.. (2020). Mechanical features of copper coatings electrodeposited by the pulsating current (PC) regime on Si(111) substrate. in International Journal of Electrochemical Science
Electrochemical Science Group, Beograd., 15(11), 12173-12191.
https://doi.org/10.20964/2020.12.01

Mladenović I, Lamovec J, Vasiljević-Radović D, Radojević V, Nikolić N. Mechanical features of copper coatings electrodeposited by the pulsating current (PC) regime on Si(111) substrate. in International Journal of Electrochemical Science. 2020;15(11):12173-12191.
doi:10.20964/2020.12.01 .

Mladenović, Ivana, Lamovec, Jelena, Vasiljević-Radović, Dana, Radojević, Vesna, Nikolić, Nebojša, "Mechanical features of copper coatings electrodeposited by the pulsating current (PC) regime on Si(111) substrate" in International Journal of Electrochemical Science, 15, no. 11 (2020):12173-12191,
https://doi.org/10.20964/2020.12.01 . .

TY  - CONF
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Obradov, M.
AU  - Radulović, Katarina
AU  - Vasiljević-Radović, Dana
AU  - Radojević, Vesna
PY  - 2019
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/4228
AB  - Copper coatings are produced on silicon wafer by electrodeposition (ED) for various cathode current densities. The resulting composite systems consist of 10 mu m monolavered copper films electrodeposited from sulphate bath on Si wafers with sputtered layers of Cr/Au. Hardness measurements were performed to evaluate properties of the composites. The composite hardness (H-c) was characterized using Vickers microindentation test. Then, an artificial neural network (ANN) model was used to study the relationship between the parameters of metallic composite and their hardness. Two experimental values: applied load during indentation test and current density during the ED process were used as the inputs to the neural network. Finally, the results of the composite hardness (experimental and predicted) were used to estimate the film hardness (H-f) of copper for each variations of the current density. This article shows that ANN is an useful tool in modeling composite hardness change with variation of experimental parameters predicting hardness change of composite Si/Cu with average error of 6 %. Using created ANN model it is possible to predict microhardness of Cu film for current density or indentation load for which we do not have experimental data.
PB  - IEEE, Electron Devices Soc & Reliability Group, New York
C3  - 2019 IEEE 31st International Conference on Microelectronics (MIEL 2019)
T1  - Artificial Neural Network for Composite Hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters
EP  - 136
SP  - 133
UR  - https://hdl.handle.net/21.15107/rcub_technorep_4228
ER  - 

@conference{
author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Obradov, M. and Radulović, Katarina and Vasiljević-Radović, Dana and Radojević, Vesna",
year = "2019",
abstract = "Copper coatings are produced on silicon wafer by electrodeposition (ED) for various cathode current densities. The resulting composite systems consist of 10 mu m monolavered copper films electrodeposited from sulphate bath on Si wafers with sputtered layers of Cr/Au. Hardness measurements were performed to evaluate properties of the composites. The composite hardness (H-c) was characterized using Vickers microindentation test. Then, an artificial neural network (ANN) model was used to study the relationship between the parameters of metallic composite and their hardness. Two experimental values: applied load during indentation test and current density during the ED process were used as the inputs to the neural network. Finally, the results of the composite hardness (experimental and predicted) were used to estimate the film hardness (H-f) of copper for each variations of the current density. This article shows that ANN is an useful tool in modeling composite hardness change with variation of experimental parameters predicting hardness change of composite Si/Cu with average error of 6 %. Using created ANN model it is possible to predict microhardness of Cu film for current density or indentation load for which we do not have experimental data.",
publisher = "IEEE, Electron Devices Soc & Reliability Group, New York",
journal = "2019 IEEE 31st International Conference on Microelectronics (MIEL 2019)",
title = "Artificial Neural Network for Composite Hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters",
pages = "136-133",
url = "https://hdl.handle.net/21.15107/rcub_technorep_4228"
}

Mladenović, I., Lamovec, J., Jović, V., Obradov, M., Radulović, K., Vasiljević-Radović, D.,& Radojević, V.. (2019). Artificial Neural Network for Composite Hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters. in 2019 IEEE 31st International Conference on Microelectronics (MIEL 2019)
IEEE, Electron Devices Soc & Reliability Group, New York., 133-136.
https://hdl.handle.net/21.15107/rcub_technorep_4228

Mladenović I, Lamovec J, Jović V, Obradov M, Radulović K, Vasiljević-Radović D, Radojević V. Artificial Neural Network for Composite Hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters. in 2019 IEEE 31st International Conference on Microelectronics (MIEL 2019). 2019;:133-136.
https://hdl.handle.net/21.15107/rcub_technorep_4228 .

Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Obradov, M., Radulović, Katarina, Vasiljević-Radović, Dana, Radojević, Vesna, "Artificial Neural Network for Composite Hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters" in 2019 IEEE 31st International Conference on Microelectronics (MIEL 2019) (2019):133-136,
https://hdl.handle.net/21.15107/rcub_technorep_4228 .

TY  - CONF
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Obradov, M.
AU  - Radulović, Katarina
AU  - Vasiljević-Radović, Dana
AU  - Radojević, Vesna
PY  - 2019
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/4186
AB  - Copper coatings are produced on silicon wafer by electrodeposition (ED) for various cathode current densities. The resulting composite systems consist of 10 μm monolayered copper films electrodeposited from sulphate bath on Si wafers with sputtered layers of Cr/Au. Hardness measurements were performed to evaluate properties of the composites. The composite hardness (H c ) was characterized using Vickers microindentation test. Then, an artificial neural network (ANN) model was used to study the relationship between the parameters of metallic composite and their hardness. Two experimental values: applied load during indentation test and current density during the ED process were used as the inputs to the neural network. Finally, the results of the composite hardness (experimental and predicted) were used to estimate the film hardness (H f ) of copper for each variations of the current density. This article shows that ANN is an useful tool in modeling composite hardness change with variation of experimental parameters predicting hardness change of composite Si/Cu with average error of 6 %. Using created ANN model it is possible to predict microhardness of Cu film for current density or indentation load for which we do not have experimental data.
PB  - Institute of Electrical and Electronics Engineers (IEEE)
C3  - 2019 IEEE 31st International Conference on Microelectronics, MIEL 2019 - Proceedings
T1  - Artificial Neural Network for Composite Hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters
EP  - 136
SP  - 133
DO  - 10.1109/MIEL.2019.8889610
ER  - 

@conference{
author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Obradov, M. and Radulović, Katarina and Vasiljević-Radović, Dana and Radojević, Vesna",
year = "2019",
abstract = "Copper coatings are produced on silicon wafer by electrodeposition (ED) for various cathode current densities. The resulting composite systems consist of 10 μm monolayered copper films electrodeposited from sulphate bath on Si wafers with sputtered layers of Cr/Au. Hardness measurements were performed to evaluate properties of the composites. The composite hardness (H c ) was characterized using Vickers microindentation test. Then, an artificial neural network (ANN) model was used to study the relationship between the parameters of metallic composite and their hardness. Two experimental values: applied load during indentation test and current density during the ED process were used as the inputs to the neural network. Finally, the results of the composite hardness (experimental and predicted) were used to estimate the film hardness (H f ) of copper for each variations of the current density. This article shows that ANN is an useful tool in modeling composite hardness change with variation of experimental parameters predicting hardness change of composite Si/Cu with average error of 6 %. Using created ANN model it is possible to predict microhardness of Cu film for current density or indentation load for which we do not have experimental data.",
publisher = "Institute of Electrical and Electronics Engineers (IEEE)",
journal = "2019 IEEE 31st International Conference on Microelectronics, MIEL 2019 - Proceedings",
title = "Artificial Neural Network for Composite Hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters",
pages = "136-133",
doi = "10.1109/MIEL.2019.8889610"
}

Mladenović, I., Lamovec, J., Jović, V., Obradov, M., Radulović, K., Vasiljević-Radović, D.,& Radojević, V.. (2019). Artificial Neural Network for Composite Hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters. in 2019 IEEE 31st International Conference on Microelectronics, MIEL 2019 - Proceedings
Institute of Electrical and Electronics Engineers (IEEE)., 133-136.
https://doi.org/10.1109/MIEL.2019.8889610

Mladenović I, Lamovec J, Jović V, Obradov M, Radulović K, Vasiljević-Radović D, Radojević V. Artificial Neural Network for Composite Hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters. in 2019 IEEE 31st International Conference on Microelectronics, MIEL 2019 - Proceedings. 2019;:133-136.
doi:10.1109/MIEL.2019.8889610 .

Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Obradov, M., Radulović, Katarina, Vasiljević-Radović, Dana, Radojević, Vesna, "Artificial Neural Network for Composite Hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters" in 2019 IEEE 31st International Conference on Microelectronics, MIEL 2019 - Proceedings (2019):133-136,
https://doi.org/10.1109/MIEL.2019.8889610 . .

TY  - JOUR
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Obradov, Marko
AU  - Vasiljević-Radović, Dana
AU  - Nikolić, Nebojša
AU  - Radojević, Vesna
PY  - 2019
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/4069
AB  - The mechanical properties of systems consisting of copper coatings electrodeposited on both brass sheet (BS) and thick electrodeposited nickel coating (ED Ni) substrates have been investigated. The electrodeposition of copper coatings was performed with and without the ultrasound assistance. The ultrasound application decreases root mean square (RMS) roughness of deposited Cu coating on both applied substrates, as obtained from non-contact AFM measurement. The coating roughness is highly dependent on the substrate roughness, being the smallest for the Cu coatings deposited on ED Ni substrate with the ultrasound mixing. The hardness and adhesion properties were characterized using the Vickers microindentation test. Model of Korsunsky was applied to the experimental data for determination the film hardness and the model of Chen-Gao was used for the adhesion evaluation. The introduction of ultrasonic agitation caused the changes in the film microstructure, and consequently in the mechanical properties. The copper coatings on both substrates, have higher hardness when deposited from electrolyte with ultrasound agitation. Although the type of the substrate has the major influence on the adhesion strength, it can be said that Cu electrodeposition with ultrasonic mixing contributes to an increase in adhesion.
PB  - Srpsko hemijsko društvo, Beograd
T2  - Journal of the Serbian Chemical Society
T1  - Mechanical characterization of copper coatings electrodeposited onto different substrates with and without ultrasound assistance
EP  - 741
IS  - 7
SP  - 729
VL  - 84
DO  - 10.2298/JSC181003023M
ER  - 

