Приказ основних података о документу

dc.creatorLamovec, Jelena
dc.creatorJović, Vesna
dc.creatorRanđelović, Danijela
dc.creatorAleksić, Radoslav
dc.creatorRadojević, Vesna
dc.date.accessioned2021-03-10T10:52:07Z
dc.date.available2021-03-10T10:52:07Z
dc.date.issued2008
dc.identifier.issn0040-6090
dc.identifier.urihttp://TechnoRep.tmf.bg.ac.rs/handle/123456789/1227
dc.description.abstractFine-grained nickel thin films were electrodeposited from a self-made sulphamate-based electrolyte on different substrates: polycrystalline cold-rolled copper and single crystal silicon with two different orientations, namely (100) and (111). The influence of the substrate and chosen plating conditions on mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Above a certain critical penetration depth, a measured hardness value is not the hardness of the electrodeposited film, but the so-called "composite hardness", because the substrate also participates in the plastic deformations during the indentation process. Four composite hardness models (Jonsson-Hogmark, Burnett-Rickerby, Chicot-Lesage and Korsunsky models) are chosen and applied to the experimental data. The applicability of mentioned models is critically tested on two types of composite systems: Ni film on Cu substrate, which is example for "hard film on soft substrate" and electrodeposited Ni on Si substrate ("soft film on hard substrate") and their reliability is given.en
dc.publisherElsevier Science Sa, Lausanne
dc.relationinfo:eu-repo/grantAgreement/MESTD/MPN2006-2010/142035/RS//
dc.rightsrestrictedAccess
dc.sourceThin Solid Films
dc.subjectVickers microhardnessen
dc.subjectNickel electrodepositionen
dc.subjectComposite hardnessen
dc.subjectHardness modelsen
dc.titleAnalysis of the composite and film hardness of electrodeposited nickel coatings on different substratesen
dc.typearticle
dc.rights.licenseARR
dc.citation.epage8654
dc.citation.issue23
dc.citation.other516(23): 8646-8654
dc.citation.rankM21
dc.citation.spage8646
dc.citation.volume516
dc.identifier.doi10.1016/j.tsf.2008.06.035
dc.identifier.scopus2-s2.0-51149093022
dc.identifier.wos000260579800073
dc.type.versionpublishedVersion


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Приказ основних података о документу