TY  - JOUR
AU  - Mladenovic, Ivana O.
AU  - Nikolić, Nebojša D.
AU  - Lamovec, Jelena S.
AU  - Vasiljevic-Radovic, Dana
AU  - Radojević, Vesna
PY  - 2021
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/4949
AB  - The mechanical characteristics of electrochemically deposited copper coatings have been examined by application of two hardness composite models: the Chicot-Lesage (C-L) and the Cheng-Gao (C-G) models. The 10, 20, 40 and 60 mu m thick fine-grained Cu coatings were electrodeposited on the brass by the regime of pulsating current (PC) at an average current density of 50 mA cm(-2), and were characterized by scanning electron (SEM), atomic force (AFM) and optical (OM) microscopes. By application of the C-L model we determined a limiting relative indentation depth (RID) value that separates the area of the coating hardness from that with a strong effect of the substrate on the measured composite hardness. The coating hardness values in the 0.9418-1.1399 GPa range, obtained by the C-G model, confirmed the assumption that the Cu coatings on the brass belongs to the "soft film on hard substrate" composite hardness system. The obtained stress exponents in the 4.35-7.69 range at an applied load of 0.49 N indicated that the dominant creep mechanism is the dislocation creep and the dislocation climb. The obtained mechanical characteristics were compared with those recently obtained on the Si(111) substrate, and the effects of substrate characteristics such as hardness and roughness on the mechanical characteristics of the electrodeposited Cu coatings were discussed and explained.
T2  - Metals
T1  - Application of the Composite Hardness Models in the Analysis of Mechanical Characteristics of Electrolytically Deposited Copper Coatings: The Effect of the Type of Substrate
IS  - 1
VL  - 11
DO  - 10.3390/met11010111
ER  - 

@article{
author = "Mladenovic, Ivana O. and Nikolić, Nebojša D. and Lamovec, Jelena S. and Vasiljevic-Radovic, Dana and Radojević, Vesna",
year = "2021",
abstract = "The mechanical characteristics of electrochemically deposited copper coatings have been examined by application of two hardness composite models: the Chicot-Lesage (C-L) and the Cheng-Gao (C-G) models. The 10, 20, 40 and 60 mu m thick fine-grained Cu coatings were electrodeposited on the brass by the regime of pulsating current (PC) at an average current density of 50 mA cm(-2), and were characterized by scanning electron (SEM), atomic force (AFM) and optical (OM) microscopes. By application of the C-L model we determined a limiting relative indentation depth (RID) value that separates the area of the coating hardness from that with a strong effect of the substrate on the measured composite hardness. The coating hardness values in the 0.9418-1.1399 GPa range, obtained by the C-G model, confirmed the assumption that the Cu coatings on the brass belongs to the "soft film on hard substrate" composite hardness system. The obtained stress exponents in the 4.35-7.69 range at an applied load of 0.49 N indicated that the dominant creep mechanism is the dislocation creep and the dislocation climb. The obtained mechanical characteristics were compared with those recently obtained on the Si(111) substrate, and the effects of substrate characteristics such as hardness and roughness on the mechanical characteristics of the electrodeposited Cu coatings were discussed and explained.",
journal = "Metals",
title = "Application of the Composite Hardness Models in the Analysis of Mechanical Characteristics of Electrolytically Deposited Copper Coatings: The Effect of the Type of Substrate",
number = "1",
volume = "11",
doi = "10.3390/met11010111"
}

Mladenovic, I. O., Nikolić, N. D., Lamovec, J. S., Vasiljevic-Radovic, D.,& Radojević, V.. (2021). Application of the Composite Hardness Models in the Analysis of Mechanical Characteristics of Electrolytically Deposited Copper Coatings: The Effect of the Type of Substrate. in Metals, 11(1).
https://doi.org/10.3390/met11010111

Mladenovic IO, Nikolić ND, Lamovec JS, Vasiljevic-Radovic D, Radojević V. Application of the Composite Hardness Models in the Analysis of Mechanical Characteristics of Electrolytically Deposited Copper Coatings: The Effect of the Type of Substrate. in Metals. 2021;11(1).
doi:10.3390/met11010111 .

Mladenovic, Ivana O., Nikolić, Nebojša D., Lamovec, Jelena S., Vasiljevic-Radovic, Dana, Radojević, Vesna, "Application of the Composite Hardness Models in the Analysis of Mechanical Characteristics of Electrolytically Deposited Copper Coatings: The Effect of the Type of Substrate" in Metals, 11, no. 1 (2021),
https://doi.org/10.3390/met11010111 . .

