TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Popović, Bogdan
AU  - Vasiljević-Radović, Dana
AU  - Aleksić, Radoslav
AU  - Radojević, Vesna
PY  - 2010
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/1536
AB  - Multilayered composite systems of alternately electrodeposited nanocrystalline Cu and Ni films on cold-rolled microcrystalline copper substrates were fabricated. Highly-densified parallel interfaces which can give rise to high strength of composites are obtained by depositing layers at a very narrow spacing. The mechanical properties of the composite systems were characterized using Vickers microhardness testing with loads ranging from 1.96 N down to 0.049 N. Dependence of microhardness on layer thickness, Ni/Cu layer thickness ratio and total thickness of the film was investigated. The microhardness increased with decreasing the layer thickness down to 30 nm and it is consistent with the Hall-Petch relation. Composite hardness model of Korsunsky was applied to the experimental data in order to determine the composite film hardness. The highest value of all the composite film hardness values was obtained when the ratio of Ni: Cu layer thickness was 4:1.
C3  - 27th International Conference on Microelectronics, MIEL 2010 - Proceedings
T1  - Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates
EP  - 216
SP  - 213
DO  - 10.1109/MIEL.2010.5490498
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Popović, Bogdan and Vasiljević-Radović, Dana and Aleksić, Radoslav and Radojević, Vesna",
year = "2010",
abstract = "Multilayered composite systems of alternately electrodeposited nanocrystalline Cu and Ni films on cold-rolled microcrystalline copper substrates were fabricated. Highly-densified parallel interfaces which can give rise to high strength of composites are obtained by depositing layers at a very narrow spacing. The mechanical properties of the composite systems were characterized using Vickers microhardness testing with loads ranging from 1.96 N down to 0.049 N. Dependence of microhardness on layer thickness, Ni/Cu layer thickness ratio and total thickness of the film was investigated. The microhardness increased with decreasing the layer thickness down to 30 nm and it is consistent with the Hall-Petch relation. Composite hardness model of Korsunsky was applied to the experimental data in order to determine the composite film hardness. The highest value of all the composite film hardness values was obtained when the ratio of Ni: Cu layer thickness was 4:1.",
journal = "27th International Conference on Microelectronics, MIEL 2010 - Proceedings",
title = "Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates",
pages = "216-213",
doi = "10.1109/MIEL.2010.5490498"
}

Lamovec, J., Jović, V., Popović, B., Vasiljević-Radović, D., Aleksić, R.,& Radojević, V.. (2010). Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates. in 27th International Conference on Microelectronics, MIEL 2010 - Proceedings, 213-216.
https://doi.org/10.1109/MIEL.2010.5490498

Lamovec J, Jović V, Popović B, Vasiljević-Radović D, Aleksić R, Radojević V. Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates. in 27th International Conference on Microelectronics, MIEL 2010 - Proceedings. 2010;:213-216.
doi:10.1109/MIEL.2010.5490498 .

Lamovec, Jelena, Jović, Vesna, Popović, Bogdan, Vasiljević-Radović, Dana, Aleksić, Radoslav, Radojević, Vesna, "Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates" in 27th International Conference on Microelectronics, MIEL 2010 - Proceedings (2010):213-216,
https://doi.org/10.1109/MIEL.2010.5490498 . .