TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Radojević, Vesna
AU  - Jaćimovski, Stevo
AU  - Popović, Bogdan
PY  - 2018
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/3765
AB  - Alternate electrodeposition of ordinary and ultrasonic-assisted Ni layers on polycrystalline copper substrates and single-crystal (100)-oriented silicon wafers was used for the formation of composite systems with nickel thin multilayer films. The hardness and adhesion properties of these composite systems were characterized using Vickers microhardness test, with different loads. Dependence of composite microhardness and film adhesion on type of substrate and layer thickness was investigated. Model of Korsunsky, Chicot-Lesage and Chen-Gao were chosen and applied to experimental data for obtaining the film hardness and adhesion evaluation, respectively. It is confirmed that in comparison with the conventional electrodeposited Ni films, the mechanical properties of the ultrasonic-assisted multilayer Ni films are improved. The microhardness and adhesion of the films are enhanced by introduction of ultrasound and by reducing the layer thickness in the film.
PB  - Belgrade : Military Technical Institute
C3  - Proceedings - 8th International scientific conference on defensive technologies-proceedings, Belgrad
T1  - Characterization of nickel thin multilayer films electrodeposited under different agitation conditions
EP  - 426
SP  - 421
UR  - https://hdl.handle.net/21.15107/rcub_technorep_3765
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Radojević, Vesna and Jaćimovski, Stevo and Popović, Bogdan",
year = "2018",
abstract = "Alternate electrodeposition of ordinary and ultrasonic-assisted Ni layers on polycrystalline copper substrates and single-crystal (100)-oriented silicon wafers was used for the formation of composite systems with nickel thin multilayer films. The hardness and adhesion properties of these composite systems were characterized using Vickers microhardness test, with different loads. Dependence of composite microhardness and film adhesion on type of substrate and layer thickness was investigated. Model of Korsunsky, Chicot-Lesage and Chen-Gao were chosen and applied to experimental data for obtaining the film hardness and adhesion evaluation, respectively. It is confirmed that in comparison with the conventional electrodeposited Ni films, the mechanical properties of the ultrasonic-assisted multilayer Ni films are improved. The microhardness and adhesion of the films are enhanced by introduction of ultrasound and by reducing the layer thickness in the film.",
publisher = "Belgrade : Military Technical Institute",
journal = "Proceedings - 8th International scientific conference on defensive technologies-proceedings, Belgrad",
title = "Characterization of nickel thin multilayer films electrodeposited under different agitation conditions",
pages = "426-421",
url = "https://hdl.handle.net/21.15107/rcub_technorep_3765"
}

Lamovec, J., Jović, V., Mladenović, I., Radojević, V., Jaćimovski, S.,& Popović, B.. (2018). Characterization of nickel thin multilayer films electrodeposited under different agitation conditions. in Proceedings - 8th International scientific conference on defensive technologies-proceedings, Belgrad
Belgrade : Military Technical Institute., 421-426.
https://hdl.handle.net/21.15107/rcub_technorep_3765

Lamovec J, Jović V, Mladenović I, Radojević V, Jaćimovski S, Popović B. Characterization of nickel thin multilayer films electrodeposited under different agitation conditions. in Proceedings - 8th International scientific conference on defensive technologies-proceedings, Belgrad. 2018;:421-426.
https://hdl.handle.net/21.15107/rcub_technorep_3765 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Radojević, Vesna, Jaćimovski, Stevo, Popović, Bogdan, "Characterization of nickel thin multilayer films electrodeposited under different agitation conditions" in Proceedings - 8th International scientific conference on defensive technologies-proceedings, Belgrad (2018):421-426,
https://hdl.handle.net/21.15107/rcub_technorep_3765 .

