Microstructure-property relations for porous bismuth films
Authorized Users Only
1999
Authors
Shen, WeiningDunn, Bruce
Ragot, F.
Goorsky, Mark
Moore, Caroline
Song, David W.
Chen, Gang
Gronsky, Ronald
Radetić, Tamara
Fuller-Mora, Wendy
Ehrlich, Alexander
Conference object (Published version)
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Show full item recordAbstract
Metallorganic decomposition of metal carboxylates is used to prepare porous thin films of bismuth. The general approach is to spin coat a precursor solution, bismuth 2-ethylhexanoate in a solvent of 2-methyl-1-propanol on the substrate of interest and then pyrolyze the resulting film under conditions which evolve the organic ligands but do not melt the bismuth. The controlled release of ligands creates the nanoporous morphology which is then preserved in the final film. Subsequent plasma etching and heat treatments are used to produce films of variable porosity. The film microstructure consists of nanoporous channels separating grains of bismuth. For films in the range of 30% porosity, thermal conductivity values are on the order of 0.35 W/mK. The interrelationships among processing conditions, microstructure and thermal conductivity are discussed.
Keywords:
Coating techniques / Crystal microstructure / Heat treatment / Methanol / Morphology / Nanostructured materials / Organic solvents / Plasma etching / Porosity / Semiconducting bismuth compounds / Thermal conductivity of solids / Thin films / Ligands / Methyl propanol / Nanoporosity / Spin coating / Semiconducting filmsSource:
International Conference on Thermoelectrics, ICT, Proceedings, 1999, 562-564Publisher:
- IEEE
Funding / projects:
- DOD/ONR MURI program on thermoelectrics (N00014-97-1-0516)
Note:
- 18th International Conference on Thermoelectrics (ICT'99), 29 August 1999 through 2 September 1999
DOI: 10.1109/ict.1999.843452
ISBN: 0-7803-5451-6
ISSN: 1094-2734
Scopus: 2-s2.0-0033299888
Institution/Community
Tehnološko-metalurški fakultetTY - CONF AU - Shen, Weining AU - Dunn, Bruce AU - Ragot, F. AU - Goorsky, Mark AU - Moore, Caroline AU - Song, David W. AU - Chen, Gang AU - Gronsky, Ronald AU - Radetić, Tamara AU - Fuller-Mora, Wendy AU - Ehrlich, Alexander PY - 1999 UR - http://TechnoRep.tmf.bg.ac.rs/handle/123456789/7268 AB - Metallorganic decomposition of metal carboxylates is used to prepare porous thin films of bismuth. The general approach is to spin coat a precursor solution, bismuth 2-ethylhexanoate in a solvent of 2-methyl-1-propanol on the substrate of interest and then pyrolyze the resulting film under conditions which evolve the organic ligands but do not melt the bismuth. The controlled release of ligands creates the nanoporous morphology which is then preserved in the final film. Subsequent plasma etching and heat treatments are used to produce films of variable porosity. The film microstructure consists of nanoporous channels separating grains of bismuth. For films in the range of 30% porosity, thermal conductivity values are on the order of 0.35 W/mK. The interrelationships among processing conditions, microstructure and thermal conductivity are discussed. PB - IEEE C3 - International Conference on Thermoelectrics, ICT, Proceedings T1 - Microstructure-property relations for porous bismuth films EP - 564 SP - 562 DO - 10.1109/ict.1999.843452 ER -
@conference{ author = "Shen, Weining and Dunn, Bruce and Ragot, F. and Goorsky, Mark and Moore, Caroline and Song, David W. and Chen, Gang and Gronsky, Ronald and Radetić, Tamara and Fuller-Mora, Wendy and Ehrlich, Alexander", year = "1999", abstract = "Metallorganic decomposition of metal carboxylates is used to prepare porous thin films of bismuth. The general approach is to spin coat a precursor solution, bismuth 2-ethylhexanoate in a solvent of 2-methyl-1-propanol on the substrate of interest and then pyrolyze the resulting film under conditions which evolve the organic ligands but do not melt the bismuth. The controlled release of ligands creates the nanoporous morphology which is then preserved in the final film. Subsequent plasma etching and heat treatments are used to produce films of variable porosity. The film microstructure consists of nanoporous channels separating grains of bismuth. For films in the range of 30% porosity, thermal conductivity values are on the order of 0.35 W/mK. The interrelationships among processing conditions, microstructure and thermal conductivity are discussed.", publisher = "IEEE", journal = "International Conference on Thermoelectrics, ICT, Proceedings", title = "Microstructure-property relations for porous bismuth films", pages = "564-562", doi = "10.1109/ict.1999.843452" }
Shen, W., Dunn, B., Ragot, F., Goorsky, M., Moore, C., Song, D. W., Chen, G., Gronsky, R., Radetić, T., Fuller-Mora, W.,& Ehrlich, A.. (1999). Microstructure-property relations for porous bismuth films. in International Conference on Thermoelectrics, ICT, Proceedings IEEE., 562-564. https://doi.org/10.1109/ict.1999.843452
Shen W, Dunn B, Ragot F, Goorsky M, Moore C, Song DW, Chen G, Gronsky R, Radetić T, Fuller-Mora W, Ehrlich A. Microstructure-property relations for porous bismuth films. in International Conference on Thermoelectrics, ICT, Proceedings. 1999;:562-564. doi:10.1109/ict.1999.843452 .
Shen, Weining, Dunn, Bruce, Ragot, F., Goorsky, Mark, Moore, Caroline, Song, David W., Chen, Gang, Gronsky, Ronald, Radetić, Tamara, Fuller-Mora, Wendy, Ehrlich, Alexander, "Microstructure-property relations for porous bismuth films" in International Conference on Thermoelectrics, ICT, Proceedings (1999):562-564, https://doi.org/10.1109/ict.1999.843452 . .