TY  - CONF
AU  - Shen, Weining
AU  - Dunn, Bruce
AU  - Ragot, F.
AU  - Goorsky, Mark
AU  - Moore, Caroline
AU  - Song, David W.
AU  - Chen, Gang
AU  - Gronsky, Ronald
AU  - Radetić, Tamara
AU  - Fuller-Mora, Wendy
AU  - Ehrlich, Alexander
PY  - 1999
UR  - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/7268
AB  - Metallorganic decomposition of metal carboxylates is used to prepare porous thin films of bismuth. The general approach is to spin coat a precursor solution, bismuth 2-ethylhexanoate in a solvent of 2-methyl-1-propanol on the substrate of interest and then pyrolyze the resulting film under conditions which evolve the organic ligands but do not melt the bismuth. The controlled release of ligands creates the nanoporous morphology which is then preserved in the final film. Subsequent plasma etching and heat treatments are used to produce films of variable porosity. The film microstructure consists of nanoporous channels separating grains of bismuth. For films in the range of 30% porosity, thermal conductivity values are on the order of 0.35 W/mK. The interrelationships among processing conditions, microstructure and thermal conductivity are discussed.
PB  - IEEE
C3  - International Conference on Thermoelectrics, ICT, Proceedings
T1  - Microstructure-property relations for porous bismuth films
EP  - 564
SP  - 562
DO  - 10.1109/ict.1999.843452
ER  - 

@conference{
author = "Shen, Weining and Dunn, Bruce and Ragot, F. and Goorsky, Mark and Moore, Caroline and Song, David W. and Chen, Gang and Gronsky, Ronald and Radetić, Tamara and Fuller-Mora, Wendy and Ehrlich, Alexander",
year = "1999",
abstract = "Metallorganic decomposition of metal carboxylates is used to prepare porous thin films of bismuth. The general approach is to spin coat a precursor solution, bismuth 2-ethylhexanoate in a solvent of 2-methyl-1-propanol on the substrate of interest and then pyrolyze the resulting film under conditions which evolve the organic ligands but do not melt the bismuth. The controlled release of ligands creates the nanoporous morphology which is then preserved in the final film. Subsequent plasma etching and heat treatments are used to produce films of variable porosity. The film microstructure consists of nanoporous channels separating grains of bismuth. For films in the range of 30% porosity, thermal conductivity values are on the order of 0.35 W/mK. The interrelationships among processing conditions, microstructure and thermal conductivity are discussed.",
publisher = "IEEE",
journal = "International Conference on Thermoelectrics, ICT, Proceedings",
title = "Microstructure-property relations for porous bismuth films",
pages = "564-562",
doi = "10.1109/ict.1999.843452"
}

Shen, W., Dunn, B., Ragot, F., Goorsky, M., Moore, C., Song, D. W., Chen, G., Gronsky, R., Radetić, T., Fuller-Mora, W.,& Ehrlich, A.. (1999). Microstructure-property relations for porous bismuth films. in International Conference on Thermoelectrics, ICT, Proceedings
IEEE., 562-564.
https://doi.org/10.1109/ict.1999.843452

Shen W, Dunn B, Ragot F, Goorsky M, Moore C, Song DW, Chen G, Gronsky R, Radetić T, Fuller-Mora W, Ehrlich A. Microstructure-property relations for porous bismuth films. in International Conference on Thermoelectrics, ICT, Proceedings. 1999;:562-564.
doi:10.1109/ict.1999.843452 .

Shen, Weining, Dunn, Bruce, Ragot, F., Goorsky, Mark, Moore, Caroline, Song, David W., Chen, Gang, Gronsky, Ronald, Radetić, Tamara, Fuller-Mora, Wendy, Ehrlich, Alexander, "Microstructure-property relations for porous bismuth films" in International Conference on Thermoelectrics, ICT, Proceedings (1999):562-564,
https://doi.org/10.1109/ict.1999.843452 . .