TY  - CONF
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Popović, Bogdan
AU  - Vorkapić, Miloš
AU  - Radojević, Vesna
PY  - 2017
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/3485
AB  - Microhardness test is the most commonly used method for assessing the mechanical properties of thin films.This testing method uses controlled contact at a single point of an indenter and chosen material which induces the plastic deformation in material under indenter. The measured hardness is considered as the composite hardness, because the substrate participates in the plastic deformation caused by indentation. This research has been carried out in order to analyze and compare the hardness response of different composite systems consist of monolayer electrodeposited copper thin film on brass and steel alloys as the substrates. The influence of the electrodeposition parameters and of the substrate on the hardness and interlayer adhesion were investigated by Vickers microhardness testing for different load.
PB  - Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering
C3  - Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic
T1  - Hardness response and adhesion of thin copper films on alloy substrates
EP  - MOI1.3.6
SP  - MOI1.3.1
UR  - https://hdl.handle.net/21.15107/rcub_technorep_3485
ER  - 

@conference{
author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Popović, Bogdan and Vorkapić, Miloš and Radojević, Vesna",
year = "2017",
abstract = "Microhardness test is the most commonly used method for assessing the mechanical properties of thin films.This testing method uses controlled contact at a single point of an indenter and chosen material which induces the plastic deformation in material under indenter. The measured hardness is considered as the composite hardness, because the substrate participates in the plastic deformation caused by indentation. This research has been carried out in order to analyze and compare the hardness response of different composite systems consist of monolayer electrodeposited copper thin film on brass and steel alloys as the substrates. The influence of the electrodeposition parameters and of the substrate on the hardness and interlayer adhesion were investigated by Vickers microhardness testing for different load.",
publisher = "Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering",
journal = "Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic",
title = "Hardness response and adhesion of thin copper films on alloy substrates",
pages = "MOI1.3.6-MOI1.3.1",
url = "https://hdl.handle.net/21.15107/rcub_technorep_3485"
}

Mladenović, I., Lamovec, J., Jović, V., Popović, B., Vorkapić, M.,& Radojević, V.. (2017). Hardness response and adhesion of thin copper films on alloy substrates. in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic
Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering., MOI1.3.1-MOI1.3.6.
https://hdl.handle.net/21.15107/rcub_technorep_3485

Mladenović I, Lamovec J, Jović V, Popović B, Vorkapić M, Radojević V. Hardness response and adhesion of thin copper films on alloy substrates. in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic. 2017;:MOI1.3.1-MOI1.3.6.
https://hdl.handle.net/21.15107/rcub_technorep_3485 .

Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Popović, Bogdan, Vorkapić, Miloš, Radojević, Vesna, "Hardness response and adhesion of thin copper films on alloy substrates" in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic (2017):MOI1.3.1-MOI1.3.6,
https://hdl.handle.net/21.15107/rcub_technorep_3485 .

TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Popović, Bogdan
AU  - Vorkapić, Miloš
AU  - Radojević, Vesna
PY  - 2016
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/3174
AB  - Composite systems of monolayered electrodeposited Ni and Cu thin films (5-10 μm) on monocrystalline Si wafers and 50 μm-thick electrodeposited Ni film as the substrates were fabricated. On the basis of their difference in hardness, these systems can be thought of as “soft film on hard substrate” composite systems. Adhesion of electrodeposited films on different substrates was investigated by Vickers microindentation hardness testing. Strong adhesion corresponds to extended plastic deformation zone at the film/substrate interface. Interfacial tension effects contribute to the measured hardness. Composite hardness models of Chicot-Lesage (C-L) and Chen-Gao (C-G) were applied in order to investigate the influence of adhesion on microhardness test results. When adhesion exists between the film and the substrate, the critical reduced depth (the ratio between the radius of the plastic zone beneath the indent and the indentation depth) increases. Microhardness measurements are useful tool for assessment and quantification of the film/substrate interface strength.
PB  - Belgrade : Military Technical Institute
C3  - Proceedings - 7th International scientific conference on defensive technologies-proceedings, Belgrad
T1  - On the correlation of microhardness with the film adhesion for “soft film on hard substrate” composite system
EP  - 540
SP  - 536
UR  - https://hdl.handle.net/21.15107/rcub_technorep_3174
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Popović, Bogdan and Vorkapić, Miloš and Radojević, Vesna",
year = "2016",
abstract = "Composite systems of monolayered electrodeposited Ni and Cu thin films (5-10 μm) on monocrystalline Si wafers and 50 μm-thick electrodeposited Ni film as the substrates were fabricated. On the basis of their difference in hardness, these systems can be thought of as “soft film on hard substrate” composite systems. Adhesion of electrodeposited films on different substrates was investigated by Vickers microindentation hardness testing. Strong adhesion corresponds to extended plastic deformation zone at the film/substrate interface. Interfacial tension effects contribute to the measured hardness. Composite hardness models of Chicot-Lesage (C-L) and Chen-Gao (C-G) were applied in order to investigate the influence of adhesion on microhardness test results. When adhesion exists between the film and the substrate, the critical reduced depth (the ratio between the radius of the plastic zone beneath the indent and the indentation depth) increases. Microhardness measurements are useful tool for assessment and quantification of the film/substrate interface strength.",
publisher = "Belgrade : Military Technical Institute",
journal = "Proceedings - 7th International scientific conference on defensive technologies-proceedings, Belgrad",
title = "On the correlation of microhardness with the film adhesion for “soft film on hard substrate” composite system",
pages = "540-536",
url = "https://hdl.handle.net/21.15107/rcub_technorep_3174"
}

