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dc.creatorMrdak, Mihailo
dc.creatorBajic, Darko
dc.creatorVeljić, Darko
dc.creatorRakin, Marko
dc.date.accessioned2022-03-04T11:15:42Z
dc.date.available2022-03-04T11:15:42Z
dc.date.issued2021
dc.identifier.issn1580-2949
dc.identifier.urihttp://TechnoRep.tmf.bg.ac.rs/handle/123456789/4780
dc.description.abstractIn this paper we will describe the process of the deposition of thick layers of VPS-Ti coating, which is used as a bonding layer for the upper porous Ti coatings on implant substrates. In order to deposit the powder, we used HoGANaS Ti powder labelled as AMPERIT 154.086-63 mu m. In order to test the mechanical properties and microstructure of the VPS-Ti coating, the powder was deposited on C 4171 (X15Cr13 EN10027) steel substrates. Mechanical tests of the microhardness of the coating were per-formed by the Vickers hardness test method (HV0.3) and tensile strength by measuring the force per unit area (MPa). The micro-hardness of the coating is 159 HV0.3, which is consistent with the microstructure. The coating was found to have a good bond strength of 68 MPa. The morphology of the powder particles was examined on a scanning electron microscope. The microstructure of the coating, both when deposited and etched, was examined with an optical microscope and a scanning elec-tron microscope. By etching the coating layers, it was found that the structure is homogeneous and that it consists of a mixture of low-temperature and high-temperature titanium phases (alpha-Ti + beta-Ti). Our tests have shown that the deposited layers of Ti coating can be used as a bonding layer for porous Ti coatings in the production of implants.en
dc.relationinfo:eu-repo/grantAgreement/MESTD/inst-2020/200287/RS//
dc.rightsrestrictedAccess
dc.sourceMateriali in Tehnologije
dc.subjectvacuum plasma spray processen
dc.subjecttitaniumen
dc.subjectmicrostructureen
dc.subjectmicrohardnessen
dc.subjectbond tensile strengthen
dc.titleCharacterisation of biomedical titanium layers deposited by a vacuum plasma spray processen
dc.typearticle
dc.rights.licensePublisher's own license
dc.citation.epage236
dc.citation.issue2
dc.citation.other55(2): 231-236
dc.citation.rankM23
dc.citation.spage231
dc.citation.volume55
dc.identifier.doi10.17222/mit.2020.135
dc.identifier.scopus2-s2.0-85105811740
dc.identifier.wos000737311900009
dc.type.versionpublishedVersion


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