Pavlović, M. G.

Link to this page

Authority KeyName Variants
9322d66a-ca6f-4d8f-969e-5fed0f239823
  • Pavlović, M. G. (1)
  • Pavlović, M.G. (1)
Projects

Author's Bibliography

Corrosion stability of electrochemically deposited Zn-Mn alloy coatings

Tomić, M. V.; Bučko, M. M.; Pavlović, M. G.; Bajat, J. B.

(Academy of Sciences and Arts of Republic of Srpska, 2010)

TY  - JOUR
AU  - Tomić, M. V.
AU  - Bučko, M. M.
AU  - Pavlović, M. G.
AU  - Bajat, J. B.
PY  - 2010
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/6154
AB  - Zinc alloy coatings electrochemically deposited on steel from electrolytes with different components differ in their composition, homogeneity, porosity, structure and other characteristics that affect their corrosion resistance. Manganese is characterized by a very negative electrochemical potential and very high strength, prompting many researchers to study Zn-Mn alloys for the anti-corrosion purposes in the industry, especially automotive. In this work it was examined the influence of the type of the electrolyte deposition on the current efficiency during electrodeposition of Zn-Mn alloys. Zn-Mn alloys were deposited on steel from chloride, sulphate and pyrophosphate plating baths at different current densities. We have examined the influence of deposition current density on the current efficiency during electrodeposition, appearance of alloy coatings, as well as their corrosion stability. It was shown that Zn-Mn alloys with the best corrosion properties, among all examined ones, were obtained from chloride plating bath at 2 A dm-2.
AB  - Превлаке легура цинка електрохемијски добијене из електролита са различитим компонентама имају разлике у свом саставу, хомогености, порозности, структури и другим карактеристикама које утичу на њихову корозиону отпорност. Манган се одликује јако негативним електрохемијским потенцијалом и јако великом чврстоћом, што је навело многе истраживаче на испитивања легуре Zn-Mn у антикорозионе сврхе, за потребе у индустрији, нарочито аутомобилској. У овом раду испитиван је утицај врсте електролита на таложење Zn-Mn легура, као и на искоришћење струје приликом електрохемијског таложења. Легуре су таложене на челику из хлоридног, сулфатног и пирофосфатног електролита различитим густинама струје. При задатим условима таложења испитиван је хемијски састав, храпавост, изглед превлака легура, и њиховa корозиона стабилност. Показано је да највећу корозиону стабилност имају легуре добијене таложењем из хлоридног електролита густином струје од
2 A dm-2.
PB  - Academy of Sciences and Arts of Republic of Srpska
T2  - Contemporary Materials
T1  - Corrosion stability of electrochemically deposited Zn-Mn alloy coatings
T1  - Корозиона стабилност превлака Zn-Mn легура добијених електрохемијским путем
EP  - 93
IS  - 1
SP  - 87
VL  - 1
DO  - 10.5767/anurs.cmat.100101.en.087T
ER  - 
@article{
author = "Tomić, M. V. and Bučko, M. M. and Pavlović, M. G. and Bajat, J. B.",
year = "2010",
abstract = "Zinc alloy coatings electrochemically deposited on steel from electrolytes with different components differ in their composition, homogeneity, porosity, structure and other characteristics that affect their corrosion resistance. Manganese is characterized by a very negative electrochemical potential and very high strength, prompting many researchers to study Zn-Mn alloys for the anti-corrosion purposes in the industry, especially automotive. In this work it was examined the influence of the type of the electrolyte deposition on the current efficiency during electrodeposition of Zn-Mn alloys. Zn-Mn alloys were deposited on steel from chloride, sulphate and pyrophosphate plating baths at different current densities. We have examined the influence of deposition current density on the current efficiency during electrodeposition, appearance of alloy coatings, as well as their corrosion stability. It was shown that Zn-Mn alloys with the best corrosion properties, among all examined ones, were obtained from chloride plating bath at 2 A dm-2., Превлаке легура цинка електрохемијски добијене из електролита са различитим компонентама имају разлике у свом саставу, хомогености, порозности, структури и другим карактеристикама које утичу на њихову корозиону отпорност. Манган се одликује јако негативним електрохемијским потенцијалом и јако великом чврстоћом, што је навело многе истраживаче на испитивања легуре Zn-Mn у антикорозионе сврхе, за потребе у индустрији, нарочито аутомобилској. У овом раду испитиван је утицај врсте електролита на таложење Zn-Mn легура, као и на искоришћење струје приликом електрохемијског таложења. Легуре су таложене на челику из хлоридног, сулфатног и пирофосфатног електролита различитим густинама струје. При задатим условима таложења испитиван је хемијски састав, храпавост, изглед превлака легура, и њиховa корозиона стабилност. Показано је да највећу корозиону стабилност имају легуре добијене таложењем из хлоридног електролита густином струје од
2 A dm-2.",
publisher = "Academy of Sciences and Arts of Republic of Srpska",
journal = "Contemporary Materials",
title = "Corrosion stability of electrochemically deposited Zn-Mn alloy coatings, Корозиона стабилност превлака Zn-Mn легура добијених електрохемијским путем",
pages = "93-87",
number = "1",
volume = "1",
doi = "10.5767/anurs.cmat.100101.en.087T"
}
Tomić, M. V., Bučko, M. M., Pavlović, M. G.,& Bajat, J. B.. (2010). Corrosion stability of electrochemically deposited Zn-Mn alloy coatings. in Contemporary Materials
Academy of Sciences and Arts of Republic of Srpska., 1(1), 87-93.
https://doi.org/10.5767/anurs.cmat.100101.en.087T
Tomić MV, Bučko MM, Pavlović MG, Bajat JB. Corrosion stability of electrochemically deposited Zn-Mn alloy coatings. in Contemporary Materials. 2010;1(1):87-93.
doi:10.5767/anurs.cmat.100101.en.087T .
Tomić, M. V., Bučko, M. M., Pavlović, M. G., Bajat, J. B., "Corrosion stability of electrochemically deposited Zn-Mn alloy coatings" in Contemporary Materials, 1, no. 1 (2010):87-93,
https://doi.org/10.5767/anurs.cmat.100101.en.087T . .
16

