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dc.creatorStević, Zoran
dc.creatorVlahović, Milica
dc.creatorMartinović, Sanja
dc.creatorDimitrijević, Stevan
dc.creatorPonomaryova, Elena
dc.creatorVolkov-Husović, Tatjana
dc.date.accessioned2021-03-10T13:47:21Z
dc.date.available2021-03-10T13:47:21Z
dc.date.issued2018
dc.identifier.issn1862-5282
dc.identifier.urihttp://TechnoRep.tmf.bg.ac.rs/handle/123456789/3947
dc.description.abstractPulse-reverse power modes are used in galvanotechniques in order to obtain coatings with better characteristics in terms of gloss, adhesion, tracking sharp edges and uniform distribution of deposits on complex shape objects, compared with the coatings produced by constant current modes. Pulse-reverse modes also allow the use of a higher current density, and thus the production speed of electroplating cells increases. Systems for standard electroplating of copper, silver and gold are optimised by the suitable choice of duration and intensity of the pulses. It is shown that coatings with satisfactory quality can be deposited using higher current density, different modes of pulsed current in a very short period of time, without expensive and often dangerous additives in the electrolyte. Parameters of the model for certain electrochemical systems were determined by modelling and computer simulation, so the system behaviour under different circumstances becomes predictive.en
dc.publisherCarl Hanser Verlag
dc.relationinfo:eu-repo/grantAgreement/MESTD/Technological Development (TD or TR)/33007/RS//
dc.relationinfo:eu-repo/grantAgreement/MESTD/Basic Research (BR or ON)/172060/RS//
dc.rightsrestrictedAccess
dc.sourceInternational Journal of Materials Research
dc.subjectElectrochemical depositionen
dc.subjectPulse currenten
dc.subjectPulse-reverse currenten
dc.subjectModellingen
dc.subjectPlating qualityen
dc.titleModelling, simulation and optimisation of pulse-reverse regime of copper, silver and gold electrodepositionen
dc.typearticle
dc.rights.licenseARR
dc.citation.epage521
dc.citation.issue6
dc.citation.other109(6): 514-521
dc.citation.rankM23
dc.citation.spage514
dc.citation.volume109
dc.identifier.doi10.3139/146.111636
dc.identifier.scopus2-s2.0-85048538359
dc.identifier.wos000452545400005
dc.type.versionpublishedVersion


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