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Influence of the structure of multilayer thin Ni/Cu films on their mechanical properties and MEMS devices fabrication applications / Uticaj strukture višeslojnih tankih filmova nikla i bakra na njihova mehanička svojstva i primenu u izradi MEMS naprava
(Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering, 2015)
Multilayer Ni/Cu films were alternately electrochemically deposited on polycrystalline Cu substrate by dual-bath technique. Change of the parameters such as total film thickness, sublayer thickness and sublayer thickness ...