@article{
author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Obradov, Marko and Vasiljević-Radović, Dana and Nikolić, Nebojša and Radojević, Vesna",
year = "2019",
abstract = "The mechanical properties of systems consisting of copper coatings electrodeposited on both brass sheet (BS) and thick electrodeposited nickel coating (ED Ni) substrates have been investigated. The electrodeposition of copper coatings was performed with and without the ultrasound assistance. The ultrasound application decreases root mean square (RMS) roughness of deposited Cu coating on both applied substrates, as obtained from non-contact AFM measurement. The coating roughness is highly dependent on the substrate roughness, being the smallest for the Cu coatings deposited on ED Ni substrate with the ultrasound mixing. The hardness and adhesion properties were characterized using the Vickers microindentation test. Model of Korsunsky was applied to the experimental data for determination the film hardness and the model of Chen-Gao was used for the adhesion evaluation. The introduction of ultrasonic agitation caused the changes in the film microstructure, and consequently in the mechanical properties. The copper coatings on both substrates, have higher hardness when deposited from electrolyte with ultrasound agitation. Although the type of the substrate has the major influence on the adhesion strength, it can be said that Cu electrodeposition with ultrasonic mixing contributes to an increase in adhesion.",
publisher = "Srpsko hemijsko društvo, Beograd",
journal = "Journal of the Serbian Chemical Society",
title = "Mechanical characterization of copper coatings electrodeposited onto different substrates with and without ultrasound assistance",
pages = "741-729",
number = "7",
volume = "84",
doi = "10.2298/JSC181003023M"
}

Mladenović, I., Lamovec, J., Jović, V., Obradov, M., Vasiljević-Radović, D., Nikolić, N.,& Radojević, V.. (2019). Mechanical characterization of copper coatings electrodeposited onto different substrates with and without ultrasound assistance. in Journal of the Serbian Chemical Society
Srpsko hemijsko društvo, Beograd., 84(7), 729-741.
https://doi.org/10.2298/JSC181003023M

Mladenović I, Lamovec J, Jović V, Obradov M, Vasiljević-Radović D, Nikolić N, Radojević V. Mechanical characterization of copper coatings electrodeposited onto different substrates with and without ultrasound assistance. in Journal of the Serbian Chemical Society. 2019;84(7):729-741.
doi:10.2298/JSC181003023M .

Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Obradov, Marko, Vasiljević-Radović, Dana, Nikolić, Nebojša, Radojević, Vesna, "Mechanical characterization of copper coatings electrodeposited onto different substrates with and without ultrasound assistance" in Journal of the Serbian Chemical Society, 84, no. 7 (2019):729-741,
https://doi.org/10.2298/JSC181003023M . .

TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Radojević, Vesna
AU  - Jaćimovski, Stevo
AU  - Popović, Bogdan
PY  - 2018
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/3765
AB  - Alternate electrodeposition of ordinary and ultrasonic-assisted Ni layers on polycrystalline copper substrates and single-crystal (100)-oriented silicon wafers was used for the formation of composite systems with nickel thin multilayer films. The hardness and adhesion properties of these composite systems were characterized using Vickers microhardness test, with different loads. Dependence of composite microhardness and film adhesion on type of substrate and layer thickness was investigated. Model of Korsunsky, Chicot-Lesage and Chen-Gao were chosen and applied to experimental data for obtaining the film hardness and adhesion evaluation, respectively. It is confirmed that in comparison with the conventional electrodeposited Ni films, the mechanical properties of the ultrasonic-assisted multilayer Ni films are improved. The microhardness and adhesion of the films are enhanced by introduction of ultrasound and by reducing the layer thickness in the film.
PB  - Belgrade : Military Technical Institute
C3  - Proceedings - 8th International scientific conference on defensive technologies-proceedings, Belgrad
T1  - Characterization of nickel thin multilayer films electrodeposited under different agitation conditions
EP  - 426
SP  - 421
UR  - https://hdl.handle.net/21.15107/rcub_technorep_3765
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Radojević, Vesna and Jaćimovski, Stevo and Popović, Bogdan",
year = "2018",
abstract = "Alternate electrodeposition of ordinary and ultrasonic-assisted Ni layers on polycrystalline copper substrates and single-crystal (100)-oriented silicon wafers was used for the formation of composite systems with nickel thin multilayer films. The hardness and adhesion properties of these composite systems were characterized using Vickers microhardness test, with different loads. Dependence of composite microhardness and film adhesion on type of substrate and layer thickness was investigated. Model of Korsunsky, Chicot-Lesage and Chen-Gao were chosen and applied to experimental data for obtaining the film hardness and adhesion evaluation, respectively. It is confirmed that in comparison with the conventional electrodeposited Ni films, the mechanical properties of the ultrasonic-assisted multilayer Ni films are improved. The microhardness and adhesion of the films are enhanced by introduction of ultrasound and by reducing the layer thickness in the film.",
publisher = "Belgrade : Military Technical Institute",
journal = "Proceedings - 8th International scientific conference on defensive technologies-proceedings, Belgrad",
title = "Characterization of nickel thin multilayer films electrodeposited under different agitation conditions",
pages = "426-421",
url = "https://hdl.handle.net/21.15107/rcub_technorep_3765"
}

Lamovec, J., Jović, V., Mladenović, I., Radojević, V., Jaćimovski, S.,& Popović, B.. (2018). Characterization of nickel thin multilayer films electrodeposited under different agitation conditions. in Proceedings - 8th International scientific conference on defensive technologies-proceedings, Belgrad
Belgrade : Military Technical Institute., 421-426.
https://hdl.handle.net/21.15107/rcub_technorep_3765

Lamovec J, Jović V, Mladenović I, Radojević V, Jaćimovski S, Popović B. Characterization of nickel thin multilayer films electrodeposited under different agitation conditions. in Proceedings - 8th International scientific conference on defensive technologies-proceedings, Belgrad. 2018;:421-426.
https://hdl.handle.net/21.15107/rcub_technorep_3765 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Radojević, Vesna, Jaćimovski, Stevo, Popović, Bogdan, "Characterization of nickel thin multilayer films electrodeposited under different agitation conditions" in Proceedings - 8th International scientific conference on defensive technologies-proceedings, Belgrad (2018):421-426,
https://hdl.handle.net/21.15107/rcub_technorep_3765 .

TY  - JOUR
AU  - Lamovec, Jelena
AU  - Mladenović, Ivana
AU  - Jović, Vesna
AU  - Radojević, Vesna
AU  - Jaćimovski, Stevo
AU  - Jovanov, Goran
PY  - 2018
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/3831
AB  - Multilayer composite structures of electrodeposited Ni films on polycrystalline copper substrates were fabricated with the assistance of ultrasonic agitation. Alternate ordinary and ultrasonicassisted electrodeposition of Ni layers allowed the formation of laminated films. The adhesion and hardness properties were characterized using bidirectional bending test and Vickers microhardness test with different loads. Dependence of composite microhardness and film adhesion on layer thickness was investigated. It was confirmed that densified parallel interfaces give rise to high hardness and strength of composites. Model of Korsunsky was chosen and applied to experimental data for obtaining the film hardness and model of Chen-Gao was applied for the adhesion evaluation. Compared with the conventional electrodeposited Ni films, the mechanical properties of the ultrasonic-assisted multilayer Ni films are improved. The microhardness and adhesion of the films are enhanced by introduction of ultrasound and by reducing the layer thickness in the film.
AB  - Višeslojne kompozitne strukture su sačinjene od elektrodeponovanih filmova Ni na supstratima od polikristalnog bakra uz pomoć ultrazvučnog mešanja. Naizmenična elektrodepozicija slojeva Ni bez i uz pomoć ultrazvučnog mešanja omogućila je formiranje laminatnih filmova. Adhezija i tvrdoća su okarakterisane ispitivanjem na savijanje u dva pravca i Vikersovim testom mikrotvrdoće sa različitim opterećenjima. Zavisnost kompozitne mikrotvrdoće i adhezije filma od debljine sloja je ispitana. Potvrđeno je da veliki broj međuslojnih granica doprinosi povećanju tvrdoće i jačine kompozita. Za obradu eksperimentalnih podataka su odabrani i primenjeni model Korsunskog za izračunavanje tvrdoće filma i model Čen-Gao za procenu adhezije filma. U poređenju sa filmovima Ni elektrodeponovanim na konvencionalan način, mehanička svojstva filmova elektrodeponovanih u prisustvu uzltrazvuka su poboljšana. Vrednosti mikrotvrdoće i adhezije su povećane uvođenjem ultrazvuka i smanjenjem debljine pojedinačnog sloja Ni u filmu.
PB  - Engineering Society for Corrosion, Belgrade, Serbia
T2  - Zaštita materijala
T1  - Obtaining and characterization of multilayer nickel thin films electrodeposited with the assistance of ultrasonic agitation
T1  - Dobijanje i karakterizacija višeslojnih tankih filmova nikla elektrodeponovanih uz pomoć ultrazvučnog mešanja
EP  - 400
IS  - 3
SP  - 394
VL  - 59
DO  - 10.5937/zasmat1803394L
ER  - 

@article{
author = "Lamovec, Jelena and Mladenović, Ivana and Jović, Vesna and Radojević, Vesna and Jaćimovski, Stevo and Jovanov, Goran",
year = "2018",
abstract = "Multilayer composite structures of electrodeposited Ni films on polycrystalline copper substrates were fabricated with the assistance of ultrasonic agitation. Alternate ordinary and ultrasonicassisted electrodeposition of Ni layers allowed the formation of laminated films. The adhesion and hardness properties were characterized using bidirectional bending test and Vickers microhardness test with different loads. Dependence of composite microhardness and film adhesion on layer thickness was investigated. It was confirmed that densified parallel interfaces give rise to high hardness and strength of composites. Model of Korsunsky was chosen and applied to experimental data for obtaining the film hardness and model of Chen-Gao was applied for the adhesion evaluation. Compared with the conventional electrodeposited Ni films, the mechanical properties of the ultrasonic-assisted multilayer Ni films are improved. The microhardness and adhesion of the films are enhanced by introduction of ultrasound and by reducing the layer thickness in the film., Višeslojne kompozitne strukture su sačinjene od elektrodeponovanih filmova Ni na supstratima od polikristalnog bakra uz pomoć ultrazvučnog mešanja. Naizmenična elektrodepozicija slojeva Ni bez i uz pomoć ultrazvučnog mešanja omogućila je formiranje laminatnih filmova. Adhezija i tvrdoća su okarakterisane ispitivanjem na savijanje u dva pravca i Vikersovim testom mikrotvrdoće sa različitim opterećenjima. Zavisnost kompozitne mikrotvrdoće i adhezije filma od debljine sloja je ispitana. Potvrđeno je da veliki broj međuslojnih granica doprinosi povećanju tvrdoće i jačine kompozita. Za obradu eksperimentalnih podataka su odabrani i primenjeni model Korsunskog za izračunavanje tvrdoće filma i model Čen-Gao za procenu adhezije filma. U poređenju sa filmovima Ni elektrodeponovanim na konvencionalan način, mehanička svojstva filmova elektrodeponovanih u prisustvu uzltrazvuka su poboljšana. Vrednosti mikrotvrdoće i adhezije su povećane uvođenjem ultrazvuka i smanjenjem debljine pojedinačnog sloja Ni u filmu.",
publisher = "Engineering Society for Corrosion, Belgrade, Serbia",
journal = "Zaštita materijala",
title = "Obtaining and characterization of multilayer nickel thin films electrodeposited with the assistance of ultrasonic agitation, Dobijanje i karakterizacija višeslojnih tankih filmova nikla elektrodeponovanih uz pomoć ultrazvučnog mešanja",
pages = "400-394",
number = "3",
volume = "59",
doi = "10.5937/zasmat1803394L"
}

Lamovec, J., Mladenović, I., Jović, V., Radojević, V., Jaćimovski, S.,& Jovanov, G.. (2018). Obtaining and characterization of multilayer nickel thin films electrodeposited with the assistance of ultrasonic agitation. in Zaštita materijala
Engineering Society for Corrosion, Belgrade, Serbia., 59(3), 394-400.
https://doi.org/10.5937/zasmat1803394L

Lamovec J, Mladenović I, Jović V, Radojević V, Jaćimovski S, Jovanov G. Obtaining and characterization of multilayer nickel thin films electrodeposited with the assistance of ultrasonic agitation. in Zaštita materijala. 2018;59(3):394-400.
doi:10.5937/zasmat1803394L .

