Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems
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2014
Konferencijski prilog (Objavljena verzija)
Metapodaci
Prikaz svih podataka o dokumentuApstrakt
Nickel and copper thin films were alternately electrodeposited from sulphamate and sulphate-based electrolytes respectively, on different substrates: polycrystalline cold rolled copper, single crystal (111)-oriented Si and 100 mu m-thick electrodeposited nickel films. Electrodeposition of layers at a very narrow spacing contribute to high strength of the composites. The influence of the substrate and plating conditions on the mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Composite hardness models were applied to the experimental data in order to obtaine absolute film hardness.
Izvor:
2014 29th International Conference on Microelectronics Proceedings - MIEL 2014, 2014, 183-186Izdavač:
- IEEE, New York
Finansiranje / projekti:
- Mikro, nano-sistemi i senzori za primenu u elektroprivredi, procesnoj industriji i zaštiti životne sredine (RS-MESTD-Technological Development (TD or TR)-32008)
Institucija/grupa
Tehnološko-metalurški fakultetTY - CONF AU - Lamovec, Jelena AU - Jović, Vesna AU - Mladenović, Ivana AU - Sarajlić, Milija AU - Radojević, Vesna PY - 2014 UR - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/2716 AB - Nickel and copper thin films were alternately electrodeposited from sulphamate and sulphate-based electrolytes respectively, on different substrates: polycrystalline cold rolled copper, single crystal (111)-oriented Si and 100 mu m-thick electrodeposited nickel films. Electrodeposition of layers at a very narrow spacing contribute to high strength of the composites. The influence of the substrate and plating conditions on the mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Composite hardness models were applied to the experimental data in order to obtaine absolute film hardness. PB - IEEE, New York C3 - 2014 29th International Conference on Microelectronics Proceedings - MIEL 2014 T1 - Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems EP - 186 SP - 183 UR - https://hdl.handle.net/21.15107/rcub_technorep_2716 ER -
@conference{ author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Sarajlić, Milija and Radojević, Vesna", year = "2014", abstract = "Nickel and copper thin films were alternately electrodeposited from sulphamate and sulphate-based electrolytes respectively, on different substrates: polycrystalline cold rolled copper, single crystal (111)-oriented Si and 100 mu m-thick electrodeposited nickel films. Electrodeposition of layers at a very narrow spacing contribute to high strength of the composites. The influence of the substrate and plating conditions on the mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Composite hardness models were applied to the experimental data in order to obtaine absolute film hardness.", publisher = "IEEE, New York", journal = "2014 29th International Conference on Microelectronics Proceedings - MIEL 2014", title = "Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems", pages = "186-183", url = "https://hdl.handle.net/21.15107/rcub_technorep_2716" }
Lamovec, J., Jović, V., Mladenović, I., Sarajlić, M.,& Radojević, V.. (2014). Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems. in 2014 29th International Conference on Microelectronics Proceedings - MIEL 2014 IEEE, New York., 183-186. https://hdl.handle.net/21.15107/rcub_technorep_2716
Lamovec J, Jović V, Mladenović I, Sarajlić M, Radojević V. Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems. in 2014 29th International Conference on Microelectronics Proceedings - MIEL 2014. 2014;:183-186. https://hdl.handle.net/21.15107/rcub_technorep_2716 .
Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Sarajlić, Milija, Radojević, Vesna, "Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems" in 2014 29th International Conference on Microelectronics Proceedings - MIEL 2014 (2014):183-186, https://hdl.handle.net/21.15107/rcub_technorep_2716 .