The diffusion phenomena occurring at the boundary between Si3N4 and active Cu based filler metal during Si3Nn/metal joining are discussed as a part of the general theory of reaction layer growth. The mechanism of reaction layer formation is explained in the light of wettability, heterogeneous chemical reactions and diffusion in the presence of a moving interface. Observed processes involve diffusion steps in conjunction with chemical reactions at solid/liquid boundary. Illustrative calculation results based on the proposed procedure are presented.
TY - JOUR
AU - Raić, Karlo T.
PY - 2000
UR - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/5333
AB - The diffusion phenomena occurring at the boundary between Si3N4 and active Cu based filler metal during Si3Nn/metal joining are discussed as a part of the general theory of reaction layer growth. The mechanism of reaction layer formation is explained in the light of wettability, heterogeneous chemical reactions and diffusion in the presence of a moving interface. Observed processes involve diffusion steps in conjunction with chemical reactions at solid/liquid boundary. Illustrative calculation results based on the proposed procedure are presented.
PB - Elsevier Science Ltd
T2 - Ceramics International
T1 - Estimate of Si3N4 diffusion into Cu based filler metal
EP - 24
IS - 1
SP - 19
VL - 26
DO - 10.1016/S0272-8842(99)00013-9
ER -
@article{
author = "Raić, Karlo T.",
year = "2000",
abstract = "The diffusion phenomena occurring at the boundary between Si3N4 and active Cu based filler metal during Si3Nn/metal joining are discussed as a part of the general theory of reaction layer growth. The mechanism of reaction layer formation is explained in the light of wettability, heterogeneous chemical reactions and diffusion in the presence of a moving interface. Observed processes involve diffusion steps in conjunction with chemical reactions at solid/liquid boundary. Illustrative calculation results based on the proposed procedure are presented.",
publisher = "Elsevier Science Ltd",
journal = "Ceramics International",
title = "Estimate of Si3N4 diffusion into Cu based filler metal",
pages = "24-19",
number = "1",
volume = "26",
doi = "10.1016/S0272-8842(99)00013-9"
}
Raić, K. T.. (2000). Estimate of Si3N4 diffusion into Cu based filler metal. in Ceramics International
Elsevier Science Ltd., 26(1), 19-24.
https://doi.org/10.1016/S0272-8842(99)00013-9
Raić KT. Estimate of Si3N4 diffusion into Cu based filler metal. in Ceramics International. 2000;26(1):19-24.
doi:10.1016/S0272-8842(99)00013-9 .
Raić, Karlo T., "Estimate of Si3N4 diffusion into Cu based filler metal" in Ceramics International, 26, no. 1 (2000):19-24,
https://doi.org/10.1016/S0272-8842(99)00013-9 . .