Lamovec, J., Jović, V., Mladenović, I., Popović, B., Vorkapić, M.,& Radojević, V.. (2016). On the correlation of microhardness with the film adhesion for “soft film on hard substrate” composite system. in Proceedings - 7th International scientific conference on defensive technologies-proceedings, Belgrad
Belgrade : Military Technical Institute., 536-540.
https://hdl.handle.net/21.15107/rcub_technorep_3174

Lamovec J, Jović V, Mladenović I, Popović B, Vorkapić M, Radojević V. On the correlation of microhardness with the film adhesion for “soft film on hard substrate” composite system. in Proceedings - 7th International scientific conference on defensive technologies-proceedings, Belgrad. 2016;:536-540.
https://hdl.handle.net/21.15107/rcub_technorep_3174 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Popović, Bogdan, Vorkapić, Miloš, Radojević, Vesna, "On the correlation of microhardness with the film adhesion for “soft film on hard substrate” composite system" in Proceedings - 7th International scientific conference on defensive technologies-proceedings, Belgrad (2016):536-540,
https://hdl.handle.net/21.15107/rcub_technorep_3174 .

TY  - JOUR
AU  - Lamovec, Jelena
AU  - Jović, Vesna B.
AU  - Mladenović, Ivana
AU  - Popović, Bogdan
AU  - Radojević, Vesna
PY  - 2015
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2928
AB  - Multilayer Ni/Cu thin films were produced by dual-bath electrodeposition technique (DBT) on polycrystalline cold-rolled Cu substrate. Different Ni/Cu multilayer structures were realized by changing of process parameters such as total film thickness, sublayer thickness and Ni/Cu sublayer thickness ratio. The mechanical properties of Vickers microhardness and interfacial adhesion in the films were investigated. Decreasing of sublayer thickness down to 300 nm and increasing of Ni:Cu sublayer thickness ratio to 1:4, lead to higher values of Vickers microhardness compared to monolayer metal films. Thin films with sublayer thicknesses from 75 nm to 5 μm show strong interfacial adhesion. A weak adhesion and sublayer exfoliation for the films with sublayer thickness greater than 5μm were found. Three-dimensional Ni microstructures can be fabricated using multilayer Ni/Cu film by selective etching of Cu layers in an acidic thiourea solution ('surface micromachining' technique).
AB  - Tehnikom elektrohemijske depozicije iz dva kupatila (dual-bath technique, DBT), dobijeni su višeslojni filmovi Ni i Cu, naizmeničnim deponovanjem na polikristalni, hladno-valjani bakarni supstrat. Različite strukture Ni/Cu višeslojnih filmova su ostvarene promenom procesnih parametara kao što su ukupna debljina filma, debljina pojedinačnog sloja u filmu i odnos debljina pojedinačnih slojeva Ni i Cu u filmu. Ispitana su mehanička svojstva mikrotvrdoće po Vikersu i adhezije filma na supstratu i kontaktnim površinama slojeva u filmu. Smanjenjem debljine pojedinačnog sloja do 300 nm i povećanjem odnosa debljina slojeva Ni:Cu na 1:4, došlo se do višestrukog povećanja vrednosti Vikersove mikrotvrdoće u odnosu na jednoslojne metalne filmove. Tanki slojevi Ni i Cu sa debljinom od 75 nm do 5 μm pokazuju dobru međuslojnu adheziju. Filmovi sa debljinom slojeva većom od 5 μm, nemaju dobru međuslojnu adheziju i uočava se delaminacija (razdvajanje) slojeva. Sve strukture višeslojnih filmova Ni i Cu se mogu primeniti za izradu trodimenzionalnih MEMS struktura od Ni, metodom selektivnog nagrizanja slojeva Cu u kiselom rastvoru tiouree tehnikom 'površinskog mikromašinstva'.
PB  - Savez inženjera i tehničara Srbije, Beograd
T2  - Tehnika
T1  - Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies
T1  - Analiza uticaja strukture na mehanička svojstva višeslojnih tankih filmova Ni/Cu za primenu u mikroelektronskim tehnologijama
EP  - 920
IS  - 6
SP  - 915
VL  - 70
DO  - 10.5937/tehnika1506915L
ER  - 

