Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films
Apstrakt
Thin Ni and Cu films with fine-grained structures have been electrodeposited from self-made sulphamate-based and sulphate-based electrolytes, respectively. DC electrodeposition of Ni films was performed on single crystal Si wafers with different orientations named (100) and (111), and electrodeposition of Cu films was performed on massive electrodeposited Ni films as the substrates. In order to investigate the influence of the microstructure of the substrates and Ni and Cu thin films on mechanical properties of these composite structures, Vickers microhardness testing for different loads was done. For any composite system of thin film on a substrate, there is a critical indentation depth,1 when a measured hardness value is not the hardness of the electrodeposited film, but the so-called "composite hardness", because the substrate also participates in the plastic deformations during the indentation process. Composite hardness model of Chicot-Lesage was chosen and applied to the experime...ntal data in order to analyse and determine the absolute film hardness. Further analysis of work hardening parameter (t/d)m, that can express the difference in tendency of the composite hardness with the indentation load, was performed for the above-mentioned composite systems.
Ključne reči:
composite hardness / Vickers microhardness / composite hardness models / electrodeposition / thin films / work hardening parameterIzvor:
Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad, 2012, 570-575Izdavač:
- Belgrade : Military Technical Institute
Finansiranje / projekti:
- Mikro, nano-sistemi i senzori za primenu u elektroprivredi, procesnoj industriji i zaštiti životne sredine (RS-MESTD-Technological Development (TD or TR)-32008)
- Razvoj opreme i procesa dobijanja polimernih kompozitnih materijala sa unapred definisanim funkcionalnim svojstvima (RS-MESTD-Technological Development (TD or TR)-34011)
- Sinteza, razvoj tehnologija dobijanja i primena nanostrukturnih multifunkcionalnih materijala definisanih svojstava (RS-MESTD-Integrated and Interdisciplinary Research (IIR or III)-45019)
- Reinforcement of Regional Microsystems and Nanosystems Centre (EU-FP7-205533)
Institucija/grupa
Tehnološko-metalurški fakultetTY - CONF AU - Lamovec, Jelena AU - Jović, Vesna AU - Mladenović, Ivana AU - Sarajlić, Milija AU - Radojević, Vesna PY - 2012 UR - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2014 AB - Thin Ni and Cu films with fine-grained structures have been electrodeposited from self-made sulphamate-based and sulphate-based electrolytes, respectively. DC electrodeposition of Ni films was performed on single crystal Si wafers with different orientations named (100) and (111), and electrodeposition of Cu films was performed on massive electrodeposited Ni films as the substrates. In order to investigate the influence of the microstructure of the substrates and Ni and Cu thin films on mechanical properties of these composite structures, Vickers microhardness testing for different loads was done. For any composite system of thin film on a substrate, there is a critical indentation depth,1 when a measured hardness value is not the hardness of the electrodeposited film, but the so-called "composite hardness", because the substrate also participates in the plastic deformations during the indentation process. Composite hardness model of Chicot-Lesage was chosen and applied to the experimental data in order to analyse and determine the absolute film hardness. Further analysis of work hardening parameter (t/d)m, that can express the difference in tendency of the composite hardness with the indentation load, was performed for the above-mentioned composite systems. PB - Belgrade : Military Technical Institute C3 - Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad T1 - Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films EP - 575 SP - 570 UR - https://hdl.handle.net/21.15107/rcub_technorep_2014 ER -
@conference{ author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Sarajlić, Milija and Radojević, Vesna", year = "2012", abstract = "Thin Ni and Cu films with fine-grained structures have been electrodeposited from self-made sulphamate-based and sulphate-based electrolytes, respectively. DC electrodeposition of Ni films was performed on single crystal Si wafers with different orientations named (100) and (111), and electrodeposition of Cu films was performed on massive electrodeposited Ni films as the substrates. In order to investigate the influence of the microstructure of the substrates and Ni and Cu thin films on mechanical properties of these composite structures, Vickers microhardness testing for different loads was done. For any composite system of thin film on a substrate, there is a critical indentation depth,1 when a measured hardness value is not the hardness of the electrodeposited film, but the so-called "composite hardness", because the substrate also participates in the plastic deformations during the indentation process. Composite hardness model of Chicot-Lesage was chosen and applied to the experimental data in order to analyse and determine the absolute film hardness. Further analysis of work hardening parameter (t/d)m, that can express the difference in tendency of the composite hardness with the indentation load, was performed for the above-mentioned composite systems.", publisher = "Belgrade : Military Technical Institute", journal = "Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad", title = "Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films", pages = "575-570", url = "https://hdl.handle.net/21.15107/rcub_technorep_2014" }
Lamovec, J., Jović, V., Mladenović, I., Sarajlić, M.,& Radojević, V.. (2012). Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films. in Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad Belgrade : Military Technical Institute., 570-575. https://hdl.handle.net/21.15107/rcub_technorep_2014
Lamovec J, Jović V, Mladenović I, Sarajlić M, Radojević V. Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films. in Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad. 2012;:570-575. https://hdl.handle.net/21.15107/rcub_technorep_2014 .
Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Sarajlić, Milija, Radojević, Vesna, "Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films" in Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrad (2012):570-575, https://hdl.handle.net/21.15107/rcub_technorep_2014 .