Lamovec, Jelena, Mladenović, Ivana, Jović, Vesna, Radojević, Vesna, Jaćimovski, Stevo, Jovanov, Goran, "Obtaining and characterization of multilayer nickel thin films electrodeposited with the assistance of ultrasonic agitation" in Zaštita materijala, 59, no. 3 (2018):394-400,
https://doi.org/10.5937/zasmat1803394L . .

TY  - CONF
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Popović, Bogdan
AU  - Vorkapić, Miloš
AU  - Radojević, Vesna
PY  - 2017
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/3485
AB  - Microhardness test is the most commonly used method for assessing the mechanical properties of thin films.This testing method uses controlled contact at a single point of an indenter and chosen material which induces the plastic deformation in material under indenter. The measured hardness is considered as the composite hardness, because the substrate participates in the plastic deformation caused by indentation. This research has been carried out in order to analyze and compare the hardness response of different composite systems consist of monolayer electrodeposited copper thin film on brass and steel alloys as the substrates. The influence of the electrodeposition parameters and of the substrate on the hardness and interlayer adhesion were investigated by Vickers microhardness testing for different load.
PB  - Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering
C3  - Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic
T1  - Hardness response and adhesion of thin copper films on alloy substrates
EP  - MOI1.3.6
SP  - MOI1.3.1
UR  - https://hdl.handle.net/21.15107/rcub_technorep_3485
ER  - 

@conference{
author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Popović, Bogdan and Vorkapić, Miloš and Radojević, Vesna",
year = "2017",
abstract = "Microhardness test is the most commonly used method for assessing the mechanical properties of thin films.This testing method uses controlled contact at a single point of an indenter and chosen material which induces the plastic deformation in material under indenter. The measured hardness is considered as the composite hardness, because the substrate participates in the plastic deformation caused by indentation. This research has been carried out in order to analyze and compare the hardness response of different composite systems consist of monolayer electrodeposited copper thin film on brass and steel alloys as the substrates. The influence of the electrodeposition parameters and of the substrate on the hardness and interlayer adhesion were investigated by Vickers microhardness testing for different load.",
publisher = "Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering",
journal = "Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic",
title = "Hardness response and adhesion of thin copper films on alloy substrates",
pages = "MOI1.3.6-MOI1.3.1",
url = "https://hdl.handle.net/21.15107/rcub_technorep_3485"
}

Mladenović, I., Lamovec, J., Jović, V., Popović, B., Vorkapić, M.,& Radojević, V.. (2017). Hardness response and adhesion of thin copper films on alloy substrates. in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic
Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering., MOI1.3.1-MOI1.3.6.
https://hdl.handle.net/21.15107/rcub_technorep_3485

Mladenović I, Lamovec J, Jović V, Popović B, Vorkapić M, Radojević V. Hardness response and adhesion of thin copper films on alloy substrates. in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic. 2017;:MOI1.3.1-MOI1.3.6.
https://hdl.handle.net/21.15107/rcub_technorep_3485 .

Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Popović, Bogdan, Vorkapić, Miloš, Radojević, Vesna, "Hardness response and adhesion of thin copper films on alloy substrates" in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic (2017):MOI1.3.1-MOI1.3.6,
https://hdl.handle.net/21.15107/rcub_technorep_3485 .

TY  - JOUR
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Radojević, Vesna
PY  - 2017
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/3529
AB  - Thin copper films were electrodeposited on a polycrystalline cold rolled copper substrate. The composition of the laboratory-made copper sulphate electrolyte was changed by the addition of various additives. The influence of chloride ion (Cl-), polyethylene glycol (PEG) and 3-mercapto-1-propane sulfonic acid (MPSA) on mechanical and adhesion properties of the electrodeposited copper films was investigated using Vickers microindentation technique. Calculations of the film hardness and adhesion were carried out using composite hardness models of Korsunsky and Chen-Gao. The hardness of the composite system is influenced by the adhesion of the copper film to the substrate. Increasing adhesion corresponds to increasing values of the calculated adhesion parameter b, named the critical reduced depth. When additives are added to a plating solution, the copper deposition mechanism is changed and fine-grained microstructure without the formation of microscopic nodules is obtained.
PB  - Faculty of Technical Sciences in Cacak
T2  - Serbian Journal of Electrical Engineering
T1  - Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films
EP  - 11
IS  - 1
SP  - 1
VL  - 14
DO  - 10.2298/SJEE1701001M
ER  - 

@article{
author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Radojević, Vesna",
year = "2017",
abstract = "Thin copper films were electrodeposited on a polycrystalline cold rolled copper substrate. The composition of the laboratory-made copper sulphate electrolyte was changed by the addition of various additives. The influence of chloride ion (Cl-), polyethylene glycol (PEG) and 3-mercapto-1-propane sulfonic acid (MPSA) on mechanical and adhesion properties of the electrodeposited copper films was investigated using Vickers microindentation technique. Calculations of the film hardness and adhesion were carried out using composite hardness models of Korsunsky and Chen-Gao. The hardness of the composite system is influenced by the adhesion of the copper film to the substrate. Increasing adhesion corresponds to increasing values of the calculated adhesion parameter b, named the critical reduced depth. When additives are added to a plating solution, the copper deposition mechanism is changed and fine-grained microstructure without the formation of microscopic nodules is obtained.",
publisher = "Faculty of Technical Sciences in Cacak",
journal = "Serbian Journal of Electrical Engineering",
title = "Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films",
pages = "11-1",
number = "1",
volume = "14",
doi = "10.2298/SJEE1701001M"
}

Mladenović, I., Lamovec, J., Jović, V.,& Radojević, V.. (2017). Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films. in Serbian Journal of Electrical Engineering
Faculty of Technical Sciences in Cacak., 14(1), 1-11.
https://doi.org/10.2298/SJEE1701001M

Mladenović I, Lamovec J, Jović V, Radojević V. Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films. in Serbian Journal of Electrical Engineering. 2017;14(1):1-11.
doi:10.2298/SJEE1701001M .

Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Radojević, Vesna, "Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films" in Serbian Journal of Electrical Engineering, 14, no. 1 (2017):1-11,
https://doi.org/10.2298/SJEE1701001M . .

TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Popović, Bogdan
AU  - Vorkapić, Miloš
AU  - Radojević, Vesna
PY  - 2016
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/3174
AB  - Composite systems of monolayered electrodeposited Ni and Cu thin films (5-10 μm) on monocrystalline Si wafers and 50 μm-thick electrodeposited Ni film as the substrates were fabricated. On the basis of their difference in hardness, these systems can be thought of as “soft film on hard substrate” composite systems. Adhesion of electrodeposited films on different substrates was investigated by Vickers microindentation hardness testing. Strong adhesion corresponds to extended plastic deformation zone at the film/substrate interface. Interfacial tension effects contribute to the measured hardness. Composite hardness models of Chicot-Lesage (C-L) and Chen-Gao (C-G) were applied in order to investigate the influence of adhesion on microhardness test results. When adhesion exists between the film and the substrate, the critical reduced depth (the ratio between the radius of the plastic zone beneath the indent and the indentation depth) increases. Microhardness measurements are useful tool for assessment and quantification of the film/substrate interface strength.
PB  - Belgrade : Military Technical Institute
C3  - Proceedings - 7th International scientific conference on defensive technologies-proceedings, Belgrad
T1  - On the correlation of microhardness with the film adhesion for “soft film on hard substrate” composite system
EP  - 540
SP  - 536
UR  - https://hdl.handle.net/21.15107/rcub_technorep_3174
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Popović, Bogdan and Vorkapić, Miloš and Radojević, Vesna",
year = "2016",
abstract = "Composite systems of monolayered electrodeposited Ni and Cu thin films (5-10 μm) on monocrystalline Si wafers and 50 μm-thick electrodeposited Ni film as the substrates were fabricated. On the basis of their difference in hardness, these systems can be thought of as “soft film on hard substrate” composite systems. Adhesion of electrodeposited films on different substrates was investigated by Vickers microindentation hardness testing. Strong adhesion corresponds to extended plastic deformation zone at the film/substrate interface. Interfacial tension effects contribute to the measured hardness. Composite hardness models of Chicot-Lesage (C-L) and Chen-Gao (C-G) were applied in order to investigate the influence of adhesion on microhardness test results. When adhesion exists between the film and the substrate, the critical reduced depth (the ratio between the radius of the plastic zone beneath the indent and the indentation depth) increases. Microhardness measurements are useful tool for assessment and quantification of the film/substrate interface strength.",
publisher = "Belgrade : Military Technical Institute",
journal = "Proceedings - 7th International scientific conference on defensive technologies-proceedings, Belgrad",
title = "On the correlation of microhardness with the film adhesion for “soft film on hard substrate” composite system",
pages = "540-536",
url = "https://hdl.handle.net/21.15107/rcub_technorep_3174"
}

Lamovec, J., Jović, V., Mladenović, I., Popović, B., Vorkapić, M.,& Radojević, V.. (2016). On the correlation of microhardness with the film adhesion for “soft film on hard substrate” composite system. in Proceedings - 7th International scientific conference on defensive technologies-proceedings, Belgrad
Belgrade : Military Technical Institute., 536-540.
https://hdl.handle.net/21.15107/rcub_technorep_3174

Lamovec J, Jović V, Mladenović I, Popović B, Vorkapić M, Radojević V. On the correlation of microhardness with the film adhesion for “soft film on hard substrate” composite system. in Proceedings - 7th International scientific conference on defensive technologies-proceedings, Belgrad. 2016;:536-540.
https://hdl.handle.net/21.15107/rcub_technorep_3174 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Popović, Bogdan, Vorkapić, Miloš, Radojević, Vesna, "On the correlation of microhardness with the film adhesion for “soft film on hard substrate” composite system" in Proceedings - 7th International scientific conference on defensive technologies-proceedings, Belgrad (2016):536-540,
https://hdl.handle.net/21.15107/rcub_technorep_3174 .