@article{
author = "Lamovec, Jelena and Jović, Vesna B. and Mladenović, Ivana and Popović, Bogdan and Radojević, Vesna",
year = "2015",
abstract = "Multilayer Ni/Cu thin films were produced by dual-bath electrodeposition technique (DBT) on polycrystalline cold-rolled Cu substrate. Different Ni/Cu multilayer structures were realized by changing of process parameters such as total film thickness, sublayer thickness and Ni/Cu sublayer thickness ratio. The mechanical properties of Vickers microhardness and interfacial adhesion in the films were investigated. Decreasing of sublayer thickness down to 300 nm and increasing of Ni:Cu sublayer thickness ratio to 1:4, lead to higher values of Vickers microhardness compared to monolayer metal films. Thin films with sublayer thicknesses from 75 nm to 5 μm show strong interfacial adhesion. A weak adhesion and sublayer exfoliation for the films with sublayer thickness greater than 5μm were found. Three-dimensional Ni microstructures can be fabricated using multilayer Ni/Cu film by selective etching of Cu layers in an acidic thiourea solution ('surface micromachining' technique)., Tehnikom elektrohemijske depozicije iz dva kupatila (dual-bath technique, DBT), dobijeni su višeslojni filmovi Ni i Cu, naizmeničnim deponovanjem na polikristalni, hladno-valjani bakarni supstrat. Različite strukture Ni/Cu višeslojnih filmova su ostvarene promenom procesnih parametara kao što su ukupna debljina filma, debljina pojedinačnog sloja u filmu i odnos debljina pojedinačnih slojeva Ni i Cu u filmu. Ispitana su mehanička svojstva mikrotvrdoće po Vikersu i adhezije filma na supstratu i kontaktnim površinama slojeva u filmu. Smanjenjem debljine pojedinačnog sloja do 300 nm i povećanjem odnosa debljina slojeva Ni:Cu na 1:4, došlo se do višestrukog povećanja vrednosti Vikersove mikrotvrdoće u odnosu na jednoslojne metalne filmove. Tanki slojevi Ni i Cu sa debljinom od 75 nm do 5 μm pokazuju dobru međuslojnu adheziju. Filmovi sa debljinom slojeva većom od 5 μm, nemaju dobru međuslojnu adheziju i uočava se delaminacija (razdvajanje) slojeva. Sve strukture višeslojnih filmova Ni i Cu se mogu primeniti za izradu trodimenzionalnih MEMS struktura od Ni, metodom selektivnog nagrizanja slojeva Cu u kiselom rastvoru tiouree tehnikom 'površinskog mikromašinstva'.",
publisher = "Savez inženjera i tehničara Srbije, Beograd",
journal = "Tehnika",
title = "Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies, Analiza uticaja strukture na mehanička svojstva višeslojnih tankih filmova Ni/Cu za primenu u mikroelektronskim tehnologijama",
pages = "920-915",
number = "6",
volume = "70",
doi = "10.5937/tehnika1506915L"
}

Lamovec, J., Jović, V. B., Mladenović, I., Popović, B.,& Radojević, V.. (2015). Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies. in Tehnika
Savez inženjera i tehničara Srbije, Beograd., 70(6), 915-920.
https://doi.org/10.5937/tehnika1506915L

Lamovec J, Jović VB, Mladenović I, Popović B, Radojević V. Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies. in Tehnika. 2015;70(6):915-920.
doi:10.5937/tehnika1506915L .

