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dc.creatorMladenović, Ivana
dc.creatorLamovec, Jelena
dc.creatorJović, Vesna
dc.creatorRadojević, Vesna
dc.date.accessioned2021-03-10T13:20:08Z
dc.date.available2021-03-10T13:20:08Z
dc.date.issued2017
dc.identifier.issn1451-4869
dc.identifier.urihttp://TechnoRep.tmf.bg.ac.rs/handle/123456789/3529
dc.description.abstractThin copper films were electrodeposited on a polycrystalline cold rolled copper substrate. The composition of the laboratory-made copper sulphate electrolyte was changed by the addition of various additives. The influence of chloride ion (Cl-), polyethylene glycol (PEG) and 3-mercapto-1-propane sulfonic acid (MPSA) on mechanical and adhesion properties of the electrodeposited copper films was investigated using Vickers microindentation technique. Calculations of the film hardness and adhesion were carried out using composite hardness models of Korsunsky and Chen-Gao. The hardness of the composite system is influenced by the adhesion of the copper film to the substrate. Increasing adhesion corresponds to increasing values of the calculated adhesion parameter b, named the critical reduced depth. When additives are added to a plating solution, the copper deposition mechanism is changed and fine-grained microstructure without the formation of microscopic nodules is obtained.en
dc.publisherFaculty of Technical Sciences in Cacak
dc.relationinfo:eu-repo/grantAgreement/MESTD/Technological Development (TD or TR)/32008/RS//
dc.relationinfo:eu-repo/grantAgreement/MESTD/Technological Development (TD or TR)/34011/RS//
dc.relationinfo:eu-repo/grantAgreement/MESTD/Integrated and Interdisciplinary Research (IIR or III)/45019/RS//
dc.rightsopenAccess
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/4.0/
dc.sourceSerbian Journal of Electrical Engineering
dc.subjectcomposite microhardnessen
dc.subjectelectrodepositionen
dc.subjectPEGen
dc.subjectMPSen
dc.subjectadhesionen
dc.subjectcritical reduced depthen
dc.titleSynergetic effect of additives on the hardness and adhesion of thin electrodeposited copper filmsen
dc.typearticle
dc.rights.licenseBY-NC-ND
dc.citation.epage11
dc.citation.issue1
dc.citation.other14(1): 1-11
dc.citation.rankM51
dc.citation.spage1
dc.citation.volume14
dc.identifier.doi10.2298/SJEE1701001M
dc.identifier.rcubconv_1614
dc.identifier.scopus2-s2.0-85018904412
dc.type.versionpublishedVersion


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