Parallel glide: Flow of dislocations with internal stress source/sink distribution

dc.creator	Raić, Karlo T.
dc.date.accessioned	2023-01-20T11:00:41Z
dc.date.available	2023-01-20T11:00:41Z
dc.date.issued	2008
dc.identifier.issn	1468-6996
dc.identifier.uri	http://TechnoRep.tmf.bg.ac.rs/handle/123456789/5574
dc.description.abstract	The unexpected glide of dislocations on a plane parallel to the film/substrate interface in ultrathin copper films, which has been called parallel glide (Balk et al 2003 Acta Metall. 51 447), is described using an analytical model. The phenomenon is observed as a problem involving inlet/outlet flow from different positions of a grain boundary into the grain channel. In this sense, parallel glide is presented as the flow of dislocations with an internal stress source/sink distribution.	sr
dc.language.iso	en	sr
dc.publisher	Taylor & Francis Group	sr
dc.rights	openAccess	sr
dc.rights.uri	https://creativecommons.org/licenses/by-nc-nd/4.0/
dc.source	Science and Technology of Advanced Materials	sr
dc.subject	Dislocations	sr
dc.subject	Dynamics	sr
dc.subject	Metallic material	sr
dc.subject	Ultrathin films	sr
dc.title	Parallel glide: Flow of dislocations with internal stress source/sink distribution	sr
dc.type	article	sr
dc.rights.license	BY-NC-ND	sr
dc.citation.issue	1
dc.citation.rank	M22
dc.citation.spage	015008
dc.citation.volume	9
dc.identifier.doi	10.1088/1468-6996/9/1/015008
dc.identifier.fulltext	http://TechnoRep.tmf.bg.ac.rs/bitstream/id/14648/Parallel_glide_pub_2008.pdf
dc.identifier.scopus	2-s2.0-49049117345
dc.identifier.wos	000257128300029
dc.type.version	publishedVersion	sr