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dc.creatorMilosavljević, Aleksandra
dc.creatorŽivković, Dragana
dc.creatorKamberović, Željko
dc.date.accessioned2021-03-10T10:53:52Z
dc.date.available2021-03-10T10:53:52Z
dc.date.issued2008
dc.identifier.issn0354-6306
dc.identifier.urihttp://TechnoRep.tmf.bg.ac.rs/handle/123456789/1254
dc.description.abstractThe Ag-In-Sn system, as one of potential lead-free solder materials, was studied in this paper. The investigated alloys were chosen from two sections, with molar ratio of In:Sn equal to 1:4; 1:2. DTA, XRD, SEM and micro hardness investigations were used in order to determine structural characteristics of chosen Ag-In-Sn ternary alloys. .en
dc.publisherSavez inženjera metalurgije Srbije, Beograd
dc.rightsopenAccess
dc.sourceMetalurgija
dc.subjectlead-free soldersen
dc.subjectAg-In-Snen
dc.subjectDTAen
dc.subjectSEMen
dc.subjectXRDen
dc.subjectmicrohardnessen
dc.titleStructural characteristics of some ternary Ag-In-Sn alloysen
dc.typearticle
dc.rights.licenseARR
dc.citation.epage167
dc.citation.issue3
dc.citation.other14(3): 161-167
dc.citation.spage161
dc.citation.volume14
dc.identifier.fulltexthttp://TechnoRep.tmf.bg.ac.rs/bitstream/id/10878/1MILOSAVLJEVIC.pdf
dc.identifier.rcubconv_974
dc.type.versionpublishedVersion


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