Characterization of nickel thin multilayer films electrodeposited under different agitation conditions

Abstract

Alternate electrodeposition of ordinary and ultrasonic-assisted Ni layers on polycrystalline copper substrates and single-crystal (100)-oriented silicon wafers was used for the formation of composite systems with nickel thin multilayer films. The hardness and adhesion properties of these composite systems were characterized using Vickers microhardness test, with different loads. Dependence of composite microhardness and film adhesion on type of substrate and layer thickness was investigated. Model of Korsunsky, Chicot-Lesage and Chen-Gao were chosen and applied to experimental data for obtaining the film hardness and adhesion evaluation, respectively. It is confirmed that in comparison with the conventional electrodeposited Ni films, the mechanical properties of the ultrasonic-assisted multilayer Ni films are improved. The microhardness and adhesion of the films are enhanced by introduction of ultrasound and by reducing the layer thickness in the film.