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Hardness response and adhesion of thin copper films on alloy substrates
(Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering, 2017)
Microhardness test is the most commonly used method for assessing the mechanical properties of thin films.This testing method uses controlled contact at a single point of an indenter and chosen material which induces the ...
Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films
(Belgrade : Military Technical Institute, 2012)
Thin Ni and Cu films with fine-grained structures have been electrodeposited from self-made sulphamate-based and sulphate-based electrolytes, respectively. DC electrodeposition of Ni films was performed on single crystal ...