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Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films
(Belgrade : Military Technical Institute, 2012)
Thin Ni and Cu films with fine-grained structures have been electrodeposited from self-made sulphamate-based and sulphate-based electrolytes, respectively. DC electrodeposition of Ni films was performed on single crystal ...
Hardness response and adhesion of thin copper films on alloy substrates
(Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering, 2017)
Microhardness test is the most commonly used method for assessing the mechanical properties of thin films.This testing method uses controlled contact at a single point of an indenter and chosen material which induces the ...
Response Surface Methodology and Artificial Neural Network-Based Models for Predicting Roughness of Cu coatings
(Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear angineering, 2020)
Copper coatings are produced on silicon wafer by electrodeposition (ED) in pulsating current (PC) regime. Electrodeposition was performed at various current density amplitudes in the range of 80−140 mA cm-2, frequency in ...