TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Sarajlić, Milija
AU  - Radojević, Vesna
PY  - 2014
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2716
AB  - Nickel and copper thin films were alternately electrodeposited from sulphamate and sulphate-based electrolytes respectively, on different substrates: polycrystalline cold rolled copper, single crystal (111)-oriented Si and 100 mu m-thick electrodeposited nickel films. Electrodeposition of layers at a very narrow spacing contribute to high strength of the composites. The influence of the substrate and plating conditions on the mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Composite hardness models were applied to the experimental data in order to obtaine absolute film hardness.
PB  - IEEE, New York
C3  - 2014 29th International Conference on Microelectronics Proceedings - MIEL 2014
T1  - Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems
EP  - 186
SP  - 183
UR  - https://hdl.handle.net/21.15107/rcub_technorep_2716
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Sarajlić, Milija and Radojević, Vesna",
year = "2014",
abstract = "Nickel and copper thin films were alternately electrodeposited from sulphamate and sulphate-based electrolytes respectively, on different substrates: polycrystalline cold rolled copper, single crystal (111)-oriented Si and 100 mu m-thick electrodeposited nickel films. Electrodeposition of layers at a very narrow spacing contribute to high strength of the composites. The influence of the substrate and plating conditions on the mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Composite hardness models were applied to the experimental data in order to obtaine absolute film hardness.",
publisher = "IEEE, New York",
journal = "2014 29th International Conference on Microelectronics Proceedings - MIEL 2014",
title = "Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems",
pages = "186-183",
url = "https://hdl.handle.net/21.15107/rcub_technorep_2716"
}

Lamovec, J., Jović, V., Mladenović, I., Sarajlić, M.,& Radojević, V.. (2014). Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems. in 2014 29th International Conference on Microelectronics Proceedings - MIEL 2014
IEEE, New York., 183-186.
https://hdl.handle.net/21.15107/rcub_technorep_2716

Lamovec J, Jović V, Mladenović I, Sarajlić M, Radojević V. Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems. in 2014 29th International Conference on Microelectronics Proceedings - MIEL 2014. 2014;:183-186.
https://hdl.handle.net/21.15107/rcub_technorep_2716 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Sarajlić, Milija, Radojević, Vesna, "Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems" in 2014 29th International Conference on Microelectronics Proceedings - MIEL 2014 (2014):183-186,
https://hdl.handle.net/21.15107/rcub_technorep_2716 .

TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Sarajlić, Milija
AU  - Radojević, Vesna
PY  - 2012
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2014
AB  - Thin Ni and Cu films with fine-grained structures have been electrodeposited from self-made sulphamate-based and sulphate-based electrolytes, respectively. DC electrodeposition of Ni films was performed on single crystal Si wafers with different orientations named (100) and (111), and electrodeposition of Cu films was performed on massive electrodeposited Ni films as the substrates. In order to investigate the influence of the microstructure of the substrates and Ni and Cu thin films on mechanical properties of these composite structures, Vickers microhardness testing for different loads was done. For any composite system of thin film on a substrate, there is a critical indentation depth,1 when a measured hardness value is not the hardness of the electrodeposited film, but the so-called "composite hardness", because the substrate also participates in the plastic deformations during the indentation process. Composite hardness model of Chicot-Lesage was chosen and applied to the experimental data in order to analyse and determine the absolute film hardness. Further analysis of work hardening parameter (t/d)m, that can express the difference in tendency of the composite hardness with the indentation load, was performed for the above-mentioned composite systems.
PB  - Belgrade : Military Technical Institute
C3  - Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad
T1  - Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films
EP  - 575
SP  - 570
UR  - https://hdl.handle.net/21.15107/rcub_technorep_2014
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Sarajlić, Milija and Radojević, Vesna",
year = "2012",
abstract = "Thin Ni and Cu films with fine-grained structures have been electrodeposited from self-made sulphamate-based and sulphate-based electrolytes, respectively. DC electrodeposition of Ni films was performed on single crystal Si wafers with different orientations named (100) and (111), and electrodeposition of Cu films was performed on massive electrodeposited Ni films as the substrates. In order to investigate the influence of the microstructure of the substrates and Ni and Cu thin films on mechanical properties of these composite structures, Vickers microhardness testing for different loads was done. For any composite system of thin film on a substrate, there is a critical indentation depth,1 when a measured hardness value is not the hardness of the electrodeposited film, but the so-called "composite hardness", because the substrate also participates in the plastic deformations during the indentation process. Composite hardness model of Chicot-Lesage was chosen and applied to the experimental data in order to analyse and determine the absolute film hardness. Further analysis of work hardening parameter (t/d)m, that can express the difference in tendency of the composite hardness with the indentation load, was performed for the above-mentioned composite systems.",
publisher = "Belgrade : Military Technical Institute",
journal = "Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad",
title = "Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films",
pages = "575-570",
url = "https://hdl.handle.net/21.15107/rcub_technorep_2014"
}

Lamovec, J., Jović, V., Mladenović, I., Sarajlić, M.,& Radojević, V.. (2012). Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films. in Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad
Belgrade : Military Technical Institute., 570-575.
https://hdl.handle.net/21.15107/rcub_technorep_2014

Lamovec J, Jović V, Mladenović I, Sarajlić M, Radojević V. Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films. in Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad. 2012;:570-575.
https://hdl.handle.net/21.15107/rcub_technorep_2014 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Sarajlić, Milija, Radojević, Vesna, "Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films" in Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad (2012):570-575,
https://hdl.handle.net/21.15107/rcub_technorep_2014 .