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dc.creatorMladenović, Ivana
dc.creatorLamovec, Jelena
dc.creatorJović, Vesna
dc.creatorPopović, Bogdan
dc.creatorVorkapić, Miloš
dc.creatorRadojević, Vesna
dc.date.accessioned2021-03-10T13:17:17Z
dc.date.available2021-03-10T13:17:17Z
dc.date.issued2017
dc.identifier.urihttp://TechnoRep.tmf.bg.ac.rs/handle/123456789/3485
dc.description.abstractMicrohardness test is the most commonly used method for assessing the mechanical properties of thin films.This testing method uses controlled contact at a single point of an indenter and chosen material which induces the plastic deformation in material under indenter. The measured hardness is considered as the composite hardness, because the substrate participates in the plastic deformation caused by indentation. This research has been carried out in order to analyze and compare the hardness response of different composite systems consist of monolayer electrodeposited copper thin film on brass and steel alloys as the substrates. The influence of the electrodeposition parameters and of the substrate on the hardness and interlayer adhesion were investigated by Vickers microhardness testing for different load.en
dc.publisherBelgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering
dc.relationinfo:eu-repo/grantAgreement/MESTD/Technological Development (TD or TR)/32008/RS//
dc.relationinfo:eu-repo/grantAgreement/MESTD/Technological Development (TD or TR)/34011/RS//
dc.relationinfo:eu-repo/grantAgreement/MESTD/Integrated and Interdisciplinary Research (IIR or III)/45019/RS//
dc.rightsopenAccess
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/
dc.sourceProceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, Ic
dc.subjectmicrohardnesssr
dc.subjectcomposite systemsr
dc.subjectthin filmsr
dc.subjectadhesionsr
dc.subjectelectrodepositionsr
dc.titleHardness response and adhesion of thin copper films on alloy substratesen
dc.typeconferenceObject
dc.rights.licenseBY
dc.citation.epageMOI1.3.6
dc.citation.other: MOI1.3.1-MOI1.3.6
dc.citation.spageMOI1.3.1
dc.identifier.fulltexthttp://TechnoRep.tmf.bg.ac.rs/bitstream/id/1378/3482.pdf
dc.identifier.rcubcer-3947
dc.type.versionpublishedVersion


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