TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Vorkapić, Miloš
AU  - Popović, Bogdan
AU  - Radojević, Vesna
PY  - 2012
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2175
AB  - Different composite systems of electrodeposited monolayered and multilayered thin metal films of Ni and Cu on cold-rolled copper substrates were made. Thin metal layers were deposited at narrow spacing of 300 nm and 150 nm and high strength of composites was obtained. Microhardness analysis was performed on the systems of ED Ni film (sulphate "Slotonik 20" electrolyte) / ED Cu film (sulphate electrolyte), ED Ni film (sulphamate electrolyte) / ED Cu film (sulphate electrolyte) and ED Ni film (sulphamate electrolyte) /ED Ni film ("Slotonik 20" electrolyte). Characterization of mechanical properties of the composite systems was done using Vickers microhardness testing with loads ranging from 0.049 N to 1.96 N. Dependence of microhardness for different composite systems on microstructure and Ni/Cu and Ni/Ni layer thickness ratio was investigated. Composite hardness model of Korsunsky was applied to the experimental data in order to determine the absolute composite film hardness. The highest value of all the composite film hardness values was obtained for the system of multilayered Ni films from two different electrolytes, and "Slotonik 20" and sulphamate and with sublayer thickness ratio 1:2, respectively.
PB  - IEEE, New York
C3  - 2012 28th International Conference on Microelectronics (MIEL)
T1  - Comparative Microhardness Analysis of Various Thin Metallic Multilayer Composite Films
EP  - 146
SP  - 143
UR  - https://hdl.handle.net/21.15107/rcub_technorep_2175
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Vorkapić, Miloš and Popović, Bogdan and Radojević, Vesna",
year = "2012",
abstract = "Different composite systems of electrodeposited monolayered and multilayered thin metal films of Ni and Cu on cold-rolled copper substrates were made. Thin metal layers were deposited at narrow spacing of 300 nm and 150 nm and high strength of composites was obtained. Microhardness analysis was performed on the systems of ED Ni film (sulphate "Slotonik 20" electrolyte) / ED Cu film (sulphate electrolyte), ED Ni film (sulphamate electrolyte) / ED Cu film (sulphate electrolyte) and ED Ni film (sulphamate electrolyte) /ED Ni film ("Slotonik 20" electrolyte). Characterization of mechanical properties of the composite systems was done using Vickers microhardness testing with loads ranging from 0.049 N to 1.96 N. Dependence of microhardness for different composite systems on microstructure and Ni/Cu and Ni/Ni layer thickness ratio was investigated. Composite hardness model of Korsunsky was applied to the experimental data in order to determine the absolute composite film hardness. The highest value of all the composite film hardness values was obtained for the system of multilayered Ni films from two different electrolytes, and "Slotonik 20" and sulphamate and with sublayer thickness ratio 1:2, respectively.",
publisher = "IEEE, New York",
journal = "2012 28th International Conference on Microelectronics (MIEL)",
title = "Comparative Microhardness Analysis of Various Thin Metallic Multilayer Composite Films",
pages = "146-143",
url = "https://hdl.handle.net/21.15107/rcub_technorep_2175"
}

Lamovec, J., Jović, V., Mladenović, I., Vorkapić, M., Popović, B.,& Radojević, V.. (2012). Comparative Microhardness Analysis of Various Thin Metallic Multilayer Composite Films. in 2012 28th International Conference on Microelectronics (MIEL)
IEEE, New York., 143-146.
https://hdl.handle.net/21.15107/rcub_technorep_2175

Lamovec J, Jović V, Mladenović I, Vorkapić M, Popović B, Radojević V. Comparative Microhardness Analysis of Various Thin Metallic Multilayer Composite Films. in 2012 28th International Conference on Microelectronics (MIEL). 2012;:143-146.
https://hdl.handle.net/21.15107/rcub_technorep_2175 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Vorkapić, Miloš, Popović, Bogdan, Radojević, Vesna, "Comparative Microhardness Analysis of Various Thin Metallic Multilayer Composite Films" in 2012 28th International Conference on Microelectronics (MIEL) (2012):143-146,
https://hdl.handle.net/21.15107/rcub_technorep_2175 .

TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Sarajlić, Milija
AU  - Radojević, Vesna
PY  - 2012
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2014
AB  - Thin Ni and Cu films with fine-grained structures have been electrodeposited from self-made sulphamate-based and sulphate-based electrolytes, respectively. DC electrodeposition of Ni films was performed on single crystal Si wafers with different orientations named (100) and (111), and electrodeposition of Cu films was performed on massive electrodeposited Ni films as the substrates. In order to investigate the influence of the microstructure of the substrates and Ni and Cu thin films on mechanical properties of these composite structures, Vickers microhardness testing for different loads was done. For any composite system of thin film on a substrate, there is a critical indentation depth,1 when a measured hardness value is not the hardness of the electrodeposited film, but the so-called "composite hardness", because the substrate also participates in the plastic deformations during the indentation process. Composite hardness model of Chicot-Lesage was chosen and applied to the experimental data in order to analyse and determine the absolute film hardness. Further analysis of work hardening parameter (t/d)m, that can express the difference in tendency of the composite hardness with the indentation load, was performed for the above-mentioned composite systems.
PB  - Belgrade : Military Technical Institute
C3  - Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad
T1  - Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films
EP  - 575
SP  - 570
UR  - https://hdl.handle.net/21.15107/rcub_technorep_2014
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Sarajlić, Milija and Radojević, Vesna",
year = "2012",
abstract = "Thin Ni and Cu films with fine-grained structures have been electrodeposited from self-made sulphamate-based and sulphate-based electrolytes, respectively. DC electrodeposition of Ni films was performed on single crystal Si wafers with different orientations named (100) and (111), and electrodeposition of Cu films was performed on massive electrodeposited Ni films as the substrates. In order to investigate the influence of the microstructure of the substrates and Ni and Cu thin films on mechanical properties of these composite structures, Vickers microhardness testing for different loads was done. For any composite system of thin film on a substrate, there is a critical indentation depth,1 when a measured hardness value is not the hardness of the electrodeposited film, but the so-called "composite hardness", because the substrate also participates in the plastic deformations during the indentation process. Composite hardness model of Chicot-Lesage was chosen and applied to the experimental data in order to analyse and determine the absolute film hardness. Further analysis of work hardening parameter (t/d)m, that can express the difference in tendency of the composite hardness with the indentation load, was performed for the above-mentioned composite systems.",
publisher = "Belgrade : Military Technical Institute",
journal = "Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad",
title = "Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films",
pages = "575-570",
url = "https://hdl.handle.net/21.15107/rcub_technorep_2014"
}

Lamovec, J., Jović, V., Mladenović, I., Sarajlić, M.,& Radojević, V.. (2012). Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films. in Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad
Belgrade : Military Technical Institute., 570-575.
https://hdl.handle.net/21.15107/rcub_technorep_2014

Lamovec J, Jović V, Mladenović I, Sarajlić M, Radojević V. Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films. in Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad. 2012;:570-575.
https://hdl.handle.net/21.15107/rcub_technorep_2014 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Sarajlić, Milija, Radojević, Vesna, "Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films" in Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad (2012):570-575,
https://hdl.handle.net/21.15107/rcub_technorep_2014 .