Hardness response and adhesion of thin copper films on alloy substrates
2017
Authors
Mladenović, IvanaLamovec, Jelena
Jović, Vesna
Popović, Bogdan
Vorkapić, Miloš
Radojević, Vesna
Conference object (Published version)
Metadata
Show full item recordAbstract
Microhardness test is the most commonly used method for assessing the mechanical properties of thin films.This testing method uses controlled contact at a single point of an indenter and chosen material which induces the plastic deformation in material under indenter. The measured hardness is considered as the composite hardness, because the substrate participates in the plastic deformation caused by indentation. This research has been carried out in order to analyze and compare the hardness response of different composite systems consist of monolayer electrodeposited copper thin film on brass and steel alloys as the substrates. The influence of the electrodeposition parameters and of the substrate on the hardness and interlayer adhesion were investigated by Vickers microhardness testing for different load.
Keywords:
microhardness / composite system / thin film / adhesion / electrodepositionSource:
Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic, 2017, MOI1.3.1-MOI1.3.6Publisher:
- Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering
Funding / projects:
- Micro- Nanosystems and Sensors for Electric Power and Process Industry and Environmental Protection (RS-MESTD-Technological Development (TD or TR)-32008)
- Predefined functional properties polymer composite materials processes and equipment development (RS-MESTD-Technological Development (TD or TR)-34011)
- Synthesis, processing and applications of nanostructured multifunctional materials with defined properties (RS-MESTD-Integrated and Interdisciplinary Research (IIR or III)-45019)
Institution/Community
Tehnološko-metalurški fakultetTY - CONF AU - Mladenović, Ivana AU - Lamovec, Jelena AU - Jović, Vesna AU - Popović, Bogdan AU - Vorkapić, Miloš AU - Radojević, Vesna PY - 2017 UR - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/3485 AB - Microhardness test is the most commonly used method for assessing the mechanical properties of thin films.This testing method uses controlled contact at a single point of an indenter and chosen material which induces the plastic deformation in material under indenter. The measured hardness is considered as the composite hardness, because the substrate participates in the plastic deformation caused by indentation. This research has been carried out in order to analyze and compare the hardness response of different composite systems consist of monolayer electrodeposited copper thin film on brass and steel alloys as the substrates. The influence of the electrodeposition parameters and of the substrate on the hardness and interlayer adhesion were investigated by Vickers microhardness testing for different load. PB - Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering C3 - Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic T1 - Hardness response and adhesion of thin copper films on alloy substrates EP - MOI1.3.6 SP - MOI1.3.1 UR - https://hdl.handle.net/21.15107/rcub_technorep_3485 ER -
@conference{ author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Popović, Bogdan and Vorkapić, Miloš and Radojević, Vesna", year = "2017", abstract = "Microhardness test is the most commonly used method for assessing the mechanical properties of thin films.This testing method uses controlled contact at a single point of an indenter and chosen material which induces the plastic deformation in material under indenter. The measured hardness is considered as the composite hardness, because the substrate participates in the plastic deformation caused by indentation. This research has been carried out in order to analyze and compare the hardness response of different composite systems consist of monolayer electrodeposited copper thin film on brass and steel alloys as the substrates. The influence of the electrodeposition parameters and of the substrate on the hardness and interlayer adhesion were investigated by Vickers microhardness testing for different load.", publisher = "Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering", journal = "Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic", title = "Hardness response and adhesion of thin copper films on alloy substrates", pages = "MOI1.3.6-MOI1.3.1", url = "https://hdl.handle.net/21.15107/rcub_technorep_3485" }
Mladenović, I., Lamovec, J., Jović, V., Popović, B., Vorkapić, M.,& Radojević, V.. (2017). Hardness response and adhesion of thin copper films on alloy substrates. in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering., MOI1.3.1-MOI1.3.6. https://hdl.handle.net/21.15107/rcub_technorep_3485
Mladenović I, Lamovec J, Jović V, Popović B, Vorkapić M, Radojević V. Hardness response and adhesion of thin copper films on alloy substrates. in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic. 2017;:MOI1.3.1-MOI1.3.6. https://hdl.handle.net/21.15107/rcub_technorep_3485 .
Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Popović, Bogdan, Vorkapić, Miloš, Radojević, Vesna, "Hardness response and adhesion of thin copper films on alloy substrates" in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic (2017):MOI1.3.1-MOI1.3.6, https://hdl.handle.net/21.15107/rcub_technorep_3485 .