Phenomenology of a formation of a honeycomb-like structure during copper electrodeposition
Само за регистроване кориснике
2007
Чланак у часопису (Објављена верзија)
Метаподаци
Приказ свих података о документуАпстракт
In this paper, the phenomenology of a formation of a honeycomb-like structure was considered. Copper deposits obtained at overpotential of 1000 mV were examined by scanning electron microscopy (SEM) technique. It was shown that two groups of craters or holes were formed by the electrodeposition at this overpotential. The origin of one group is associated with hydrogen evolution and the attachment of hydrogen bubbles at the surface area of an electrode. For the origin of the other group, a current distribution at the growing surface was very important. The effect of preparing a working electrode onto the formation of a honeycomb-like structure is also considered.
Кључне речи:
Copper / Crater or hole / Electroplating / Hydrogen evolution / Scanning electron microscopy (SEM)Извор:
Journal of Solid State Electrochemistry, 2007, 11, 5, 667-675Финансирање / пројекти:
- Таложење ултрафиних прахова метала и легура и наноструктурираних површина електрохемијским поступцима (RS-MESTD-MPN2006-2010-142032)
DOI: 10.1007/s10008-006-0222-z
ISSN: 1432-8488
WoS: 000244199400013
Scopus: 2-s2.0-33847248524
Институција/група
Tehnološko-metalurški fakultetTY - JOUR AU - Nikolić, Nebojša D. AU - Popov, Konstantin I. AU - Pavlović, Lj.J. AU - Pavlović, Miomir PY - 2007 UR - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/5494 AB - In this paper, the phenomenology of a formation of a honeycomb-like structure was considered. Copper deposits obtained at overpotential of 1000 mV were examined by scanning electron microscopy (SEM) technique. It was shown that two groups of craters or holes were formed by the electrodeposition at this overpotential. The origin of one group is associated with hydrogen evolution and the attachment of hydrogen bubbles at the surface area of an electrode. For the origin of the other group, a current distribution at the growing surface was very important. The effect of preparing a working electrode onto the formation of a honeycomb-like structure is also considered. T2 - Journal of Solid State Electrochemistry T1 - Phenomenology of a formation of a honeycomb-like structure during copper electrodeposition EP - 675 IS - 5 SP - 667 VL - 11 DO - 10.1007/s10008-006-0222-z ER -
@article{ author = "Nikolić, Nebojša D. and Popov, Konstantin I. and Pavlović, Lj.J. and Pavlović, Miomir", year = "2007", abstract = "In this paper, the phenomenology of a formation of a honeycomb-like structure was considered. Copper deposits obtained at overpotential of 1000 mV were examined by scanning electron microscopy (SEM) technique. It was shown that two groups of craters or holes were formed by the electrodeposition at this overpotential. The origin of one group is associated with hydrogen evolution and the attachment of hydrogen bubbles at the surface area of an electrode. For the origin of the other group, a current distribution at the growing surface was very important. The effect of preparing a working electrode onto the formation of a honeycomb-like structure is also considered.", journal = "Journal of Solid State Electrochemistry", title = "Phenomenology of a formation of a honeycomb-like structure during copper electrodeposition", pages = "675-667", number = "5", volume = "11", doi = "10.1007/s10008-006-0222-z" }
Nikolić, N. D., Popov, K. I., Pavlović, Lj.J.,& Pavlović, M.. (2007). Phenomenology of a formation of a honeycomb-like structure during copper electrodeposition. in Journal of Solid State Electrochemistry, 11(5), 667-675. https://doi.org/10.1007/s10008-006-0222-z
Nikolić ND, Popov KI, Pavlović L, Pavlović M. Phenomenology of a formation of a honeycomb-like structure during copper electrodeposition. in Journal of Solid State Electrochemistry. 2007;11(5):667-675. doi:10.1007/s10008-006-0222-z .
Nikolić, Nebojša D., Popov, Konstantin I., Pavlović, Lj.J., Pavlović, Miomir, "Phenomenology of a formation of a honeycomb-like structure during copper electrodeposition" in Journal of Solid State Electrochemistry, 11, no. 5 (2007):667-675, https://doi.org/10.1007/s10008-006-0222-z . .