TY  - CONF
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Radojević, Vesna
PY  - 2016
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/3156
AB  - Tanki bakarni filmovi debljine 10 μm deponovani su na hladno-valjanim supstratima od bakra i mesinga procesom elektrohemijske depozicije iz laboratorijski napravljenog sulfatnog kupatila sa dodatkom različitih aditiva (hloridnih jona (Cl-) i polietilen glikola (PEG)). Ispitivan je uticaj aditiva i parametara depozicije na strukturna i mehanička svojstva bakarnih prevlaka. Prisustvo aditiva omogućilo je nastajanje glatkih i sjajnih depozita usled promene njihove mikrostrukture. Mikromehanička svojstva filmova bakra ispitivana su metodom mikroindentacije po Vikersu. Izmerena vrednost tvrdoće kompozitnog sistema Cu film – supstrat je složena funkcija tvrdoće supstrata i tvrdoće filma. Za određivanje tvrdoće filmova iz kompozitne mikrotvrdoće korišćeni su modeli Korsunskog i Šiko-Lezaža. Eksperimentalna ispitivanja su pokazala da se istovremenim dodatkom aditiva (PEG+Cl-) ostvaruje kvalitetnija mikrostruktura depozita koji usled toga imaju bolja mikromehanička svojstva.
PB  - Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering
C3  - Zbornik 60. konferencije za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehni
T1  - Sinergetski efekat aditiva na morfološka i mikromehanička svojstva bakarnih prevlaka na različitim podlogama
EP  - MO1.1.6
SP  - MO1.1.1
UR  - https://hdl.handle.net/21.15107/rcub_technorep_3156
ER  - 

@conference{
author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Radojević, Vesna",
year = "2016",
abstract = "Tanki bakarni filmovi debljine 10 μm deponovani su na hladno-valjanim supstratima od bakra i mesinga procesom elektrohemijske depozicije iz laboratorijski napravljenog sulfatnog kupatila sa dodatkom različitih aditiva (hloridnih jona (Cl-) i polietilen glikola (PEG)). Ispitivan je uticaj aditiva i parametara depozicije na strukturna i mehanička svojstva bakarnih prevlaka. Prisustvo aditiva omogućilo je nastajanje glatkih i sjajnih depozita usled promene njihove mikrostrukture. Mikromehanička svojstva filmova bakra ispitivana su metodom mikroindentacije po Vikersu. Izmerena vrednost tvrdoće kompozitnog sistema Cu film – supstrat je složena funkcija tvrdoće supstrata i tvrdoće filma. Za određivanje tvrdoće filmova iz kompozitne mikrotvrdoće korišćeni su modeli Korsunskog i Šiko-Lezaža. Eksperimentalna ispitivanja su pokazala da se istovremenim dodatkom aditiva (PEG+Cl-) ostvaruje kvalitetnija mikrostruktura depozita koji usled toga imaju bolja mikromehanička svojstva.",
publisher = "Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering",
journal = "Zbornik 60. konferencije za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehni",
title = "Sinergetski efekat aditiva na morfološka i mikromehanička svojstva bakarnih prevlaka na različitim podlogama",
pages = "MO1.1.6-MO1.1.1",
url = "https://hdl.handle.net/21.15107/rcub_technorep_3156"
}

Mladenović, I., Lamovec, J., Jović, V.,& Radojević, V.. (2016). Sinergetski efekat aditiva na morfološka i mikromehanička svojstva bakarnih prevlaka na različitim podlogama. in Zbornik 60. konferencije za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehni
Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering., MO1.1.1-MO1.1.6.
https://hdl.handle.net/21.15107/rcub_technorep_3156

Mladenović I, Lamovec J, Jović V, Radojević V. Sinergetski efekat aditiva na morfološka i mikromehanička svojstva bakarnih prevlaka na različitim podlogama. in Zbornik 60. konferencije za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehni. 2016;:MO1.1.1-MO1.1.6.
https://hdl.handle.net/21.15107/rcub_technorep_3156 .

Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Radojević, Vesna, "Sinergetski efekat aditiva na morfološka i mikromehanička svojstva bakarnih prevlaka na različitim podlogama" in Zbornik 60. konferencije za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehni (2016):MO1.1.1-MO1.1.6,
https://hdl.handle.net/21.15107/rcub_technorep_3156 .

TY  - CONF
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Radojević, Vesna
PY  - 2015
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2871
AB  - Multilayer Ni/Cu films were alternately electrochemically deposited on polycrystalline Cu substrate by dual-bath technique. Change of the parameters such as total film thickness, sublayer thickness and sublayer thickness ratio influences the mechanical properties of the multilayer Ni/Cu films and gives the possibilities for different MEMS fabrication applications. Thin Ni and Cu films with sublayer thickness from 75 nm to 5 µm have good interlayer adhesion. Decreasing the sublayer thickness leads to increase in the composite microhardness value. Delamination of the layers is noticed for the sublayer thickness greater than 5 µm. Three-dimensional Ni microstructures can be fabricated using multilayer Ni/Cu film by selective etching of Cu layers in in acidic thiourea solution („surface micromachining“ technique).
AB  - Tehnikom elektrohemijske depozicije iz dva kupatila (DBT), dobijeni su višeslojni filmovi Ni i Cu naizmeničnim deponovanjem na polikristalni bakarni supstrat. Promena parametara kao što su ukupna debljina filma, debljina pojedinačnog sloja i odnos debljina pojedinačnih slojeva Ni i Cu u filmu, utiče na mehanička svojstva višeslojnih filmova i omogućava formiranje različitih struktura za njihovu primenu u MEMS-u. Tanki filmovi Ni i Cu sa debljinom slojeva od 75 nm do 5 μm pokazuju dobru međuslojnu adheziju. Smanjenjem debljine pojedinačnog sloja do 300 nm i povećanjem odnosa debljina slojeva Ni:Cu na 1:4, došlo se do višestrukog povećanja vrednosti Vikersove mikrotvrdoće u odnosu na jednoslojne metalne filmove. Filmovi sa debljinom slojeva većom od 5 mikrometara, nemaju dobru medjuslojnu adheziju i uočava se delaminacija slojeva. Sve strukture višeslojnih filmova Ni i Cu se mogu primeniti za izradu trodimenzionalnih MEMS struktura od nikla, metodom selektivnog nagrizanja sloja bakra u kiselom rastvoru tiouree (tehnikom „površinskog mikromašinstva“).
PB  - Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering
C3  - Zbornik 59. konferencije za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehni
T1  - Influence of the structure of multilayer thin Ni/Cu films
on their mechanical properties and MEMS devices
fabrication applications
T1  - Uticaj strukture višeslojnih tankih filmova nikla i bakra na njihova mehanička svojstva i primenu u izradi MEMS naprava
EP  - MO2.1.4
SP  - MO2.1.1
UR  - https://hdl.handle.net/21.15107/rcub_technorep_2871
ER  - 

@conference{
author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Radojević, Vesna",
year = "2015",
abstract = "Multilayer Ni/Cu films were alternately electrochemically deposited on polycrystalline Cu substrate by dual-bath technique. Change of the parameters such as total film thickness, sublayer thickness and sublayer thickness ratio influences the mechanical properties of the multilayer Ni/Cu films and gives the possibilities for different MEMS fabrication applications. Thin Ni and Cu films with sublayer thickness from 75 nm to 5 µm have good interlayer adhesion. Decreasing the sublayer thickness leads to increase in the composite microhardness value. Delamination of the layers is noticed for the sublayer thickness greater than 5 µm. Three-dimensional Ni microstructures can be fabricated using multilayer Ni/Cu film by selective etching of Cu layers in in acidic thiourea solution („surface micromachining“ technique)., Tehnikom elektrohemijske depozicije iz dva kupatila (DBT), dobijeni su višeslojni filmovi Ni i Cu naizmeničnim deponovanjem na polikristalni bakarni supstrat. Promena parametara kao što su ukupna debljina filma, debljina pojedinačnog sloja i odnos debljina pojedinačnih slojeva Ni i Cu u filmu, utiče na mehanička svojstva višeslojnih filmova i omogućava formiranje različitih struktura za njihovu primenu u MEMS-u. Tanki filmovi Ni i Cu sa debljinom slojeva od 75 nm do 5 μm pokazuju dobru međuslojnu adheziju. Smanjenjem debljine pojedinačnog sloja do 300 nm i povećanjem odnosa debljina slojeva Ni:Cu na 1:4, došlo se do višestrukog povećanja vrednosti Vikersove mikrotvrdoće u odnosu na jednoslojne metalne filmove. Filmovi sa debljinom slojeva većom od 5 mikrometara, nemaju dobru medjuslojnu adheziju i uočava se delaminacija slojeva. Sve strukture višeslojnih filmova Ni i Cu se mogu primeniti za izradu trodimenzionalnih MEMS struktura od nikla, metodom selektivnog nagrizanja sloja bakra u kiselom rastvoru tiouree (tehnikom „površinskog mikromašinstva“).",
publisher = "Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering",
journal = "Zbornik 59. konferencije za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehni",
title = "Influence of the structure of multilayer thin Ni/Cu films
on their mechanical properties and MEMS devices
fabrication applications, Uticaj strukture višeslojnih tankih filmova nikla i bakra na njihova mehanička svojstva i primenu u izradi MEMS naprava",
pages = "MO2.1.4-MO2.1.1",
url = "https://hdl.handle.net/21.15107/rcub_technorep_2871"
}

Mladenović, I., Lamovec, J., Jović, V.,& Radojević, V.. (2015). Influence of the structure of multilayer thin Ni/Cu films
on their mechanical properties and MEMS devices
fabrication applications. in Zbornik 59. konferencije za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehni
Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering., MO2.1.1-MO2.1.4.
https://hdl.handle.net/21.15107/rcub_technorep_2871

Mladenović I, Lamovec J, Jović V, Radojević V. Influence of the structure of multilayer thin Ni/Cu films
on their mechanical properties and MEMS devices
fabrication applications. in Zbornik 59. konferencije za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehni. 2015;:MO2.1.1-MO2.1.4.
https://hdl.handle.net/21.15107/rcub_technorep_2871 .

Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Radojević, Vesna, "Influence of the structure of multilayer thin Ni/Cu films
on their mechanical properties and MEMS devices
fabrication applications" in Zbornik 59. konferencije za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehni (2015):MO2.1.1-MO2.1.4,
https://hdl.handle.net/21.15107/rcub_technorep_2871 .

TY  - JOUR
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Stojanović, Dušica
AU  - Kojović, Aleksandar
AU  - Radojević, Vesna
PY  - 2015
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2961
AB  - This investigation has been carried out in order to analyse and compare the hardness response of different composite systems of the same type, named 'soft film on hard substrate' composite system. Composite systems of mono- and multilayered electrodeposited Ni and Cu thin films on (100) and (111)-oriented monocrystalline Si wafers and 100 µm-thick electrodeposited Ni film as the substrates were fabricated. The indentation behaviour of these composite structures was characterized using Berkovich nanohardness and Vickers microhardness testing. The measured hardness is so-called 'composite hardness', because the substrate participates in the plastic deformation during the indentation process. The contribution of the substrate to the measured hardness starts at indentation depths of the order of 0.07- 0.2 times the film thickness. Dependence of nanohardness and microhardness values on electrodeposition process conditions, substrate and film microstructure, total film thickness, layer thickness and Ni/Cu layer thickness ratio for different composite systems ratio was investigated. Composite hardness model of Chicot-Lesage (C-L) was chosen and applied to experimental data in order to determine absolute film hardness.
AB  - Ovo istraživanje je izvršeno u cilju analize i upoređivanja odziva različitih kompozitnih sistema koji pripadaju istom tipu sistema nazvanom 'mek film na tvrdom supstratu', pri merenju tvrdoće. Formirani su kompozitni sistemi elektrodepozicijom jedno- i višeslojnih Ni i Cu tankih filmova na (100) i (111)- orijentisanim monokristalnim Si pločicama i 100-µm debelom elektrodeponovanom Ni filmu kao supstratima. Ponašanje ovih kompozitnih struktura pri utiskivanju je okarakterisano merenjem nanotvrdoće po Berkoviču i mikrotvrdoće po Vikersu. Izmerena vrednost mikrotvrdoće se naziva 'kompozitnom tvrdoćom' jer prilikom testiranja utiskivanjem dolazi i do plastične deformacije supstrata. Doprinos deformacije supstrata izmerenoj tvrdoći počinje na dubinama utiskivanja koje su reda 0.07-0.2 puta manje od debljine filma. Istraživana je zavisnost vrednosti nanotvrdoće i mikrotvrdoće od procesnih parametera elektrodepozicije, mikrostrukture supstrata i filmova, ukupne debljine filma, debljine pojedinačnog sloja u filmu i odnosa debljina Ni/Cu pojedinačnih slojeva u filmu za različite kompozitne sisteme. Radi određivanja apsolutne tvrdoće filma u sistemu, odabran je i na eksperimentalne rezultate primenjen model kompozitne tvrdoće Šiko-Lezaž (C-L).
PB  - Engineering Society for Corrosion, Belgrade, Serbia
T2  - Zaštita materijala
T1  - Indentation behaviour of 'soft film on hard substrate' composite system type
T1  - Ponašanje kompozitnih sistema tipa 'mek film na tvrdom supstratu' na testu utiskivanja
EP  - 277
IS  - 3
SP  - 269
VL  - 56
DO  - 10.5937/ZasMat1503269L
ER  - 

@article{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Stojanović, Dušica and Kojović, Aleksandar and Radojević, Vesna",
year = "2015",
abstract = "This investigation has been carried out in order to analyse and compare the hardness response of different composite systems of the same type, named 'soft film on hard substrate' composite system. Composite systems of mono- and multilayered electrodeposited Ni and Cu thin films on (100) and (111)-oriented monocrystalline Si wafers and 100 µm-thick electrodeposited Ni film as the substrates were fabricated. The indentation behaviour of these composite structures was characterized using Berkovich nanohardness and Vickers microhardness testing. The measured hardness is so-called 'composite hardness', because the substrate participates in the plastic deformation during the indentation process. The contribution of the substrate to the measured hardness starts at indentation depths of the order of 0.07- 0.2 times the film thickness. Dependence of nanohardness and microhardness values on electrodeposition process conditions, substrate and film microstructure, total film thickness, layer thickness and Ni/Cu layer thickness ratio for different composite systems ratio was investigated. Composite hardness model of Chicot-Lesage (C-L) was chosen and applied to experimental data in order to determine absolute film hardness., Ovo istraživanje je izvršeno u cilju analize i upoređivanja odziva različitih kompozitnih sistema koji pripadaju istom tipu sistema nazvanom 'mek film na tvrdom supstratu', pri merenju tvrdoće. Formirani su kompozitni sistemi elektrodepozicijom jedno- i višeslojnih Ni i Cu tankih filmova na (100) i (111)- orijentisanim monokristalnim Si pločicama i 100-µm debelom elektrodeponovanom Ni filmu kao supstratima. Ponašanje ovih kompozitnih struktura pri utiskivanju je okarakterisano merenjem nanotvrdoće po Berkoviču i mikrotvrdoće po Vikersu. Izmerena vrednost mikrotvrdoće se naziva 'kompozitnom tvrdoćom' jer prilikom testiranja utiskivanjem dolazi i do plastične deformacije supstrata. Doprinos deformacije supstrata izmerenoj tvrdoći počinje na dubinama utiskivanja koje su reda 0.07-0.2 puta manje od debljine filma. Istraživana je zavisnost vrednosti nanotvrdoće i mikrotvrdoće od procesnih parametera elektrodepozicije, mikrostrukture supstrata i filmova, ukupne debljine filma, debljine pojedinačnog sloja u filmu i odnosa debljina Ni/Cu pojedinačnih slojeva u filmu za različite kompozitne sisteme. Radi određivanja apsolutne tvrdoće filma u sistemu, odabran je i na eksperimentalne rezultate primenjen model kompozitne tvrdoće Šiko-Lezaž (C-L).",
publisher = "Engineering Society for Corrosion, Belgrade, Serbia",
journal = "Zaštita materijala",
title = "Indentation behaviour of 'soft film on hard substrate' composite system type, Ponašanje kompozitnih sistema tipa 'mek film na tvrdom supstratu' na testu utiskivanja",
pages = "277-269",
number = "3",
volume = "56",
doi = "10.5937/ZasMat1503269L"
}

Lamovec, J., Jović, V., Mladenović, I., Stojanović, D., Kojović, A.,& Radojević, V.. (2015). Indentation behaviour of 'soft film on hard substrate' composite system type. in Zaštita materijala
Engineering Society for Corrosion, Belgrade, Serbia., 56(3), 269-277.
https://doi.org/10.5937/ZasMat1503269L

Lamovec J, Jović V, Mladenović I, Stojanović D, Kojović A, Radojević V. Indentation behaviour of 'soft film on hard substrate' composite system type. in Zaštita materijala. 2015;56(3):269-277.
doi:10.5937/ZasMat1503269L .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Stojanović, Dušica, Kojović, Aleksandar, Radojević, Vesna, "Indentation behaviour of 'soft film on hard substrate' composite system type" in Zaštita materijala, 56, no. 3 (2015):269-277,
https://doi.org/10.5937/ZasMat1503269L . .

TY  - JOUR
AU  - Lamovec, Jelena
AU  - Jović, Vesna B.
AU  - Mladenović, Ivana
AU  - Popović, Bogdan
AU  - Radojević, Vesna
PY  - 2015
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2928
AB  - Multilayer Ni/Cu thin films were produced by dual-bath electrodeposition technique (DBT) on polycrystalline cold-rolled Cu substrate. Different Ni/Cu multilayer structures were realized by changing of process parameters such as total film thickness, sublayer thickness and Ni/Cu sublayer thickness ratio. The mechanical properties of Vickers microhardness and interfacial adhesion in the films were investigated. Decreasing of sublayer thickness down to 300 nm and increasing of Ni:Cu sublayer thickness ratio to 1:4, lead to higher values of Vickers microhardness compared to monolayer metal films. Thin films with sublayer thicknesses from 75 nm to 5 μm show strong interfacial adhesion. A weak adhesion and sublayer exfoliation for the films with sublayer thickness greater than 5μm were found. Three-dimensional Ni microstructures can be fabricated using multilayer Ni/Cu film by selective etching of Cu layers in an acidic thiourea solution ('surface micromachining' technique).
AB  - Tehnikom elektrohemijske depozicije iz dva kupatila (dual-bath technique, DBT), dobijeni su višeslojni filmovi Ni i Cu, naizmeničnim deponovanjem na polikristalni, hladno-valjani bakarni supstrat. Različite strukture Ni/Cu višeslojnih filmova su ostvarene promenom procesnih parametara kao što su ukupna debljina filma, debljina pojedinačnog sloja u filmu i odnos debljina pojedinačnih slojeva Ni i Cu u filmu. Ispitana su mehanička svojstva mikrotvrdoće po Vikersu i adhezije filma na supstratu i kontaktnim površinama slojeva u filmu. Smanjenjem debljine pojedinačnog sloja do 300 nm i povećanjem odnosa debljina slojeva Ni:Cu na 1:4, došlo se do višestrukog povećanja vrednosti Vikersove mikrotvrdoće u odnosu na jednoslojne metalne filmove. Tanki slojevi Ni i Cu sa debljinom od 75 nm do 5 μm pokazuju dobru međuslojnu adheziju. Filmovi sa debljinom slojeva većom od 5 μm, nemaju dobru međuslojnu adheziju i uočava se delaminacija (razdvajanje) slojeva. Sve strukture višeslojnih filmova Ni i Cu se mogu primeniti za izradu trodimenzionalnih MEMS struktura od Ni, metodom selektivnog nagrizanja slojeva Cu u kiselom rastvoru tiouree tehnikom 'površinskog mikromašinstva'.
PB  - Savez inženjera i tehničara Srbije, Beograd
T2  - Tehnika
T1  - Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies
T1  - Analiza uticaja strukture na mehanička svojstva višeslojnih tankih filmova Ni/Cu za primenu u mikroelektronskim tehnologijama
EP  - 920
IS  - 6
SP  - 915
VL  - 70
DO  - 10.5937/tehnika1506915L
ER  - 

