Parallel glide: Flow of dislocations with internal stress source/sink distribution
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Метаподаци
Приказ свих података о документуАпстракт
The unexpected glide of dislocations on a plane parallel to the film/substrate interface in ultrathin copper films, which has been called parallel glide (Balk et al 2003 Acta Metall. 51 447), is described using an analytical model. The phenomenon is observed as a problem involving inlet/outlet flow from different positions of a grain boundary into the grain channel. In this sense, parallel glide is presented as the flow of dislocations with an internal stress source/sink distribution.
Кључне речи:
Dislocations / Dynamics / Metallic material / Ultrathin filmsИзвор:
Science and Technology of Advanced Materials, 2008, 9, 1, 015008-Издавач:
- Taylor & Francis Group
DOI: 10.1088/1468-6996/9/1/015008
ISSN: 1468-6996
WoS: 000257128300029
Scopus: 2-s2.0-49049117345
Институција/група
Tehnološko-metalurški fakultetTY - JOUR AU - Raić, Karlo T. PY - 2008 UR - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/5574 AB - The unexpected glide of dislocations on a plane parallel to the film/substrate interface in ultrathin copper films, which has been called parallel glide (Balk et al 2003 Acta Metall. 51 447), is described using an analytical model. The phenomenon is observed as a problem involving inlet/outlet flow from different positions of a grain boundary into the grain channel. In this sense, parallel glide is presented as the flow of dislocations with an internal stress source/sink distribution. PB - Taylor & Francis Group T2 - Science and Technology of Advanced Materials T1 - Parallel glide: Flow of dislocations with internal stress source/sink distribution IS - 1 SP - 015008 VL - 9 DO - 10.1088/1468-6996/9/1/015008 ER -
@article{ author = "Raić, Karlo T.", year = "2008", abstract = "The unexpected glide of dislocations on a plane parallel to the film/substrate interface in ultrathin copper films, which has been called parallel glide (Balk et al 2003 Acta Metall. 51 447), is described using an analytical model. The phenomenon is observed as a problem involving inlet/outlet flow from different positions of a grain boundary into the grain channel. In this sense, parallel glide is presented as the flow of dislocations with an internal stress source/sink distribution.", publisher = "Taylor & Francis Group", journal = "Science and Technology of Advanced Materials", title = "Parallel glide: Flow of dislocations with internal stress source/sink distribution", number = "1", pages = "015008", volume = "9", doi = "10.1088/1468-6996/9/1/015008" }
Raić, K. T.. (2008). Parallel glide: Flow of dislocations with internal stress source/sink distribution. in Science and Technology of Advanced Materials Taylor & Francis Group., 9(1), 015008. https://doi.org/10.1088/1468-6996/9/1/015008
Raić KT. Parallel glide: Flow of dislocations with internal stress source/sink distribution. in Science and Technology of Advanced Materials. 2008;9(1):015008. doi:10.1088/1468-6996/9/1/015008 .
Raić, Karlo T., "Parallel glide: Flow of dislocations with internal stress source/sink distribution" in Science and Technology of Advanced Materials, 9, no. 1 (2008):015008, https://doi.org/10.1088/1468-6996/9/1/015008 . .