TY  - JOUR
AU  - Antić, Katarina
AU  - Onjia, Antonije
AU  - Vasiljevic-Radovic, Dana
AU  - Veličković, Zlate
AU  - Tomić, Simonida
PY  - 2021
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/4784
AB  - The adsorption of Ni2+ ions from water solutions by using hydrogels based on 2-hydroxyethyl acrylate (HEA) and itaconic acid (IA) was studied. Hydrogel synthesis was optimized with response surface methodology (RSM). The hydrogel with the best adsorption capacity towards Ni2+ ions was chosen for further experiments. The hydrogel was characterized by Fourier transform infrared spectroscopy (FTIR), scanning electron microscopy (SEM) and atomic force microscopy (AFM) analysis before and after the adsorption of Ni2+ ions. Batch equilibrium experiments were conducted to investigate the influence of solution pH, hydrogel weight, ionic strength, adsorption time, temperature and initial concentration of nickel ions on the adsorption. Time-dependent adsorption fitted the best to the pseudo-second-order kinetic model. A thermodynamic study revealed that the adsorption was an exothermic and non-spontaneous process. Five isotherm models were studied, and the best fit was obtained with the Redlich-Peterson model. Consecutive adsorption/desorption studies indicated that the HEA/IA hydrogel can be efficiently used as a sorbent for the removal of Ni2+ ions from the water solution. This study develops a potential adsorbent for the effective removal of trace nickel ions.
T2  - Gels
T1  - Removal of Nickel Ions from Aqueous Solutions by 2-Hydroxyethyl Acrylate/Itaconic Acid Hydrogels Optimized with Response Surface Methodology
IS  - 4
VL  - 7
DO  - 10.3390/gels7040225
ER  - 

@article{
author = "Antić, Katarina and Onjia, Antonije and Vasiljevic-Radovic, Dana and Veličković, Zlate and Tomić, Simonida",
year = "2021",
abstract = "The adsorption of Ni2+ ions from water solutions by using hydrogels based on 2-hydroxyethyl acrylate (HEA) and itaconic acid (IA) was studied. Hydrogel synthesis was optimized with response surface methodology (RSM). The hydrogel with the best adsorption capacity towards Ni2+ ions was chosen for further experiments. The hydrogel was characterized by Fourier transform infrared spectroscopy (FTIR), scanning electron microscopy (SEM) and atomic force microscopy (AFM) analysis before and after the adsorption of Ni2+ ions. Batch equilibrium experiments were conducted to investigate the influence of solution pH, hydrogel weight, ionic strength, adsorption time, temperature and initial concentration of nickel ions on the adsorption. Time-dependent adsorption fitted the best to the pseudo-second-order kinetic model. A thermodynamic study revealed that the adsorption was an exothermic and non-spontaneous process. Five isotherm models were studied, and the best fit was obtained with the Redlich-Peterson model. Consecutive adsorption/desorption studies indicated that the HEA/IA hydrogel can be efficiently used as a sorbent for the removal of Ni2+ ions from the water solution. This study develops a potential adsorbent for the effective removal of trace nickel ions.",
journal = "Gels",
title = "Removal of Nickel Ions from Aqueous Solutions by 2-Hydroxyethyl Acrylate/Itaconic Acid Hydrogels Optimized with Response Surface Methodology",
number = "4",
volume = "7",
doi = "10.3390/gels7040225"
}

Antić, K., Onjia, A., Vasiljevic-Radovic, D., Veličković, Z.,& Tomić, S.. (2021). Removal of Nickel Ions from Aqueous Solutions by 2-Hydroxyethyl Acrylate/Itaconic Acid Hydrogels Optimized with Response Surface Methodology. in Gels, 7(4).
https://doi.org/10.3390/gels7040225

Antić K, Onjia A, Vasiljevic-Radovic D, Veličković Z, Tomić S. Removal of Nickel Ions from Aqueous Solutions by 2-Hydroxyethyl Acrylate/Itaconic Acid Hydrogels Optimized with Response Surface Methodology. in Gels. 2021;7(4).
doi:10.3390/gels7040225 .

Antić, Katarina, Onjia, Antonije, Vasiljevic-Radovic, Dana, Veličković, Zlate, Tomić, Simonida, "Removal of Nickel Ions from Aqueous Solutions by 2-Hydroxyethyl Acrylate/Itaconic Acid Hydrogels Optimized with Response Surface Methodology" in Gels, 7, no. 4 (2021),
https://doi.org/10.3390/gels7040225 . .