Formation of dish-like holes and a channel structure in electrodeposition of copper under hydrogen co-deposition

Nikolić, N.D.; Pavlović, Lj.J.; Pavlović, M.G.; Popov, Konstantin I.

(Elsevier, 2007)

TY  - JOUR
AU  - Nikolić, N.D.
AU  - Pavlović, Lj.J.
AU  - Pavlović, M.G.
AU  - Popov, Konstantin I.
PY  - 2007
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/5509
AB  - Copper electrodeposition from acid sulfate solutions at an overpotential of 1000 mV, which is about 250 mV outside the plateau of the limiting diffusion current density, was examined by the determination of the average current efficiency of hydrogen evolution and by the scanning electron microscopic (SEM) analysis of the morphology of the formed copper deposits. Craters or holes formed due to the attachment hydrogen bubbles were the dominant morphological forms of copper deposits obtained at this overpotential. In dependence of the concentration of Cu (II) ions in the plating solution, the two types of holes or craters were formed. One type of holes is obtained by electrodeposition from a solution with a concentration of Cu (II) ions of 0.075 M CuSO4 in 0.50 M H2SO4, and a honeycomb-like structure was formed from these holes. The other types of holes are formed from a solution with a higher concentration of Cu (II) ions (0.60 M CuSO4 in 0.50 M H2SO4) and the formed holes were dish-like. A mixture of both types of holes was obtained by electrodeposition from 0.30 M CuSO4 in 0.50 M H2SO4. The obtained morphologies of copper deposits are discussed in terms of the effect of hydrogen evolution on the hydrodynamic conditions in the plating solution.
PB  - Elsevier
T2  - Electrochimica Acta
T1  - Formation of dish-like holes and a channel structure in electrodeposition of copper under hydrogen co-deposition
EP  - 8104
IS  - 28
SP  - 8096
VL  - 52
DO  - 10.1016/j.electacta.2007.07.008
ER  - 
@article{
author = "Nikolić, N.D. and Pavlović, Lj.J. and Pavlović, M.G. and Popov, Konstantin I.",
year = "2007",
abstract = "Copper electrodeposition from acid sulfate solutions at an overpotential of 1000 mV, which is about 250 mV outside the plateau of the limiting diffusion current density, was examined by the determination of the average current efficiency of hydrogen evolution and by the scanning electron microscopic (SEM) analysis of the morphology of the formed copper deposits. Craters or holes formed due to the attachment hydrogen bubbles were the dominant morphological forms of copper deposits obtained at this overpotential. In dependence of the concentration of Cu (II) ions in the plating solution, the two types of holes or craters were formed. One type of holes is obtained by electrodeposition from a solution with a concentration of Cu (II) ions of 0.075 M CuSO4 in 0.50 M H2SO4, and a honeycomb-like structure was formed from these holes. The other types of holes are formed from a solution with a higher concentration of Cu (II) ions (0.60 M CuSO4 in 0.50 M H2SO4) and the formed holes were dish-like. A mixture of both types of holes was obtained by electrodeposition from 0.30 M CuSO4 in 0.50 M H2SO4. The obtained morphologies of copper deposits are discussed in terms of the effect of hydrogen evolution on the hydrodynamic conditions in the plating solution.",
publisher = "Elsevier",
journal = "Electrochimica Acta",
title = "Formation of dish-like holes and a channel structure in electrodeposition of copper under hydrogen co-deposition",
pages = "8104-8096",
number = "28",
volume = "52",
doi = "10.1016/j.electacta.2007.07.008"
}
Nikolić, N.D., Pavlović, Lj.J., Pavlović, M.G.,& Popov, K. I.. (2007). Formation of dish-like holes and a channel structure in electrodeposition of copper under hydrogen co-deposition. in Electrochimica Acta
Elsevier., 52(28), 8096-8104.
https://doi.org/10.1016/j.electacta.2007.07.008
Nikolić N, Pavlović L, Pavlović M, Popov KI. Formation of dish-like holes and a channel structure in electrodeposition of copper under hydrogen co-deposition. in Electrochimica Acta. 2007;52(28):8096-8104.
doi:10.1016/j.electacta.2007.07.008 .
Nikolić, N.D., Pavlović, Lj.J., Pavlović, M.G., Popov, Konstantin I., "Formation of dish-like holes and a channel structure in electrodeposition of copper under hydrogen co-deposition" in Electrochimica Acta, 52, no. 28 (2007):8096-8104,
https://doi.org/10.1016/j.electacta.2007.07.008 . .
3
87
79
87