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dc.creatorDimitrijević, Stevan
dc.creatorAnđić, Zoran
dc.creatorKamberović, Željko
dc.creatorDimitrijević, Silvana
dc.creatorVuković, N.
dc.date.accessioned2021-03-10T12:17:25Z
dc.date.available2021-03-10T12:17:25Z
dc.date.issued2014
dc.identifier.issn0861-9808
dc.identifier.urihttp://TechnoRep.tmf.bg.ac.rs/handle/123456789/2553
dc.description.abstractThe paper presents an improved process for recycling of silver-plate brass housing. Silver and copper are recovered with a purity of 99.99 % and 99.90 %, respectively, with the aim of obtaining materials of higher value using additional procedures based on the same process and equipment. The novel approach with subsequent electrorefining yields copper of 99.99 % purity with BS EN 1978:1998 (Cu-CATH-1) quality and is referred to as LME grade A. Additional processing of silver results in superfine, micro-sized Ag powder with partie size from 0.14 to 1.13 mu m and purity of 99.999 %. Copper electrorefining tests were performed using 1.50 dm(3) of synthetic electrolyte in a 2 dm(3) electrolytic cell. Effects of current density and electrolyte composition were investigated. Optimal current density for the first and second refining was 120 A/m(2) and 200 A/m(2), respectively. Additional refining of silver was performed by chemical reduction from an aqueous solution. Optimal results were obtained with ascorbic acid as a reduction agent in concentration of 0.1 mol/dm(3) and polyvinylpyrrolidon as a protective agent in concentration of 2 % by mass. The investigation results could be adopted into production.en
dc.relationinfo:eu-repo/grantAgreement/MESTD/Technological Development (TD or TR)/34033/RS//
dc.rightsrestrictedAccess
dc.sourceBulgarian Chemical Communications
dc.subjectrecyclingen
dc.subjectcopperen
dc.subjectelectrorefiningen
dc.subjectsilveren
dc.subjectmicro-sized powderen
dc.titleRecycling of silver-plated brass for production of high purity copper and ultrafine silver powder for electric contactsen
dc.typearticle
dc.rights.licenseARR
dc.citation.epage824
dc.citation.issue4
dc.citation.other46(4): 814-824
dc.citation.spage814
dc.citation.volume46
dc.identifier.pmid
dc.identifier.rcubhttps://hdl.handle.net/21.15107/rcub_technorep_2553
dc.identifier.scopus2-s2.0-84936777712
dc.identifier.wos000348242400022
dc.type.versionpublishedVersion


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