TY  - JOUR
AU  - Mladenovic, Ivana O.
AU  - Lamovec, Jelena S.
AU  - Vasiljevic-Radovic, Dana G.
AU  - Radojević, Vesna
AU  - Nikolić, Nebojša D.
PY  - 2020
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/4739
AB  - Mechanical features of the Cu coatings produced by the pulsating current (PC) regime on Si(111) substrate have been investigated. The Cu coatings were electrodeposited by varying duty cycle (15-50 %) and keeping the current density amplitude constant (100 mA cm(-2)), and by keeping duty cycle constant (50 %) but varying the current density amplitude value (80-120 mA cm(-2)). The scanning electron microscopy (SEM) and optical microscopy (OM) techniques showed that morphology of the coatings changed with increasing the duty cycle from those with large and well defined grains to uniform and compact fine-grained coatings. The Vickers microindentation technique was used for an examination of hardness applying the Chen-Gao (C-G) composite hardness model and indentation creep features of the Cu coatings. The obtained values of hardness for the Cu coatings on Si(111) in the 0.9069-1.5079 GPa range indicated the successful implementation of the C-G model for this "soft film on hard substrate" composite system. The obtained stress exponents ranging from 2.79 to 5.29 indicated that creep mechanism changed from grain boundary sliding to both dislocation climbs and dislocation creep with decreasing duty cycle values. The maximum hardness and minimum stress exponent was obtained for the fine-grained Cu coating produced with a duty cycle of 50 % and the current density amplitude of 100 mA cm(-2), indicating that its plastic deformation during microindentation was primarily caused by grain boundary sliding. Optimization of process formation and mechanical features of the Cu coatings was made using Response Surface Methodology (RSM), and error of 3.2 % showed a good agreement between predicted and measured values.
T2  - International Journal of Electrochemical Science
T1  - Mechanical features of copper coatings electrodeposited by the pulsating current (PC) regime on Si(111) substrate
EP  - 12191
IS  - 12
SP  - 12173
VL  - 15
DO  - 10.20964/2020.12.01
ER  - 

@article{
author = "Mladenovic, Ivana O. and Lamovec, Jelena S. and Vasiljevic-Radovic, Dana G. and Radojević, Vesna and Nikolić, Nebojša D.",
year = "2020",
abstract = "Mechanical features of the Cu coatings produced by the pulsating current (PC) regime on Si(111) substrate have been investigated. The Cu coatings were electrodeposited by varying duty cycle (15-50 %) and keeping the current density amplitude constant (100 mA cm(-2)), and by keeping duty cycle constant (50 %) but varying the current density amplitude value (80-120 mA cm(-2)). The scanning electron microscopy (SEM) and optical microscopy (OM) techniques showed that morphology of the coatings changed with increasing the duty cycle from those with large and well defined grains to uniform and compact fine-grained coatings. The Vickers microindentation technique was used for an examination of hardness applying the Chen-Gao (C-G) composite hardness model and indentation creep features of the Cu coatings. The obtained values of hardness for the Cu coatings on Si(111) in the 0.9069-1.5079 GPa range indicated the successful implementation of the C-G model for this "soft film on hard substrate" composite system. The obtained stress exponents ranging from 2.79 to 5.29 indicated that creep mechanism changed from grain boundary sliding to both dislocation climbs and dislocation creep with decreasing duty cycle values. The maximum hardness and minimum stress exponent was obtained for the fine-grained Cu coating produced with a duty cycle of 50 % and the current density amplitude of 100 mA cm(-2), indicating that its plastic deformation during microindentation was primarily caused by grain boundary sliding. Optimization of process formation and mechanical features of the Cu coatings was made using Response Surface Methodology (RSM), and error of 3.2 % showed a good agreement between predicted and measured values.",
journal = "International Journal of Electrochemical Science",
title = "Mechanical features of copper coatings electrodeposited by the pulsating current (PC) regime on Si(111) substrate",
pages = "12191-12173",
number = "12",
volume = "15",
doi = "10.20964/2020.12.01"
}

Mladenovic, I. O., Lamovec, J. S., Vasiljevic-Radovic, D. G., Radojević, V.,& Nikolić, N. D.. (2020). Mechanical features of copper coatings electrodeposited by the pulsating current (PC) regime on Si(111) substrate. in International Journal of Electrochemical Science, 15(12), 12173-12191.
https://doi.org/10.20964/2020.12.01

Mladenovic IO, Lamovec JS, Vasiljevic-Radovic DG, Radojević V, Nikolić ND. Mechanical features of copper coatings electrodeposited by the pulsating current (PC) regime on Si(111) substrate. in International Journal of Electrochemical Science. 2020;15(12):12173-12191.
doi:10.20964/2020.12.01 .

Mladenovic, Ivana O., Lamovec, Jelena S., Vasiljevic-Radovic, Dana G., Radojević, Vesna, Nikolić, Nebojša D., "Mechanical features of copper coatings electrodeposited by the pulsating current (PC) regime on Si(111) substrate" in International Journal of Electrochemical Science, 15, no. 12 (2020):12173-12191,
https://doi.org/10.20964/2020.12.01 . .