@article{
author = "Lamovec, Jelena and Jović, Vesna B. and Mladenović, Ivana and Popović, Bogdan and Radojević, Vesna",
year = "2015",
abstract = "Multilayer Ni/Cu thin films were produced by dual-bath electrodeposition technique (DBT) on polycrystalline cold-rolled Cu substrate. Different Ni/Cu multilayer structures were realized by changing of process parameters such as total film thickness, sublayer thickness and Ni/Cu sublayer thickness ratio. The mechanical properties of Vickers microhardness and interfacial adhesion in the films were investigated. Decreasing of sublayer thickness down to 300 nm and increasing of Ni:Cu sublayer thickness ratio to 1:4, lead to higher values of Vickers microhardness compared to monolayer metal films. Thin films with sublayer thicknesses from 75 nm to 5 μm show strong interfacial adhesion. A weak adhesion and sublayer exfoliation for the films with sublayer thickness greater than 5μm were found. Three-dimensional Ni microstructures can be fabricated using multilayer Ni/Cu film by selective etching of Cu layers in an acidic thiourea solution ('surface micromachining' technique)., Tehnikom elektrohemijske depozicije iz dva kupatila (dual-bath technique, DBT), dobijeni su višeslojni filmovi Ni i Cu, naizmeničnim deponovanjem na polikristalni, hladno-valjani bakarni supstrat. Različite strukture Ni/Cu višeslojnih filmova su ostvarene promenom procesnih parametara kao što su ukupna debljina filma, debljina pojedinačnog sloja u filmu i odnos debljina pojedinačnih slojeva Ni i Cu u filmu. Ispitana su mehanička svojstva mikrotvrdoće po Vikersu i adhezije filma na supstratu i kontaktnim površinama slojeva u filmu. Smanjenjem debljine pojedinačnog sloja do 300 nm i povećanjem odnosa debljina slojeva Ni:Cu na 1:4, došlo se do višestrukog povećanja vrednosti Vikersove mikrotvrdoće u odnosu na jednoslojne metalne filmove. Tanki slojevi Ni i Cu sa debljinom od 75 nm do 5 μm pokazuju dobru međuslojnu adheziju. Filmovi sa debljinom slojeva većom od 5 μm, nemaju dobru međuslojnu adheziju i uočava se delaminacija (razdvajanje) slojeva. Sve strukture višeslojnih filmova Ni i Cu se mogu primeniti za izradu trodimenzionalnih MEMS struktura od Ni, metodom selektivnog nagrizanja slojeva Cu u kiselom rastvoru tiouree tehnikom 'površinskog mikromašinstva'.",
publisher = "Savez inženjera i tehničara Srbije, Beograd",
journal = "Tehnika",
title = "Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies, Analiza uticaja strukture na mehanička svojstva višeslojnih tankih filmova Ni/Cu za primenu u mikroelektronskim tehnologijama",
pages = "920-915",
number = "6",
volume = "70",
doi = "10.5937/tehnika1506915L"
}

Lamovec, J., Jović, V. B., Mladenović, I., Popović, B.,& Radojević, V.. (2015). Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies. in Tehnika
Savez inženjera i tehničara Srbije, Beograd., 70(6), 915-920.
https://doi.org/10.5937/tehnika1506915L

Lamovec J, Jović VB, Mladenović I, Popović B, Radojević V. Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies. in Tehnika. 2015;70(6):915-920.
doi:10.5937/tehnika1506915L .

Lamovec, Jelena, Jović, Vesna B., Mladenović, Ivana, Popović, Bogdan, Radojević, Vesna, "Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies" in Tehnika, 70, no. 6 (2015):915-920,
https://doi.org/10.5937/tehnika1506915L . .

TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Sarajlić, Milija
AU  - Radojević, Vesna
PY  - 2014
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2716
AB  - Nickel and copper thin films were alternately electrodeposited from sulphamate and sulphate-based electrolytes respectively, on different substrates: polycrystalline cold rolled copper, single crystal (111)-oriented Si and 100 mu m-thick electrodeposited nickel films. Electrodeposition of layers at a very narrow spacing contribute to high strength of the composites. The influence of the substrate and plating conditions on the mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Composite hardness models were applied to the experimental data in order to obtaine absolute film hardness.
PB  - IEEE, New York
C3  - 2014 29th International Conference on Microelectronics Proceedings - MIEL 2014
T1  - Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems
EP  - 186
SP  - 183
UR  - https://hdl.handle.net/21.15107/rcub_technorep_2716
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Sarajlić, Milija and Radojević, Vesna",
year = "2014",
abstract = "Nickel and copper thin films were alternately electrodeposited from sulphamate and sulphate-based electrolytes respectively, on different substrates: polycrystalline cold rolled copper, single crystal (111)-oriented Si and 100 mu m-thick electrodeposited nickel films. Electrodeposition of layers at a very narrow spacing contribute to high strength of the composites. The influence of the substrate and plating conditions on the mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Composite hardness models were applied to the experimental data in order to obtaine absolute film hardness.",
publisher = "IEEE, New York",
journal = "2014 29th International Conference on Microelectronics Proceedings - MIEL 2014",
title = "Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems",
pages = "186-183",
url = "https://hdl.handle.net/21.15107/rcub_technorep_2716"
}

Lamovec, J., Jović, V., Mladenović, I., Sarajlić, M.,& Radojević, V.. (2014). Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems. in 2014 29th International Conference on Microelectronics Proceedings - MIEL 2014
IEEE, New York., 183-186.
https://hdl.handle.net/21.15107/rcub_technorep_2716

Lamovec J, Jović V, Mladenović I, Sarajlić M, Radojević V. Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems. in 2014 29th International Conference on Microelectronics Proceedings - MIEL 2014. 2014;:183-186.
https://hdl.handle.net/21.15107/rcub_technorep_2716 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Sarajlić, Milija, Radojević, Vesna, "Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems" in 2014 29th International Conference on Microelectronics Proceedings - MIEL 2014 (2014):183-186,
https://hdl.handle.net/21.15107/rcub_technorep_2716 .

TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Popović, Bogdan
AU  - Radojević, Vesna
PY  - 2014
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2563
AB  - Thin metallic multilayer films consisting of nanometer layer thickness deposited on different substrates have shown promising mechanical, electrical and magnetical properties, especially for applications in fabrication of microelectromechanical (MEMS) structures and wear-resistant applications. Electrodeposition of Ni/Cu multilayer films on substrates of (111)-oriented single crystal Si and 100μm-thick electrodeposited Ni film was carried out using dual-bath technique (DBT). The current density values was maintained at 10 mA cm-2 and projected thickness of deposit was 5μm. Vickers microhardness of Ni/Cu thin multilayer films was investigated. The substrate starts to contribute the measured hardness at penetration depths of the order of 0.07 - 0.20 times the film thickness. The measured “composite hardness” is a complex value that depends on the microstructure and the hardness of the film and the substrate and their relative differences. Ni/Cu films on (111)-oriented Si wafer and 100μm-thick electrodeposited Ni film as the substrates can be thought as “soft film on hard substrate” composite systems. Chicot-Lesage model based on the model for reinforced composites can be applied to experimental data for all specimen and the film hardness was calculated for each indentation diagonal. The values obtained for the film hardness HF are not constant for all types of these composite systems, but influenced by the applied load.
PB  - Belgrade : Military Technical Institute
C3  - Proceedings - 6th International scientific conference on defensive technologies-proceedings, Belgrad
T1  - Effect of substrate type on microhardness of multilayer thin film composite system
EP  - 683
SP  - 680
UR  - https://hdl.handle.net/21.15107/rcub_technorep_2563
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Popović, Bogdan and Radojević, Vesna",
year = "2014",
abstract = "Thin metallic multilayer films consisting of nanometer layer thickness deposited on different substrates have shown promising mechanical, electrical and magnetical properties, especially for applications in fabrication of microelectromechanical (MEMS) structures and wear-resistant applications. Electrodeposition of Ni/Cu multilayer films on substrates of (111)-oriented single crystal Si and 100μm-thick electrodeposited Ni film was carried out using dual-bath technique (DBT). The current density values was maintained at 10 mA cm-2 and projected thickness of deposit was 5μm. Vickers microhardness of Ni/Cu thin multilayer films was investigated. The substrate starts to contribute the measured hardness at penetration depths of the order of 0.07 - 0.20 times the film thickness. The measured “composite hardness” is a complex value that depends on the microstructure and the hardness of the film and the substrate and their relative differences. Ni/Cu films on (111)-oriented Si wafer and 100μm-thick electrodeposited Ni film as the substrates can be thought as “soft film on hard substrate” composite systems. Chicot-Lesage model based on the model for reinforced composites can be applied to experimental data for all specimen and the film hardness was calculated for each indentation diagonal. The values obtained for the film hardness HF are not constant for all types of these composite systems, but influenced by the applied load.",
publisher = "Belgrade : Military Technical Institute",
journal = "Proceedings - 6th International scientific conference on defensive technologies-proceedings, Belgrad",
title = "Effect of substrate type on microhardness of multilayer thin film composite system",
pages = "683-680",
url = "https://hdl.handle.net/21.15107/rcub_technorep_2563"
}

Lamovec, J., Jović, V., Mladenović, I., Popović, B.,& Radojević, V.. (2014). Effect of substrate type on microhardness of multilayer thin film composite system. in Proceedings - 6th International scientific conference on defensive technologies-proceedings, Belgrad
Belgrade : Military Technical Institute., 680-683.
https://hdl.handle.net/21.15107/rcub_technorep_2563

Lamovec J, Jović V, Mladenović I, Popović B, Radojević V. Effect of substrate type on microhardness of multilayer thin film composite system. in Proceedings - 6th International scientific conference on defensive technologies-proceedings, Belgrad. 2014;:680-683.
https://hdl.handle.net/21.15107/rcub_technorep_2563 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Popović, Bogdan, Radojević, Vesna, "Effect of substrate type on microhardness of multilayer thin film composite system" in Proceedings - 6th International scientific conference on defensive technologies-proceedings, Belgrad (2014):680-683,
https://hdl.handle.net/21.15107/rcub_technorep_2563 .

TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Vorkapić, Miloš
AU  - Popović, Bogdan
AU  - Radojević, Vesna
PY  - 2012
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2175
AB  - Different composite systems of electrodeposited monolayered and multilayered thin metal films of Ni and Cu on cold-rolled copper substrates were made. Thin metal layers were deposited at narrow spacing of 300 nm and 150 nm and high strength of composites was obtained. Microhardness analysis was performed on the systems of ED Ni film (sulphate "Slotonik 20" electrolyte) / ED Cu film (sulphate electrolyte), ED Ni film (sulphamate electrolyte) / ED Cu film (sulphate electrolyte) and ED Ni film (sulphamate electrolyte) /ED Ni film ("Slotonik 20" electrolyte). Characterization of mechanical properties of the composite systems was done using Vickers microhardness testing with loads ranging from 0.049 N to 1.96 N. Dependence of microhardness for different composite systems on microstructure and Ni/Cu and Ni/Ni layer thickness ratio was investigated. Composite hardness model of Korsunsky was applied to the experimental data in order to determine the absolute composite film hardness. The highest value of all the composite film hardness values was obtained for the system of multilayered Ni films from two different electrolytes, and "Slotonik 20" and sulphamate and with sublayer thickness ratio 1:2, respectively.
PB  - IEEE, New York
C3  - 2012 28th International Conference on Microelectronics (MIEL)
T1  - Comparative Microhardness Analysis of Various Thin Metallic Multilayer Composite Films
EP  - 146
SP  - 143
UR  - https://hdl.handle.net/21.15107/rcub_technorep_2175
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Vorkapić, Miloš and Popović, Bogdan and Radojević, Vesna",
year = "2012",
abstract = "Different composite systems of electrodeposited monolayered and multilayered thin metal films of Ni and Cu on cold-rolled copper substrates were made. Thin metal layers were deposited at narrow spacing of 300 nm and 150 nm and high strength of composites was obtained. Microhardness analysis was performed on the systems of ED Ni film (sulphate "Slotonik 20" electrolyte) / ED Cu film (sulphate electrolyte), ED Ni film (sulphamate electrolyte) / ED Cu film (sulphate electrolyte) and ED Ni film (sulphamate electrolyte) /ED Ni film ("Slotonik 20" electrolyte). Characterization of mechanical properties of the composite systems was done using Vickers microhardness testing with loads ranging from 0.049 N to 1.96 N. Dependence of microhardness for different composite systems on microstructure and Ni/Cu and Ni/Ni layer thickness ratio was investigated. Composite hardness model of Korsunsky was applied to the experimental data in order to determine the absolute composite film hardness. The highest value of all the composite film hardness values was obtained for the system of multilayered Ni films from two different electrolytes, and "Slotonik 20" and sulphamate and with sublayer thickness ratio 1:2, respectively.",
publisher = "IEEE, New York",
journal = "2012 28th International Conference on Microelectronics (MIEL)",
title = "Comparative Microhardness Analysis of Various Thin Metallic Multilayer Composite Films",
pages = "146-143",
url = "https://hdl.handle.net/21.15107/rcub_technorep_2175"
}

Lamovec, J., Jović, V., Mladenović, I., Vorkapić, M., Popović, B.,& Radojević, V.. (2012). Comparative Microhardness Analysis of Various Thin Metallic Multilayer Composite Films. in 2012 28th International Conference on Microelectronics (MIEL)
IEEE, New York., 143-146.
https://hdl.handle.net/21.15107/rcub_technorep_2175

Lamovec J, Jović V, Mladenović I, Vorkapić M, Popović B, Radojević V. Comparative Microhardness Analysis of Various Thin Metallic Multilayer Composite Films. in 2012 28th International Conference on Microelectronics (MIEL). 2012;:143-146.
https://hdl.handle.net/21.15107/rcub_technorep_2175 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Vorkapić, Miloš, Popović, Bogdan, Radojević, Vesna, "Comparative Microhardness Analysis of Various Thin Metallic Multilayer Composite Films" in 2012 28th International Conference on Microelectronics (MIEL) (2012):143-146,
https://hdl.handle.net/21.15107/rcub_technorep_2175 .

TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Sarajlić, Milija
AU  - Radojević, Vesna
PY  - 2012
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2014
AB  - Thin Ni and Cu films with fine-grained structures have been electrodeposited from self-made sulphamate-based and sulphate-based electrolytes, respectively. DC electrodeposition of Ni films was performed on single crystal Si wafers with different orientations named (100) and (111), and electrodeposition of Cu films was performed on massive electrodeposited Ni films as the substrates. In order to investigate the influence of the microstructure of the substrates and Ni and Cu thin films on mechanical properties of these composite structures, Vickers microhardness testing for different loads was done. For any composite system of thin film on a substrate, there is a critical indentation depth,1 when a measured hardness value is not the hardness of the electrodeposited film, but the so-called "composite hardness", because the substrate also participates in the plastic deformations during the indentation process. Composite hardness model of Chicot-Lesage was chosen and applied to the experimental data in order to analyse and determine the absolute film hardness. Further analysis of work hardening parameter (t/d)m, that can express the difference in tendency of the composite hardness with the indentation load, was performed for the above-mentioned composite systems.
PB  - Belgrade : Military Technical Institute
C3  - Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad
T1  - Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films
EP  - 575
SP  - 570
UR  - https://hdl.handle.net/21.15107/rcub_technorep_2014
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Sarajlić, Milija and Radojević, Vesna",
year = "2012",
abstract = "Thin Ni and Cu films with fine-grained structures have been electrodeposited from self-made sulphamate-based and sulphate-based electrolytes, respectively. DC electrodeposition of Ni films was performed on single crystal Si wafers with different orientations named (100) and (111), and electrodeposition of Cu films was performed on massive electrodeposited Ni films as the substrates. In order to investigate the influence of the microstructure of the substrates and Ni and Cu thin films on mechanical properties of these composite structures, Vickers microhardness testing for different loads was done. For any composite system of thin film on a substrate, there is a critical indentation depth,1 when a measured hardness value is not the hardness of the electrodeposited film, but the so-called "composite hardness", because the substrate also participates in the plastic deformations during the indentation process. Composite hardness model of Chicot-Lesage was chosen and applied to the experimental data in order to analyse and determine the absolute film hardness. Further analysis of work hardening parameter (t/d)m, that can express the difference in tendency of the composite hardness with the indentation load, was performed for the above-mentioned composite systems.",
publisher = "Belgrade : Military Technical Institute",
journal = "Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad",
title = "Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films",
pages = "575-570",
url = "https://hdl.handle.net/21.15107/rcub_technorep_2014"
}

Lamovec, J., Jović, V., Mladenović, I., Sarajlić, M.,& Radojević, V.. (2012). Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films. in Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad
Belgrade : Military Technical Institute., 570-575.
https://hdl.handle.net/21.15107/rcub_technorep_2014

Lamovec J, Jović V, Mladenović I, Sarajlić M, Radojević V. Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films. in Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad. 2012;:570-575.
https://hdl.handle.net/21.15107/rcub_technorep_2014 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Sarajlić, Milija, Radojević, Vesna, "Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films" in Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad (2012):570-575,
https://hdl.handle.net/21.15107/rcub_technorep_2014 .

TY  - JOUR
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Vorkapić, Miloš
AU  - Radojević, Vesna
AU  - Aleksić, Radoslav
PY  - 2012
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2028
AB  - Fine-grained nickel and copper thin films were electrodeposited (ED) from self-made sulphamate and sulphate electrolytes, respectively, on different substrates. The substrates were single crystal silicon with two different orientations, namely (100) and (111) and bulk electrodeposited Ni films. Nickel films on Si substrate and ED Cu films on bulk ED Ni substrate can be thought as composite systems of 'soft film on hard substrate' type. The influence of the substrate layer and chosen plating conditions on mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Above a certain critical penetration depth, a measured hardness value is not the hardness of the electrodeposited film, but the so-called 'composite hardness', because the substrate also participates in the plastic deformations during the indentation process. Composite hardness models of Jonsson-Hogmark (J-H), Burnett-Rickerby (B-R) and Korsunsky (K) do not fit experimental data for this type of composite system well. Chicot-Lesage (C-L) model based on the model for reinforced composites can be applied to experimental data even for the thick coatings (50 mm). Model (C-L) for reinforced composites was chosen for all specimen and the film hardness was calculated, for each indentation diagonal. The values obtained for the film hardness HF are influenced by the applied load. In case of the system of ED Ni film on Si substrate, film hardness lines have descending character, but in case of the ED Cu film on bulk ED Ni substrate, the film hardness increases. The variations should be related to physical phenomena such as the indentation size effect, the cracking in the neighborhood of the indent, the elastic contribution of the substrate for the lowest loads, or the crushing of the film for the highest loads.
AB  - Elektrohemijskim taloženjem (ET) tankih filmova Ni i Cu na različitim podlogama, monokristalnom silicijumu orijentacija (100) i (111) i masivnom elektrohemijski istaloženom filmu Ni, formirani su kompozitni sistemi tipa 'mekog filma na tvrdoj podlozi'. Sitnozrni talozi Ni i Cu su bili dobijeni iz dva različita elektrolita pod odabranim uslovima elektrolize, Ni iz sulfamatnog i Cu iz sulfatnog elektrolita.U cilju određivanja mehaničkih svojstava ovih kompozitnih sistema, i posebno, određivanja svojstava filmova u okviru sistema, izvršena su merenja mikrotvrdoće utiskivanjem po Vikersovoj metodi za različita opterećenja. Izmerena vrednost mikrotvrdoće opisuje kompozitni sistem u celini i naziva se 'kompozitnom mikrotvrdoćom'. Ona ne predstavlja apsolutnu tvrdoću elektrohemijski istaloženog filma zbog učešća podloge u plastičnoj deformaciji tokom utiskivanja. Model Šiko-Lezaža (Chicot-Lesage) se pokazao odgovarajućim za analizu apsolutne tvrdoće tankih filmova za kompozitne sisteme 'mek film na tvrdoj podlozi' i primenjen je na eksperimentalne rezultate.
PB  - Savez inženjera i tehničara Srbije, Beograd
T2  - Tehnika
T1  - Micromechanical properties of composite systems consisting of electrodeposited nickel coatings on different substrates
T1  - Mikromehanička svojstva kompozitnih sistema formiranih elektrohemijskim taloženjem filmova nikla i bakra na različitim podlogama
EP  - 15
IS  - 1
SP  - 9
VL  - 67
UR  - https://hdl.handle.net/21.15107/rcub_technorep_2028
ER  - 

