Estimate of Si3N4 diffusion into Cu based filler metal

dc.creator	Raić, Karlo T.
dc.date.accessioned	2023-01-13T07:07:06Z
dc.date.available	2023-01-13T07:07:06Z
dc.date.issued	2000
dc.identifier.issn	0272-8842
dc.identifier.uri	http://TechnoRep.tmf.bg.ac.rs/handle/123456789/5333
dc.description.abstract	The diffusion phenomena occurring at the boundary between Si3N4 and active Cu based filler metal during Si3Nn/metal joining are discussed as a part of the general theory of reaction layer growth. The mechanism of reaction layer formation is explained in the light of wettability, heterogeneous chemical reactions and diffusion in the presence of a moving interface. Observed processes involve diffusion steps in conjunction with chemical reactions at solid/liquid boundary. Illustrative calculation results based on the proposed procedure are presented.	sr
dc.language.iso	en	sr
dc.publisher	Elsevier Science Ltd	sr
dc.rights	restrictedAccess	sr
dc.source	Ceramics International	sr
dc.title	Estimate of Si3N4 diffusion into Cu based filler metal	sr
dc.type	article	sr
dc.rights.license	ARR	sr
dc.citation.epage	24
dc.citation.issue	1
dc.citation.rank	M22
dc.citation.spage	19
dc.citation.volume	26
dc.identifier.doi	10.1016/S0272-8842(99)00013-9
dc.identifier.scopus	2-s2.0-0034459539
dc.type.version	publishedVersion	sr