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dc.creatorMarković, Branislav
dc.creatorSokić, Miroslav
dc.creatorKamberović, Željko
dc.creatorŽivković, Dragana
dc.creatorŠtrbac, Nada
dc.creatorManojlović, Vaso
dc.date.accessioned2021-03-10T12:40:13Z
dc.date.available2021-03-10T12:40:13Z
dc.date.issued2015
dc.identifier.issn2217-8961
dc.identifier.urihttp://TechnoRep.tmf.bg.ac.rs/handle/123456789/2914
dc.description.abstractPresent work is focused on the copper (I) sulphide leaching with sodium chloride in hydrochloric acid solution and with introduction of gaseous oxygen. Chemical reactions of leaching and their thermodynamic probabilities are predicted based on the literature data and products which were formed during the process and the overall leaching reaction was defined. The influence of temperature and time on the leaching degree of copper was experimentally determined. The quantity of dissolved copper increases with the increase of both investigated parameters. Elemental sulphur was formed as the main leaching product, precipitated at the particle surfaces and chloride ions have a role to disrupt the creation of this passive layer.en
dc.publisherSavez inženjera metalurgije Srbije, Beograd
dc.relationinfo:eu-repo/grantAgreement/MESTD/Technological Development (TD or TR)/34023/RS//
dc.rightsopenAccess
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/
dc.sourceMetallurgical & Materials Engineering
dc.subjectleachingen
dc.subjectcopper (I) sulphideen
dc.subjecthydrochloric aciden
dc.subjectsodium chlorideen
dc.titleInvestigation of copper(i) sulphide leaching in oxidative hydrochloric acid solutionen
dc.typearticle
dc.rights.licenseBY
dc.citation.epage258
dc.citation.issue4
dc.citation.other21(4): 253-258
dc.citation.rankM24
dc.citation.spage253
dc.citation.volume21
dc.identifier.doi10.30544/71
dc.identifier.fulltexthttp://TechnoRep.tmf.bg.ac.rs/bitstream/id/966/2911.pdf
dc.identifier.wos000216066100003
dc.type.versionpublishedVersion


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Приказ основних података о документу