@article{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Vorkapić, Miloš and Radojević, Vesna and Aleksić, Radoslav",
year = "2012",
abstract = "Fine-grained nickel and copper thin films were electrodeposited (ED) from self-made sulphamate and sulphate electrolytes, respectively, on different substrates. The substrates were single crystal silicon with two different orientations, namely (100) and (111) and bulk electrodeposited Ni films. Nickel films on Si substrate and ED Cu films on bulk ED Ni substrate can be thought as composite systems of 'soft film on hard substrate' type. The influence of the substrate layer and chosen plating conditions on mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Above a certain critical penetration depth, a measured hardness value is not the hardness of the electrodeposited film, but the so-called 'composite hardness', because the substrate also participates in the plastic deformations during the indentation process. Composite hardness models of Jonsson-Hogmark (J-H), Burnett-Rickerby (B-R) and Korsunsky (K) do not fit experimental data for this type of composite system well. Chicot-Lesage (C-L) model based on the model for reinforced composites can be applied to experimental data even for the thick coatings (50 mm). Model (C-L) for reinforced composites was chosen for all specimen and the film hardness was calculated, for each indentation diagonal. The values obtained for the film hardness HF are influenced by the applied load. In case of the system of ED Ni film on Si substrate, film hardness lines have descending character, but in case of the ED Cu film on bulk ED Ni substrate, the film hardness increases. The variations should be related to physical phenomena such as the indentation size effect, the cracking in the neighborhood of the indent, the elastic contribution of the substrate for the lowest loads, or the crushing of the film for the highest loads., Elektrohemijskim taloženjem (ET) tankih filmova Ni i Cu na različitim podlogama, monokristalnom silicijumu orijentacija (100) i (111) i masivnom elektrohemijski istaloženom filmu Ni, formirani su kompozitni sistemi tipa 'mekog filma na tvrdoj podlozi'. Sitnozrni talozi Ni i Cu su bili dobijeni iz dva različita elektrolita pod odabranim uslovima elektrolize, Ni iz sulfamatnog i Cu iz sulfatnog elektrolita.U cilju određivanja mehaničkih svojstava ovih kompozitnih sistema, i posebno, određivanja svojstava filmova u okviru sistema, izvršena su merenja mikrotvrdoće utiskivanjem po Vikersovoj metodi za različita opterećenja. Izmerena vrednost mikrotvrdoće opisuje kompozitni sistem u celini i naziva se 'kompozitnom mikrotvrdoćom'. Ona ne predstavlja apsolutnu tvrdoću elektrohemijski istaloženog filma zbog učešća podloge u plastičnoj deformaciji tokom utiskivanja. Model Šiko-Lezaža (Chicot-Lesage) se pokazao odgovarajućim za analizu apsolutne tvrdoće tankih filmova za kompozitne sisteme 'mek film na tvrdoj podlozi' i primenjen je na eksperimentalne rezultate.",
publisher = "Savez inženjera i tehničara Srbije, Beograd",
journal = "Tehnika",
title = "Micromechanical properties of composite systems consisting of electrodeposited nickel coatings on different substrates, Mikromehanička svojstva kompozitnih sistema formiranih elektrohemijskim taloženjem filmova nikla i bakra na različitim podlogama",
pages = "15-9",
number = "1",
volume = "67",
url = "https://hdl.handle.net/21.15107/rcub_technorep_2028"
}

Lamovec, J., Jović, V., Mladenović, I., Vorkapić, M., Radojević, V.,& Aleksić, R.. (2012). Micromechanical properties of composite systems consisting of electrodeposited nickel coatings on different substrates. in Tehnika
Savez inženjera i tehničara Srbije, Beograd., 67(1), 9-15.
https://hdl.handle.net/21.15107/rcub_technorep_2028

Lamovec J, Jović V, Mladenović I, Vorkapić M, Radojević V, Aleksić R. Micromechanical properties of composite systems consisting of electrodeposited nickel coatings on different substrates. in Tehnika. 2012;67(1):9-15.
https://hdl.handle.net/21.15107/rcub_technorep_2028 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Vorkapić, Miloš, Radojević, Vesna, Aleksić, Radoslav, "Micromechanical properties of composite systems consisting of electrodeposited nickel coatings on different substrates" in Tehnika, 67, no. 1 (2012):9-15,
https://hdl.handle.net/21.15107/rcub_technorep_2028 .

TY  - JOUR
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Vorkapić, Miloš
AU  - Radojević, Vesna
AU  - Aleksić, Radoslav
PY  - 2012
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/1966
AB  - Fine-grained nickel and copper thin films were electrodeposited (ED) from self-made sulphamate and sulphate electrolytes, respectively, on different substrates. The substrates were single crystal silicon with two different orientations, namely (100) and (111) and bulk electrodeposited Ni films. Nickel films on Si substrate and ED Cu films on bulk ED Ni substrate can be thought as composite systems of 'soft film on hard substrate' type. The influence of the substrate layer and chosen plating conditions on mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Above a certain critical penetration depth, a measured hardness value is not the hardness of the electrodeposited film, but the so-called 'composite hardness', because the substrate also participates in the plastic deformations during the indentation process. Composite hardness models of Jonsson-Hogmark (J-H), Burnett-Rickerby (B-R) and Korsunsky (K) do not fit experimental data for this type of composite system well. Chicot-Lesage (C-L) model based on the model for reinforced composites can be applied to experimental data even for the thick coatings (50 mm). Model (C-L) for reinforced composites was chosen for all specimen and the film hardness was calculated, for each indentation diagonal. The values obtained for the film hardness HF are influenced by the applied load. In case of the system of ED Ni film on Si substrate, film hardness lines have descending character, but in case of the ED Cu film on bulk ED Ni substrate, the film hardness increases. The variations should be related to physical phenomena such as the indentation size effect, the cracking in the neighborhood of the indent, the elastic contribution of the substrate for the lowest loads, or the crushing of the film for the highest loads.
AB  - Elektrohemijskim taloženjem (ET) tankih filmova Ni i Cu na različitim podlogama, monokristalnom silicijumu orijentacija (100) i (111) i masivnom elektrohemijski istaloženom filmu Ni, formirani su kompozitni sistemi tipa 'mekog filma na tvrdoj podlozi'. Sitnozrni talozi Ni i Cu su bili dobijeni iz dva različita elektrolita pod odabranim uslovima elektrolize, Ni iz sulfamatnog i Cu iz sulfatnog elektrolita.U cilju određivanja mehaničkih svojstava ovih kompozitnih sistema, i posebno, određivanja svojstava filmova u okviru sistema, izvršena su merenja mikrotvrdoće utiskivanjem po Vikersovoj metodi za različita opterećenja. Izmerena vrednost mikrotvrdoće opisuje kompozitni sistem u celini i naziva se 'kompozitnom mikrotvrdoćom'. Ona ne predstavlja apsolutnu tvrdoću elektrohemijski istaloženog filma zbog učešća podloge u plastičnoj deformaciji tokom utiskivanja. Model Šiko-Lezaža (Chicot-Lesage) se pokazao odgovarajućim za analizu apsolutne tvrdoće tankih filmova za kompozitne sisteme 'mek film na tvrdoj podlozi' i primenjen je na eksperimentalne rezultate.
PB  - Savez inženjera i tehničara Srbije, Beograd
T2  - Tehnika
T1  - Micromechanical properties of composite systems consisting of electrodeposited nickel coatings on different substrates
T1  - Mikromehanička svojstva kompozitnih sistema formiranih elektrohemijskim taloženjem filmova nikla i bakra na različitim podlogama
EP  - 15
IS  - 1
SP  - 9
VL  - 67
UR  - https://hdl.handle.net/21.15107/rcub_technorep_1966
ER  - 

@article{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Vorkapić, Miloš and Radojević, Vesna and Aleksić, Radoslav",
year = "2012",
abstract = "Fine-grained nickel and copper thin films were electrodeposited (ED) from self-made sulphamate and sulphate electrolytes, respectively, on different substrates. The substrates were single crystal silicon with two different orientations, namely (100) and (111) and bulk electrodeposited Ni films. Nickel films on Si substrate and ED Cu films on bulk ED Ni substrate can be thought as composite systems of 'soft film on hard substrate' type. The influence of the substrate layer and chosen plating conditions on mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Above a certain critical penetration depth, a measured hardness value is not the hardness of the electrodeposited film, but the so-called 'composite hardness', because the substrate also participates in the plastic deformations during the indentation process. Composite hardness models of Jonsson-Hogmark (J-H), Burnett-Rickerby (B-R) and Korsunsky (K) do not fit experimental data for this type of composite system well. Chicot-Lesage (C-L) model based on the model for reinforced composites can be applied to experimental data even for the thick coatings (50 mm). Model (C-L) for reinforced composites was chosen for all specimen and the film hardness was calculated, for each indentation diagonal. The values obtained for the film hardness HF are influenced by the applied load. In case of the system of ED Ni film on Si substrate, film hardness lines have descending character, but in case of the ED Cu film on bulk ED Ni substrate, the film hardness increases. The variations should be related to physical phenomena such as the indentation size effect, the cracking in the neighborhood of the indent, the elastic contribution of the substrate for the lowest loads, or the crushing of the film for the highest loads., Elektrohemijskim taloženjem (ET) tankih filmova Ni i Cu na različitim podlogama, monokristalnom silicijumu orijentacija (100) i (111) i masivnom elektrohemijski istaloženom filmu Ni, formirani su kompozitni sistemi tipa 'mekog filma na tvrdoj podlozi'. Sitnozrni talozi Ni i Cu su bili dobijeni iz dva različita elektrolita pod odabranim uslovima elektrolize, Ni iz sulfamatnog i Cu iz sulfatnog elektrolita.U cilju određivanja mehaničkih svojstava ovih kompozitnih sistema, i posebno, određivanja svojstava filmova u okviru sistema, izvršena su merenja mikrotvrdoće utiskivanjem po Vikersovoj metodi za različita opterećenja. Izmerena vrednost mikrotvrdoće opisuje kompozitni sistem u celini i naziva se 'kompozitnom mikrotvrdoćom'. Ona ne predstavlja apsolutnu tvrdoću elektrohemijski istaloženog filma zbog učešća podloge u plastičnoj deformaciji tokom utiskivanja. Model Šiko-Lezaža (Chicot-Lesage) se pokazao odgovarajućim za analizu apsolutne tvrdoće tankih filmova za kompozitne sisteme 'mek film na tvrdoj podlozi' i primenjen je na eksperimentalne rezultate.",
publisher = "Savez inženjera i tehničara Srbije, Beograd",
journal = "Tehnika",
title = "Micromechanical properties of composite systems consisting of electrodeposited nickel coatings on different substrates, Mikromehanička svojstva kompozitnih sistema formiranih elektrohemijskim taloženjem filmova nikla i bakra na različitim podlogama",
pages = "15-9",
number = "1",
volume = "67",
url = "https://hdl.handle.net/21.15107/rcub_technorep_1966"
}

Lamovec, J., Jović, V., Mladenović, I., Vorkapić, M., Radojević, V.,& Aleksić, R.. (2012). Micromechanical properties of composite systems consisting of electrodeposited nickel coatings on different substrates. in Tehnika
Savez inženjera i tehničara Srbije, Beograd., 67(1), 9-15.
https://hdl.handle.net/21.15107/rcub_technorep_1966

Lamovec J, Jović V, Mladenović I, Vorkapić M, Radojević V, Aleksić R. Micromechanical properties of composite systems consisting of electrodeposited nickel coatings on different substrates. in Tehnika. 2012;67(1):9-15.
https://hdl.handle.net/21.15107/rcub_technorep_1966 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Vorkapić, Miloš, Radojević, Vesna, Aleksić, Radoslav, "Micromechanical properties of composite systems consisting of electrodeposited nickel coatings on different substrates" in Tehnika, 67, no. 1 (2012):9-15,
https://hdl.handle.net/21.15107/rcub_technorep_1966 .