Lamovec, Jelena, Jović, Vesna B., Mladenović, Ivana, Popović, Bogdan, Radojević, Vesna, "Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies" in Tehnika, 70, no. 6 (2015):915-920,
https://doi.org/10.5937/tehnika1506915L . .

TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Popović, Bogdan
AU  - Radojević, Vesna
PY  - 2014
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2563
AB  - Thin metallic multilayer films consisting of nanometer layer thickness deposited on different substrates have shown promising mechanical, electrical and magnetical properties, especially for applications in fabrication of microelectromechanical (MEMS) structures and wear-resistant applications. Electrodeposition of Ni/Cu multilayer films on substrates of (111)-oriented single crystal Si and 100μm-thick electrodeposited Ni film was carried out using dual-bath technique (DBT). The current density values was maintained at 10 mA cm-2 and projected thickness of deposit was 5μm. Vickers microhardness of Ni/Cu thin multilayer films was investigated. The substrate starts to contribute the measured hardness at penetration depths of the order of 0.07 - 0.20 times the film thickness. The measured “composite hardness” is a complex value that depends on the microstructure and the hardness of the film and the substrate and their relative differences. Ni/Cu films on (111)-oriented Si wafer and 100μm-thick electrodeposited Ni film as the substrates can be thought as “soft film on hard substrate” composite systems. Chicot-Lesage model based on the model for reinforced composites can be applied to experimental data for all specimen and the film hardness was calculated for each indentation diagonal. The values obtained for the film hardness HF are not constant for all types of these composite systems, but influenced by the applied load.
PB  - Belgrade : Military Technical Institute
C3  - Proceedings - 6th International scientific conference on defensive technologies-proceedings, Belgrad
T1  - Effect of substrate type on microhardness of multilayer thin film composite system
EP  - 683
SP  - 680
UR  - https://hdl.handle.net/21.15107/rcub_technorep_2563
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Popović, Bogdan and Radojević, Vesna",
year = "2014",
abstract = "Thin metallic multilayer films consisting of nanometer layer thickness deposited on different substrates have shown promising mechanical, electrical and magnetical properties, especially for applications in fabrication of microelectromechanical (MEMS) structures and wear-resistant applications. Electrodeposition of Ni/Cu multilayer films on substrates of (111)-oriented single crystal Si and 100μm-thick electrodeposited Ni film was carried out using dual-bath technique (DBT). The current density values was maintained at 10 mA cm-2 and projected thickness of deposit was 5μm. Vickers microhardness of Ni/Cu thin multilayer films was investigated. The substrate starts to contribute the measured hardness at penetration depths of the order of 0.07 - 0.20 times the film thickness. The measured “composite hardness” is a complex value that depends on the microstructure and the hardness of the film and the substrate and their relative differences. Ni/Cu films on (111)-oriented Si wafer and 100μm-thick electrodeposited Ni film as the substrates can be thought as “soft film on hard substrate” composite systems. Chicot-Lesage model based on the model for reinforced composites can be applied to experimental data for all specimen and the film hardness was calculated for each indentation diagonal. The values obtained for the film hardness HF are not constant for all types of these composite systems, but influenced by the applied load.",
publisher = "Belgrade : Military Technical Institute",
journal = "Proceedings - 6th International scientific conference on defensive technologies-proceedings, Belgrad",
title = "Effect of substrate type on microhardness of multilayer thin film composite system",
pages = "683-680",
url = "https://hdl.handle.net/21.15107/rcub_technorep_2563"
}

