Приказ основних података о документу
The estimation of solid copper surface tension in copper sulfate solutions
dc.creator | Popov, K.I. | |
dc.creator | Nikolic, N.D. | |
dc.creator | Rakočević, Zlatko Lj. | |
dc.date.accessioned | 2018-03-01T19:13:02Z | |
dc.date.accessioned | 2023-01-13T12:41:21Z | |
dc.date.available | 2018-03-01T19:13:02Z | |
dc.date.available | 2023-01-13T12:41:21Z | |
dc.date.issued | 2002 | |
dc.identifier.issn | 0352-5139 | |
dc.identifier.uri | http://TechnoRep.tmf.bg.ac.rs/handle/123456789/5373 | |
dc.description.abstract | In metal electrodeposition in the limiting diffusion current density range, the deposition current density remains constant regardless of the deposition overpotential used, At the same time, die larger the deposition overpotential is the more disperse is the formed deposit, which is characterised by an increase specific surface. The difference in die specific surface of disperse deposits obtained at two different overpotentials; in the limiting diffusion current density range is correlated with the difference between the deposition overpotentials. A method for the estimation of the surface tension of solid copper in copper sulfate solutions is also proposed. | en |
dc.rights | openAccess | en |
dc.rights | restrictedAccess | |
dc.source | Journal of the Serbian Chemical Society | en |
dc.subject | interfacial energy copper-copper sulfate solution | en |
dc.subject | specific surface of copper powder | en |
dc.title | The estimation of solid copper surface tension in copper sulfate solutions | en |
dc.type | article | en |
dc.rights.license | ARR | |
dc.citation.epage | 775 | |
dc.citation.issue | 11 | |
dc.citation.rank | M23 | |
dc.citation.spage | 769 | |
dc.citation.volume | 67 | |
dc.identifier.doi | 10.2298/JSC0211769P | |
dc.identifier.scopus | 2-s2.0-0036983056 | |
dc.identifier.wos | 000179956900008 | |
dc.type.version | publishedVersion |