The estimation of solid copper surface tension in copper sulfate solutions
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2002
Članak u časopisu (Objavljena verzija)
Metapodaci
Prikaz svih podataka o dokumentuApstrakt
In metal electrodeposition in the limiting diffusion current density range, the deposition current density remains constant regardless of the deposition overpotential used, At the same time, die larger the deposition overpotential is the more disperse is the formed deposit, which is characterised by an increase specific surface. The difference in die specific surface of disperse deposits obtained at two different overpotentials; in the limiting diffusion current density range is correlated with the difference between the deposition overpotentials. A method for the estimation of the surface tension of solid copper in copper sulfate solutions is also proposed.
Ključne reči:
interfacial energy copper-copper sulfate solution / specific surface of copper powderIzvor:
Journal of the Serbian Chemical Society, 2002, 67, 11, 769-775
DOI: 10.2298/JSC0211769P
ISSN: 0352-5139
WoS: 000179956900008
Scopus: 2-s2.0-0036983056
Institucija/grupa
Tehnološko-metalurški fakultetTY - JOUR AU - Popov, K.I. AU - Nikolic, N.D. AU - Rakočević, Zlatko Lj. PY - 2002 UR - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/5373 AB - In metal electrodeposition in the limiting diffusion current density range, the deposition current density remains constant regardless of the deposition overpotential used, At the same time, die larger the deposition overpotential is the more disperse is the formed deposit, which is characterised by an increase specific surface. The difference in die specific surface of disperse deposits obtained at two different overpotentials; in the limiting diffusion current density range is correlated with the difference between the deposition overpotentials. A method for the estimation of the surface tension of solid copper in copper sulfate solutions is also proposed. T2 - Journal of the Serbian Chemical Society T1 - The estimation of solid copper surface tension in copper sulfate solutions EP - 775 IS - 11 SP - 769 VL - 67 DO - 10.2298/JSC0211769P ER -
@article{ author = "Popov, K.I. and Nikolic, N.D. and Rakočević, Zlatko Lj.", year = "2002", abstract = "In metal electrodeposition in the limiting diffusion current density range, the deposition current density remains constant regardless of the deposition overpotential used, At the same time, die larger the deposition overpotential is the more disperse is the formed deposit, which is characterised by an increase specific surface. The difference in die specific surface of disperse deposits obtained at two different overpotentials; in the limiting diffusion current density range is correlated with the difference between the deposition overpotentials. A method for the estimation of the surface tension of solid copper in copper sulfate solutions is also proposed.", journal = "Journal of the Serbian Chemical Society", title = "The estimation of solid copper surface tension in copper sulfate solutions", pages = "775-769", number = "11", volume = "67", doi = "10.2298/JSC0211769P" }
Popov, K.I., Nikolic, N.D.,& Rakočević, Z. Lj.. (2002). The estimation of solid copper surface tension in copper sulfate solutions. in Journal of the Serbian Chemical Society, 67(11), 769-775. https://doi.org/10.2298/JSC0211769P
Popov K, Nikolic N, Rakočević ZL. The estimation of solid copper surface tension in copper sulfate solutions. in Journal of the Serbian Chemical Society. 2002;67(11):769-775. doi:10.2298/JSC0211769P .
Popov, K.I., Nikolic, N.D., Rakočević, Zlatko Lj., "The estimation of solid copper surface tension in copper sulfate solutions" in Journal of the Serbian Chemical Society, 67, no. 11 (2002):769-775, https://doi.org/10.2298/JSC0211769P . .
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