Lamovec, J., Jović, V., Mladenović, I., Popović, B.,& Radojević, V.. (2014). Effect of substrate type on microhardness of multilayer thin film composite system. in Proceedings - 6th International scientific conference on defensive technologies-proceedings, Belgrad
Belgrade : Military Technical Institute., 680-683.
https://hdl.handle.net/21.15107/rcub_technorep_2563

Lamovec J, Jović V, Mladenović I, Popović B, Radojević V. Effect of substrate type on microhardness of multilayer thin film composite system. in Proceedings - 6th International scientific conference on defensive technologies-proceedings, Belgrad. 2014;:680-683.
https://hdl.handle.net/21.15107/rcub_technorep_2563 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Popović, Bogdan, Radojević, Vesna, "Effect of substrate type on microhardness of multilayer thin film composite system" in Proceedings - 6th International scientific conference on defensive technologies-proceedings, Belgrad (2014):680-683,
https://hdl.handle.net/21.15107/rcub_technorep_2563 .

TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Vorkapić, Miloš
AU  - Popović, Bogdan
AU  - Radojević, Vesna
PY  - 2012
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2175
AB  - Different composite systems of electrodeposited monolayered and multilayered thin metal films of Ni and Cu on cold-rolled copper substrates were made. Thin metal layers were deposited at narrow spacing of 300 nm and 150 nm and high strength of composites was obtained. Microhardness analysis was performed on the systems of ED Ni film (sulphate "Slotonik 20" electrolyte) / ED Cu film (sulphate electrolyte), ED Ni film (sulphamate electrolyte) / ED Cu film (sulphate electrolyte) and ED Ni film (sulphamate electrolyte) /ED Ni film ("Slotonik 20" electrolyte). Characterization of mechanical properties of the composite systems was done using Vickers microhardness testing with loads ranging from 0.049 N to 1.96 N. Dependence of microhardness for different composite systems on microstructure and Ni/Cu and Ni/Ni layer thickness ratio was investigated. Composite hardness model of Korsunsky was applied to the experimental data in order to determine the absolute composite film hardness. The highest value of all the composite film hardness values was obtained for the system of multilayered Ni films from two different electrolytes, and "Slotonik 20" and sulphamate and with sublayer thickness ratio 1:2, respectively.
PB  - IEEE, New York
C3  - 2012 28th International Conference on Microelectronics (MIEL)
T1  - Comparative Microhardness Analysis of Various Thin Metallic Multilayer Composite Films
EP  - 146
SP  - 143
UR  - https://hdl.handle.net/21.15107/rcub_technorep_2175
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Vorkapić, Miloš and Popović, Bogdan and Radojević, Vesna",
year = "2012",
abstract = "Different composite systems of electrodeposited monolayered and multilayered thin metal films of Ni and Cu on cold-rolled copper substrates were made. Thin metal layers were deposited at narrow spacing of 300 nm and 150 nm and high strength of composites was obtained. Microhardness analysis was performed on the systems of ED Ni film (sulphate "Slotonik 20" electrolyte) / ED Cu film (sulphate electrolyte), ED Ni film (sulphamate electrolyte) / ED Cu film (sulphate electrolyte) and ED Ni film (sulphamate electrolyte) /ED Ni film ("Slotonik 20" electrolyte). Characterization of mechanical properties of the composite systems was done using Vickers microhardness testing with loads ranging from 0.049 N to 1.96 N. Dependence of microhardness for different composite systems on microstructure and Ni/Cu and Ni/Ni layer thickness ratio was investigated. Composite hardness model of Korsunsky was applied to the experimental data in order to determine the absolute composite film hardness. The highest value of all the composite film hardness values was obtained for the system of multilayered Ni films from two different electrolytes, and "Slotonik 20" and sulphamate and with sublayer thickness ratio 1:2, respectively.",
publisher = "IEEE, New York",
journal = "2012 28th International Conference on Microelectronics (MIEL)",
title = "Comparative Microhardness Analysis of Various Thin Metallic Multilayer Composite Films",
pages = "146-143",
url = "https://hdl.handle.net/21.15107/rcub_technorep_2175"
}

Lamovec, J., Jović, V., Mladenović, I., Vorkapić, M., Popović, B.,& Radojević, V.. (2012). Comparative Microhardness Analysis of Various Thin Metallic Multilayer Composite Films. in 2012 28th International Conference on Microelectronics (MIEL)
IEEE, New York., 143-146.
https://hdl.handle.net/21.15107/rcub_technorep_2175

Lamovec J, Jović V, Mladenović I, Vorkapić M, Popović B, Radojević V. Comparative Microhardness Analysis of Various Thin Metallic Multilayer Composite Films. in 2012 28th International Conference on Microelectronics (MIEL). 2012;:143-146.
https://hdl.handle.net/21.15107/rcub_technorep_2175 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Vorkapić, Miloš, Popović, Bogdan, Radojević, Vesna, "Comparative Microhardness Analysis of Various Thin Metallic Multilayer Composite Films" in 2012 28th International Conference on Microelectronics (MIEL) (2012):143-146,
https://hdl.handle.net/21.15107/rcub_technorep_2175 .

TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Popović, Bogdan
AU  - Vasiljević-Radović, Dana
AU  - Aleksić, Radoslav
AU  - Radojević, Vesna
PY  - 2010
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/1536
AB  - Multilayered composite systems of alternately electrodeposited nanocrystalline Cu and Ni films on cold-rolled microcrystalline copper substrates were fabricated. Highly-densified parallel interfaces which can give rise to high strength of composites are obtained by depositing layers at a very narrow spacing. The mechanical properties of the composite systems were characterized using Vickers microhardness testing with loads ranging from 1.96 N down to 0.049 N. Dependence of microhardness on layer thickness, Ni/Cu layer thickness ratio and total thickness of the film was investigated. The microhardness increased with decreasing the layer thickness down to 30 nm and it is consistent with the Hall-Petch relation. Composite hardness model of Korsunsky was applied to the experimental data in order to determine the composite film hardness. The highest value of all the composite film hardness values was obtained when the ratio of Ni: Cu layer thickness was 4:1.
C3  - 27th International Conference on Microelectronics, MIEL 2010 - Proceedings
T1  - Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates
EP  - 216
SP  - 213
DO  - 10.1109/MIEL.2010.5490498
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Popović, Bogdan and Vasiljević-Radović, Dana and Aleksić, Radoslav and Radojević, Vesna",
year = "2010",
abstract = "Multilayered composite systems of alternately electrodeposited nanocrystalline Cu and Ni films on cold-rolled microcrystalline copper substrates were fabricated. Highly-densified parallel interfaces which can give rise to high strength of composites are obtained by depositing layers at a very narrow spacing. The mechanical properties of the composite systems were characterized using Vickers microhardness testing with loads ranging from 1.96 N down to 0.049 N. Dependence of microhardness on layer thickness, Ni/Cu layer thickness ratio and total thickness of the film was investigated. The microhardness increased with decreasing the layer thickness down to 30 nm and it is consistent with the Hall-Petch relation. Composite hardness model of Korsunsky was applied to the experimental data in order to determine the composite film hardness. The highest value of all the composite film hardness values was obtained when the ratio of Ni: Cu layer thickness was 4:1.",
journal = "27th International Conference on Microelectronics, MIEL 2010 - Proceedings",
title = "Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates",
pages = "216-213",
doi = "10.1109/MIEL.2010.5490498"
}

Lamovec, J., Jović, V., Popović, B., Vasiljević-Radović, D., Aleksić, R.,& Radojević, V.. (2010). Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates. in 27th International Conference on Microelectronics, MIEL 2010 - Proceedings, 213-216.
https://doi.org/10.1109/MIEL.2010.5490498

Lamovec J, Jović V, Popović B, Vasiljević-Radović D, Aleksić R, Radojević V. Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates. in 27th International Conference on Microelectronics, MIEL 2010 - Proceedings. 2010;:213-216.
doi:10.1109/MIEL.2010.5490498 .

Lamovec, Jelena, Jović, Vesna, Popović, Bogdan, Vasiljević-Radović, Dana, Aleksić, Radoslav, Radojević, Vesna, "Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates" in 27th International Conference on Microelectronics, MIEL 2010 - Proceedings (2010):213-216,
https://doi.org/10.1109/MIEL.2010.5490498 . .